Patents by Inventor Wei-Chin Chen

Wei-Chin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250119813
    Abstract: A transmission channel switching method is provided. The transmission channel switching method may include the following steps. An apparatus may establish a plurality of transmission channels. The apparatus may transmit data through a default transmission channel of the transmission channels, wherein the default transmission channel corresponds to the lowest power consumption. The apparatus may determine whether to switch to another transmission channel of the transmission channels according to channel quality of each transmission channel and power consumption corresponds to each transmission channel.
    Type: Application
    Filed: September 23, 2024
    Publication date: April 10, 2025
    Inventors: Wei-Shuo CHEN, Kun-Lin WU, Pang-Hsin SHIH, Yuan-Chin WEN, Te-Hsin LIN, Cheng-Che CHEN
  • Publication number: 20250084869
    Abstract: An axial-flow heat-dissipation fan including a frame and a blade wheel is provided. The frame has an inlet, an outlet, and an inner wall connected between the inlet and the outlet. The inner wall surrounding the blade wheel has at least one rough region. The blade wheel is rotatably disposed in the frame and located between the inlet and the outlet, and an air flows into the frame via the inlet and flows out of the frame via the outlet by rotation of the blade wheel. A gap exists between a blade end of the blade wheel and the inner wall. A laminar flow is generated at the gap when the blade wheel is rotating and the blade end passes through the rough region so as to prevent a backflow generated at the gap, wherein a flowing direction of the backflow is opposite to a flowing direction of the air flow.
    Type: Application
    Filed: September 11, 2024
    Publication date: March 13, 2025
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Mao-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen, Tsung-Ting Chen
  • Patent number: 12234396
    Abstract: An optical adhesive film structure having an alignment function is provided. The optical adhesive film structure includes an optical adhesive layer and a release film. The release film is disposed on the optical adhesive layer. A first film surface of the release film facing away from the optical adhesive layer has a plurality of marks. The marks are recessed into the release film relative to the first film surface and do not run through the release film. A stitching display module and a manufacturing method of the stitching display module are also provided.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: February 25, 2025
    Assignee: AUO CORPORATION
    Inventors: Yi-Hsin Lin, Wen-Lung Chen, Yu-Chin Wu, Wei-Lung Liau
  • Publication number: 20250054798
    Abstract: Disclosed are a bonding system and a bonding method. In one embodiment, the bonding system includes a chamber, first and second electrostatic chucks, a visible light sensor module and a nonvisible light module. The chamber is configured to provide a vacuum state. The first electrostatic chuck is configured to hold a first substrate having a first alignment mark in the chamber, wherein the first electrostatic chuck has a first window. The second electrostatic chuck is configured to hold a second substrate having a second alignment mark in the chamber, wherein the second electrostatic chuck has a second window. The visible light sensor module is configured to capture images of the first and the second alignment marks. The nonvisible light module is configured to capture a combined image of the first and second alignment marks via the first and second windows overlapping each other in the vacuum state.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Ling Hwang, Chung-Jung Wu, Tung Li Wu, Wei-Chih Chen, Hsu-Chin Tseng, Jeng-Nan Hung
  • Patent number: 12219731
    Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: February 4, 2025
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
  • Publication number: 20250027502
    Abstract: An axial-flow heat dissipation fan including a frame, a hub, and a plurality of blades is provided. The frame has an air inlet and an air outlet. The hub is rotatably arranged in the frame. The blades disposed at side of the hub respectively and rotate along with the hub. Each of the blades has a front surface facing toward the air inlet and a rear surface facing toward the air outlet. A surface roughness of the front surface is different from a surface roughness of the rear surface.
    Type: Application
    Filed: July 8, 2024
    Publication date: January 23, 2025
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Mao-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen, Tsung-Ting Chen
  • Patent number: 12140159
    Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.
    Type: Grant
    Filed: January 9, 2024
    Date of Patent: November 12, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Patent number: 12104603
    Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: October 1, 2024
    Assignee: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen, Tsung-Ting Chen
  • Publication number: 20240317353
    Abstract: A single shock suspension fork for bicycles is provided. The single shock suspension fork includes a fork crown, a shock absorber, a fork brace and two lower fork tubes. The two lower fork tubes are fixed and connected with two ends of the fork brace and a top end of each of the lower fork tubes projecting from the fork brace is inserted into a hole on each of two ends of the fork crown. A middle part of the fork brace is connected with a first end of the shock absorber while a second end of the shock absorber is inserted and connected with a steerer tube at a central part of the fork crown. Thereby the single shock suspension fork has simple structure, labor-and-time saving assembly, and convenient maintenance. Thereby shortcomings of conventional dual shock absorbers such as high manufacturing cost and time-consuming assembly can be overcome.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 26, 2024
    Inventor: WEI-CHIN CHEN
  • Publication number: 20240243114
    Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Mao-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Kuan-Lin Chen, Chun-Chieh Wang
  • Publication number: 20240237268
    Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
    Type: Application
    Filed: October 13, 2023
    Publication date: July 11, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
  • Patent number: 12035503
    Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 9, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20240207920
    Abstract: The present invention relates to a forming and manufacturing method of a bicycle shock-absorbing front fork crown. It mainly includes a stamping step that processes and forms an aluminum ingot base material into a crown prototype, wherein the crown prototype includes two shoulders and a solid convex seat, a deep drawing forming step that the solid convex seat is extended and processed to form a front fork tube, an appearance processing step that the front fork crown is formed through processing and forming the two side shoulders and the front fork tube surface, and finally, a drilling process is carried out on the two side shoulders. In this way, the front fork crown with the front fork tube can be formed integrally with an aluminum ingot through a series of processing processes, so that the front fork crown can provide a high-strength anti-vibration function.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 27, 2024
    Inventor: WEI-CHIN CHEN
  • Publication number: 20240141922
    Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20240138098
    Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
  • Patent number: 11968800
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
  • Patent number: 11913472
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20240055417
    Abstract: Provided is an electronic package structure, including a substrate, a first electronic component disposed on the substrate, at least one second electronic component disposed on the substrate, an insulating film disposed on the second electronic component and the substrate, an insulating glue filled onto the second electronic component and the substrate to cover at least part of the insulating film, a liquid metal disposed on the first electronic component, and a heat-dissipating plate disposed on the first electronic component to squeeze the liquid metal. The insulating film and the insulating glue prevent the overflowing liquid metal from contacting the second electronic component and the substrate.
    Type: Application
    Filed: August 10, 2023
    Publication date: February 15, 2024
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen
  • Patent number: 11865670
    Abstract: The present invention discloses a device for removal of wheel rim burr which comprises a main body, plural positioning wheels, an eccentric wheel disposed on the main body, and at least two brush wheels disposed between two corresponding positioning wheels.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: January 9, 2024
    Assignee: Alex Global Technology, Inc.
    Inventor: Wei-Chin Chen
  • Publication number: 20230349386
    Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.
    Type: Application
    Filed: April 25, 2023
    Publication date: November 2, 2023
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen, Tsung-Ting Chen