Abstract: A folding lens system includes: a polarization-dependence device, a first optical device, a first polarization controller, a second optical device and a second polarization controller. The polarization-dependence device has a first surface and a second surface opposite to the first surface. The first optical device is located at a side facing toward the first surface of the polarization-dependence device. The first polarization controller is located between the polarization-dependence device and the first optical device. The first polarization controller has the same curvature as the first surface of the polarization-dependence device. The second optical device is located at a side facing toward the second surface of the polarization-dependence device. The second polarization controller is located between the polarization-dependence device and the second optical device. The second polarization controller has the same curvature as the second surface of the polarization-dependence device.

Abstract: A method of forming an integrated circuit, including forming a n-type doped well (N-well) and a p-type doped well (P-well) disposed side by side on a semiconductor substrate, forming a first fin active region extruded from the N-well and a second fin active region extruded from the P-well, forming a first isolation feature inserted between and vertically extending through the N-well and the P-well, and forming a second isolation feature over the N-well and the P-well and laterally contacting the first and the second fin active regions.

Abstract: An antioxidant conductive thermal paste and a method of manufacturing the same are provided. The antioxidant conductive thermal paste includes a reactive monomer, a thermosetting resin, a polymerization inhibitor, an electrically conductive filler, and a thixotropic agent. The method consists of the steps of mixing a reactive monomer, a thermosetting resin, and a polymerization inhibitor evenly to get a first polymer mixture, and adding an electrically conductive filler and a thixotropic agent into the first polymer mixture in turn and blending the mixture evenly to obtain an antioxidant conductive thermal paste with good adherence, high electrical conductivity, high thermal conductivity, improved thermal-mechanical fatigue resistance or mechanical fatigue resistance.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: An assistive device structure for positioning and pressure relief is provided, including a first elastic layer and a second elastic layer, which are attached by using a high-frequency encapsulation process, sealing, bagging, thermoforming, or an integrally molding process. Each of the first and second elastic layers has a bottom surface and an arc surface disposed opposite to each other. The arc surface includes two protrusions and a recess formed there in between. The two protrusions have different heights. A hollow area is disposed in the recess of the first and second elastic layers. Based on such structure, the bottom surfaces of the first and second elastic layers are attached to form the proposed assistive device structure for a user to lean against and providing multiple positioning effects and pressure relief. More than four axial directions of supporting forces are generated to effectively enhance muscle relaxation and stress relief.

Abstract: A simulated shaking bullet chain type toy gun equipped with a bullet chain is provided. The toy gun includes a gun body, an actuated member, and a bolt assembly and a reciprocating assembly both reciprocatingly disposed in the gun body. The reciprocating assembly is linked to the bolt assembly and has a trigger portion reciprocating with the reciprocating assembly to produce a moving path. The actuated member is installed in the gun body and located on the moving path, and connected to the bullet chain. The reciprocating assembly reciprocates to trigger the actuated member by the trigger portion, and the actuated member links the bullet chain to shake, so as to achieve a high degree of simulation of the shaking effect of the bullet chain.

Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.

Abstract: A method of forming a semiconductor device includes forming a first conductive feature on a bottom surface of an opening through a dielectric layer. The forming the first conductive feature leaves seeds on sidewalls of the opening. A treatment process is performed on the seeds to form treated seeds. The treated seeds are removed with a cleaning process. The cleaning process may include a rinse with deionized water. A second conductive feature is formed to fill the opening.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A first driver circuit is configured to cooperate with a second driver circuit to control a display panel, wherein the first driver circuit is configured to output display data to a first area of the display panel and the second driver circuit is configured to output display data to a second area of the display panel. A method used for the first driver circuit includes outputting at least one emission control signal to control the second area of the display panel when the second driver circuit is disabled.

Abstract: A memory device includes a substrate, a first transistor and a second transistor, a first word line, a second word line, and a bit line. The first transistor and the second transistor are over the substrate and are electrically connected to each other, in which each of the first and second transistors includes first semiconductor layers and second semiconductor layers, a gate structure, and source/drain structures, in which the first semiconductor layers are in contact with the second semiconductor layers, and a width of the first semiconductor layers is narrower than a width of the second semiconductor layers. The first word line is electrically connected to the gate structure of the first transistor. The second word line is electrically connected to the gate structure of the second transistor. The bit line is electrically connected to a first one of the source/drain structures of the first transistor.

Abstract: A system for remotely controlling microscopic machinery and a method thereof are provided. The system includes at least one local device and a remote host for sending a control command thereto. A microslide is placed on a microscopic camera device in the local device, and the microscopic camera device captures an image of the microslide according to a capture command in the control command. The local device transmits the image to the remote host in a video format. A motorized stage moves to a next preset position according to a movement command in the control command to capture another image of the microslide. The steps of capturing and transmitting the image and the step of moving are repeated until the microslide is captured completely. The invention can solve the problem of time delay when the image captured by the remote control microscopic camera device is displayed.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: A method for forming a semiconductor package is provided. The method includes forming a first alignment mark in a first substrate of a first wafer and forming a first bonding structure over the first substrate. The method also includes forming a second bonding structure over a second substrate of a second wafer and trimming the second substrate, so that a first width of the first substrate is greater than a second width of the second substrate. The method further includes attaching the second wafer to the first wafer via the first bonding structure and the second bonding structure, thinning the second wafer until a through-substrate via in the second substrate is exposed, and performing a photolithography process on the second wafer using the first alignment mark.

Abstract: A method and device for collision predicting and readable computer storage medium. The method for collision predicting includes: obtaining a host vehicle motion track of a host vehicle; obtaining at least one host vehicle track point on the host vehicle motion track; establishing a collision prediction area around the host vehicle track point, and matching the collision prediction area to a time point where the host vehicle is located at the host vehicle track point; obtaining a target vehicle motion track of a target vehicle; obtaining at least one target vehicle track point on the target vehicle motion track, and matching the target vehicle track point to a time point where the target vehicle is located at the target vehicle track point; and calculating a projected collision time between the host vehicle and the target vehicle when a preset condition is met.

Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.

Abstract: An analysis method and an electronic apparatus for breast image are provided. The method includes the following steps. One or more breast ultrasound images are obtained. The breast ultrasound images are used for forming a three-dimensional (3D) breast model. A volume of interest (VOI) in the breast ultrasound image is obtained by applying a detection model on the 3D breast model. The VOI is compared with a tissue segmentation result. The VOI is determined as a false positive according to a compared result between the VOI and the tissue segmentation result. The compared result includes that the VOI is located at a glandular tissue based on the tissue segmentation result. In response to the VOI being located in the glandular tissue of the tissue segmentation result, the VOI is compared with the lactiferous duct in the 3D breast model.

Abstract: An electronic device includes a substrate, a conductive structure disposed on the substrate, and a first insulating island disposed on the conductive structure. The conductive structure includes a first conductive component, a second conductive component, and a third conductive component. The third conductive component is disposed on the first conductive component and the second conductive component. The third conductive component is electrically connected to the first conductive component and the second conductive component. In a cross-sectional view of the electronic device, the width of the first insulating island is greater than the width of the third conductive component.

Abstract: An antenna device includes a first insulation layer, a defected metal layer, a second insulation layer, and a plurality of radiators. The defected metal layer is disposed on the first insulation layer, and the defected metal layer has a plurality of recess features which are arranged with uniform pitches. The second insulation layer is disposed on the first insulation layer and the defected metal layer. The radiators are disposed on the second insulation layer, and each radiator has a feeding portion and a grounding portion.