Patents by Inventor Wei Hung

Wei Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240042291
    Abstract: A golf bag includes a base, a bag body, a stand and a cover. The base has a first member and a second member. The second member is pivoted on the first member to be turned between a first position and a second position. A divider is connected to the second member to be kept a predetermined distance above the bottom and moved with the second member. The bag body is connected to the base, with an annular gap formed between the bag body and the divider. The stand has two legs, which are moved between a third position and a fourth position. The cover is received in the gap between the bag body and the divider for reciprocation between a retracted position and an elevating position. Wherein, the golf bag can be switched between a straight status and a leaning status. In the straight status, the golf bag has both the first member and the second member touch the ground. In the leaning status, the golf bag has the first member and distal ends of the legs touch the ground.
    Type: Application
    Filed: April 12, 2023
    Publication date: February 8, 2024
    Inventor: WEI HUNG LAI
  • Publication number: 20240042292
    Abstract: A golf bag includes a base, two wheels, a bag body and a stand assembly. The base has a first base member and a second base member. The first base member has a first bottom side. The second base is pivoted on the first base member to be turned between a first position and a second position. The bag body is connected to the base, and is turned between a third position and a fourth position. The stand assembly has two stands, which are turned between a fifth position and a sixth position. Wherein, the golf bag can be switched between an upright status and a self-standing status. In the upright status, the golf bag has both the first bottom side and the second bottom side touch the ground. In the self-standing status, the golf bag has the first bottom side and distal ends of the stands touch the ground.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Inventor: Wei Hung LAI
  • Publication number: 20240042290
    Abstract: A golf bag includes a bag, a hood, a guider and a lock device. The bag has a bag body and a frame, wherein the bag body is connected to the frame to hold a shape of the bag body. The hood has a lid to be opened and closed, wherein the hood is connected to a top of the bag to be moved between a first position and a second position. The lid is proximal to the bag when the hood is moved to the second position. The guider movably engages the hood with the bag to guide the hood to move between the first position and the second position. The lock device detachably connects the hood to the bag when the hood is moved to the first position to hold the hood at the first position, wherein the hood is free to move to the second position from the first position when the lock device disconnects the hood to the bag.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Inventor: Wei Hung LAI
  • Patent number: 11894332
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • Patent number: 11892884
    Abstract: A hinge structure for an electronic device including a first part and a second part is provided. The hinge structure includes a first fixing base, a second fixing base, a rotating element, and a control element. The first fixing base connects to the first part. The second fixing base connects to the second part and includes a first locking structure. The rotating element includes a second locking structure. An end of the rotating element rotatably and movably connects to the first fixing base along an axial direction. The other end of the rotating element engages with the first locking structure through the second locking structure. The control element extends to the rotating element for driving the rotating element to move along the axial direction.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 6, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Tsung-Ju Chiang, Marco Da Ros, Yung-Hsiang Chen, Li Wei Hung
  • Patent number: 11892263
    Abstract: A shaking bullet chain structure of a toy gun is provided. The toy gun has a gun body and an action. The structure includes a fixing base, a slider, a bullet chain, and a sway assembly. The fixing base is disposed beside the gun body and includes a frame and a cover. The slider is movably connected to the cover and is provided with a working trough. The bullet chain is hung on the fixing base and includes multiple bullets and a belt. One end of the sway assembly is pivoted to the frame, and another end is connected to an insert rod. The insert rod penetrates a bullet and the working trough. When the action reciprocates in the gun body, the action is configured to drives the slider to move therewith to further drive the bullet chain to shake by the working trough pushing the insert rod.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: February 6, 2024
    Assignee: VEGA FORCE INTERNATIONAL CORP.
    Inventors: Shih-Che Kung, Wei-Hung Chung
  • Patent number: 11892873
    Abstract: The disclosure provides a computer device. The computer device includes a base, a host case, and a display support. The base includes an upper surface and includes a power module therein. The host case is detachably fixed to the base and electrically connected to the power module through the upper surface. One end of the display support is connected to the base, and the other end thereof includes a display connection structure.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: February 6, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yung-Hsiang Chen, Li-Hsiang Chiu, Marco Da Ros, Li-Wei Hung
  • Publication number: 20240038752
    Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
    Type: Application
    Filed: October 5, 2023
    Publication date: February 1, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
  • Patent number: 11887955
    Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: January 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang
  • Patent number: 11872887
    Abstract: A display system and a vehicular head-up display system using the same is disclosed. The display system includes an image generating device, a polarization reflection film, a light-transmitting substrate, a curved wave plate, a curved reflector and a transparent substrate. The image generating device emits polarized light. The curved wave plate adheres to the reflective curved surface of the curved reflector through an optical adhesive. The curved wave plate and the reflective surface have the same curvatures. The reflective curved surface faces towards the polarization reflection film. When the curved reflector reflects the polarized light sequentially passing through the polarization reflection film and the curved wave plate to the polarization reflection film through the curved wave plate, the curved wave plate converts the polarization direction of the polarized light. Finally, the polarization reflection film reflects the polarized light to the transparent substrate to generate a virtual image.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: January 16, 2024
    Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., Interface Optoelectronics (WuXi) Co., Ltd., General Interface Solution Limited
    Inventors: Wei Hung Tsay, Kun Da Lu
  • Patent number: 11868295
    Abstract: A method and system for accelerating the analysis of large-scale data reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the signal reference value is converted into a collected value according to a preset signal transformation ratio and correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: January 9, 2024
    Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventors: Gan-Hao Wei, Li-Wei Hung
  • Patent number: 11871531
    Abstract: A computer device and a host module thereof are provided. The host module includes a case, a motherboard, and a power supply unit. The case includes a first side plate, a second side plate, a front panel, a rear panel, and a separation structure. The rear panel is located on an opposite side of the front panel. The first side plate, the second side plate, the front panel, and the rear panel enclose an internal space. The separation structure is located in the internal space, extends from the first side plate to the second side plate, and divides the internal space into a first part and a second part. The second part is located under the first part. The motherboard is disposed in the first part. The power supply unit is disposed in the second part, and is electrically connected to the motherboard.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: January 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yung-Hsiang Chen, Marco Da Ros, Li-Wei Hung, Li-Hsiang Chiu
  • Patent number: 11867877
    Abstract: An annular light trapping component includes an inner surface, an outer surface, an object-side surface and an image-side surface. The inner surface includes multiple L-shaped annular grooves. The annular light trapping component includes multiple stripe-shaped structures in the L-shaped annular grooves. The L-shaped annular grooves include an object-side L-shaped annular groove closest to the object-side surface and an image-side L-shaped annular groove closest to the image-side surface. A bottom diameter of the image-side L-shaped annular groove is larger than a bottom diameter of the object-side L-shaped annular groove. Each L-shaped annular groove includes a first side and a second side located between the object-side surface and the image-side surface. The stripe-shaped structures are disposed on the first side or the second side. A degree of inclination between the first side and the central axis is larger than a degree of inclination between the second side and the central axis.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: January 9, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Ming-Ta Chou, Cheng-Feng Lin, Wei-Hung Weng
  • Publication number: 20240004819
    Abstract: A method and system for accelerating analysis of large-scale data that reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the preset signal reference value is converted into a collected value according to a preset signal transformation ratio and a correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Applicant: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventors: GAN-HAO WEI, LI-WEI HUNG
  • Patent number: 11860506
    Abstract: A virtual reality display system of reduced size and depth but with a point of focus electronically changeable to suit different human eyes includes a display device and a focusing structure. The display device emits light for images, the focusing structure on the light path includes a first electrode layer, a second electrode layer, and a first liquid crystal layer between the first electrode layer and the second electrode layer, these two electrode layers receiving different voltages. The first liquid crystal layer is configured to converge the image light as necessary for the viewer and enlarge images as desired by the viewer. The image light after being focused displays a virtual reality image.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: January 2, 2024
    Assignees: Interface Technology (ChengDu) Co., Ltd., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., INTERFACE OPTOELECTRONICS (WUXI) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Po-Lun Chen, Yun-Pei Chen, Che-Wen Chiang, Wei-Hung Tsay
  • Patent number: 11863233
    Abstract: A cable distribution system that includes a head end connected to a plurality of customer devices through a transmission network that includes a remote fiber node that converts digital data to analog data suitable for the plurality of customer devices. The remote fiber node includes a processor. The remote fiber node receives a software image containing (i) a hardware image, (ii) a primary boot loader, (iii) a kernel, (iv) a software dataplane for a dataplane, and (v) software applications for a control plane. Based upon the file name of the software image selectively using at least some of (i) a hardware image, (ii) a primary boot loader, (iii) a kernel, (iv) a software dataplane for a dataplane, and (v) software applications for a control plane, in resetting the remote physical device.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: January 2, 2024
    Assignee: ARRIS Enterprises LLC
    Inventors: Anand Kumar Goenka, Vasudevan Jothilingam, Wei Hung Hui
  • Patent number: 11862670
    Abstract: A semiconductor device includes a drift region, a dielectric film, and an anti-type doping layer. The drift region has a first type conductivity. The anti-type doping layer is located between the drift region and the dielectric film, and has a second type conductivity opposite to the first type conductivity so as to change a current path of a current in the drift region, to thereby prevent the current from being influenced by the dielectric film. A method for manufacturing a semiconductor device and a method for reducing an influence of a dielectric film are also disclosed.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: January 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Fu Lin, Tsung-Hao Yeh, Chih-Wei Hung
  • Patent number: 11854964
    Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate. The semiconductor device structure includes a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate. The semiconductor device structure includes an upper conductive via between the conductive pillar and the interconnection structure. A center of the upper conductive via is laterally separated from a center of the protruding portion by a first distance. The semiconductor device structure includes a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Da Cheng, Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Po-Hao Tsai, Yung-Sheng Lin
  • Patent number: 11855058
    Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
  • Patent number: 11855652
    Abstract: A multiplexer (MUX) calibration system includes main MUX circuitry, first replica MUX circuitry, digital-to-analog (DAC) circuitry, detection circuitry, and control circuitry. The main MUX circuitry receives clock signals and outputs a first data signal based on the clock signals. The first replica MUX circuitry receives the clock signals and outputs a second data signal based on the clock signals. The DAC circuitry generates an offset voltage. The detection circuitry receives the second data signal and the offset voltage and generates a first error signal based on one or more of the second data signal and the offset voltage. The control circuitry receives the first error signal and generates a first control signal indicating an adjustment to the clock signals.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: December 26, 2023
    Assignee: XILINX, INC.
    Inventors: Hao-Wei Hung, Tan Kee Hian, Siok Wei Lim, Hongtao Zhang