Patents by Inventor Wei Lei

Wei Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240376054
    Abstract: The present disclosure provides LPA antagonists, as well as pharmaceutical compositions comprising the compounds disclosed herein. Also provided are methods for treating LPA-associated diseases, disorders, and conditions.
    Type: Application
    Filed: December 8, 2023
    Publication date: November 14, 2024
    Inventors: Wei HUANG, Hui Lei, Zhongmiao Xu, Haizhen Zhang, Qiong Zhang
  • Publication number: 20240376105
    Abstract: The present disclosure relates generally to GLP-1 agonists and pharmaceutical compositions comprising the same, as well as methods for treating a GLP-1 associated disease, disorder, or condition.
    Type: Application
    Filed: July 2, 2024
    Publication date: November 14, 2024
    Inventors: Wei HUANG, Hui LEI, Chunliang LU, Haizhen ZHANG
  • Patent number: 12137914
    Abstract: An anastomosis set for anastomosing a first end to be anastomosed with a second end to be anastomosed, such anastomosis set comprising: a first manipulator, with a first telescoping part at a distal end thereof, the first telescoping part is used for telescoping toward the first end to be anastomosed; a second manipulator, with a second telescoping part at a distal end thereof, the second telescoping part is used for telescoping toward the second end to be anastomosed; and an anastomosis mechanism for anastomosing the first end to be anastomosed with the second end to be anastomosed; the first manipulator including a first exit part through which the first manipulator will be removed from the first end to be anastomosed after anastomosing; the second manipulator has a second exit part, through which the second manipulator will be removed from the second end to be anastomosed after anastomosing.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: November 12, 2024
    Assignee: Vasocollar, Inc
    Inventors: Hsin-Lei Huang, Wei-Chen Hong, Cheng Tung Huang, Hang-Yi Lin, Hsin-Hui Huang
  • Publication number: 20240371827
    Abstract: A package structure includes a supporting base, conductive pillars, a first semiconductor die, a second semiconductor die, a first adhesive material, a second adhesive material and an isolation structure. The conductive pillars are disposed in the supporting base, and protruding out from a top surface of the supporting base. The second semiconductor die is adjacent to the first semiconductor die, wherein the first and second semiconductor dies are disposed on the supporting base and electrically connected to the conductive pillars. The first adhesive material is disposed in between the first semiconductor die and the top surface of the supporting base, and partially covering the conductive pillars. The second adhesive material is disposed in between the second semiconductor die and the top surface of the supporting base, and partially covering the conductive pillars. The isolation structure prevents a bleeding of the first and second adhesive material to an adjacent semiconductor die.
    Type: Application
    Filed: May 3, 2023
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Fung Chang, Ching-Hua Hsieh, Yi-Yang Lei, Chao-Wei Chiu, Ming-Yu Yen
  • Publication number: 20240371771
    Abstract: Embodiments of the disclosure include an apparatus and method of forming a semiconductor structure that includes metal contacts with a low resistance. In some embodiments, the semiconductor device generally includes an interconnect. The interconnect generally includes a dielectric layer with a tungsten (W) plug formed therein, a feature formed in the dielectric layer and over the W plug, a liner layer formed on an exposed surface of the W plug and on sidewalls of the feature, an interruption layer formed on the liner layer, and a conductive material substantially filling the feature. The liner layer includes molybdenum (Mo) or W, and the interruption layer includes Mo.
    Type: Application
    Filed: January 26, 2024
    Publication date: November 7, 2024
    Inventors: Sahil Jaykumar PATEL, Wei LEI, Tuerxun AILIHUMAER, Joung Joo LEE, Rongjun WANG, Xianmin TANG
  • Publication number: 20240362387
    Abstract: A device includes a first conductive line as an input line. The device further includes a second conductive line as an output line, wherein the first conductive line and the second conductive line are in a same level of the integrated circuit. The device further includes a first passive isolation structure between the first conductive line and the second conductive line, wherein the first passive isolation structure and the second conductive line are each positioned at an integer multiple of an interval between the first conductive line and the first passive isolation structure.
    Type: Application
    Filed: July 12, 2024
    Publication date: October 31, 2024
    Inventors: Cheok-Kei LEI, Jerry Chang Jui KAO, Chi-Lin LIU, Hui-Zhong ZHUANG, Zhe-Wei JIANG, Chien-Hsing LI
  • Publication number: 20240355673
    Abstract: Semiconductor devices and methods for molybdenum fill in semiconductor devices are provided. In one aspect, a method for processing a semiconductor device substrate is provided. The method includes exposing at least one feature formed in a dielectric layer to a grain modification layer deposition process to deposit a grain modification layer over at least a portion of the at least one feature. The at least one feature is defined by sidewall surfaces formed in the dielectric layer and a bottom surface extending between the sidewall surfaces. The method further includes exposing the at least one feature to a molybdenum deposition process to form a molybdenum-fill layer on the grain modification layer, wherein the grain modification layer comprises a metal different from molybdenum.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 24, 2024
    Inventors: Wei LEI, Sahil PATEL, Yixiong YANG, Yu LEI, Shiyu YUE, Yi XU, Tuerxun AILIHUMAER, Juhyun OH, Xianmin TANG, Rongjun WANG
  • Publication number: 20240337705
    Abstract: The present application relates to the technology field of assessment of aging state of oil paper insulation of the large power transformer and quantitative diagnostic, specifically estimating parameters of the circuit through the initial slope of the recovery voltage. It includes an improved mathematical model for solving parameters of the dielectric response equivalent circuit by using the peak of the recovery voltage, the peak time and the initial slope characteristics; transforming the identification of parameters of the equivalent circuit into a mathematical optimization problem, and then solving the mathematical optimization problem using a particle swarm algorithm. The design of the present application can significantly reduce the sampling data of the recovery voltage, and the measured data in the field and the calculated data of different capacity RVM experiments on real transformers have good consistency, which is conducive to the diagnosis of state of oil paper insulation of the transformer.
    Type: Application
    Filed: March 27, 2024
    Publication date: October 10, 2024
    Inventors: Qilong ZHU, Fu LI, Bing WANG, Baode LIN, Tao ZHU, Shizhen LI, Yuntao LIU, Rui ZHANG, Yanyi XIE, Jianlai GUO, Yu ZHANG, Jinkuo CAO, Tao GUO, Yongzhi WANG, Bing DUAN, Yakui DENG, Dong LEI, Yan QING, Yunguang YU, Wei YU, Maobing LI, Lu YANG, Lin GAO, Zhibin TAN, Yanqi YAO, Shaohua JIANG, Wuzheng HE, Haocheng YANG, Yunhong XIONG
  • Publication number: 20240340970
    Abstract: Wireless communications systems may support flexible waveform configuration for autonomous uplink transmissions. A base station may transmit broadcast signaling (e.g., a system information block (SIB)) indicating waveform configuration information for an autonomous uplink transmission by a user equipment (UE). In some cases, the broadcast signaling may include a waveform configuration field (WCF) that may indicate whether flexible waveforms for autonomous uplink are supported, may configure a waveform type, may indicate waveform configuration mapping rules, etc. As such, a UE may identify whether flexible waveform configuration for autonomous uplink is supported, and may determine waveform types for autonomous uplink transmissions based on waveform type configuration information from a base station (e.g., which may include an indication of whether flexible waveform configuration is supported, an indication of waveform type/scenario mapping rules, etc.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Inventors: Jing LEI, Seyong PARK, Hung Dinh LY, Wei YANG, Linhai HE, Joseph Binamira SORIAGA, Wanshi CHEN, Ruiming ZHENG
  • Patent number: 12112890
    Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: October 8, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Borui Xia, Anthony Chih-Tung Chan, Shiyu Yue, Wei Lei, Aravind Miyar Kamath, Mukund Sundararajan, Rongjun Wang, Adolph Miller Allen
  • Publication number: 20240333060
    Abstract: The invention relates to a double-layer winding layout method suitable for asymmetrical winding machine. The method is implemented by three main steps: 1) the design of the initial double-layer winding layout structure for each machine unit, which is based on the principle of the largest number of spokes belonging to phase A; 2) rearranging the number of spokes in positive (e.g., labeled a-phase belt) and negative sectors (e.g., labeled x-phase belt) belonging to phase A for making slot numbers equally divided; 3) solving the serial number of the stator slot in reverse to get the final winding layout schemes which contain multiple layout structures for one slot-pole combination. The method of the present invention improves the conventional star-of-slot theory based on the distribution characteristics of the asymmetrical windings, perfects the general design theory of double-layer asymmetrical winding structure.
    Type: Application
    Filed: June 4, 2024
    Publication date: October 3, 2024
    Applicants: ZHEJIANG UNIVERSITY, ZHEJIANG UNIVERSITY ADVANCED ELECTRICAL EQUIPMENT INNOVATION CENTER
    Inventors: Dong YAN, Haowei LEI, Peidong HU, Zhen ZHANG, Yan YAN, Wei CHEN, Tingna SHI
  • Publication number: 20240327404
    Abstract: The present disclosure relates generally to GLP-1 agonists and pharmaceutical compositions comprising the same, as well as methods for treating a GLP-1 associated disease, disorder, or condition.
    Type: Application
    Filed: April 5, 2024
    Publication date: October 3, 2024
    Inventors: Wei HUANG, Hui LEI, Chunliang LU, Haizhen ZHANG
  • Patent number: 12106033
    Abstract: The present disclosure describes a method for optimizing metal cuts in standard cells. The method includes placing a standard cell in a layout area and inserting a metal cut along a metal interconnect of the standard cell at a location away from a boundary of the standard cell. The method further includes disconnecting, at the location, a metal portion of the metal interconnect from a remaining portion of the metal interconnect based on the metal cut.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: October 1, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheok-Kei Lei, Zhe-Wei Jiang, Chi-Yu Lu, Yi-Hsin Ko, Chi-Lin Liu, Hui-Zhong Zhuang
  • Publication number: 20240322309
    Abstract: A housing of a battery cell has an opening at an end in a first direction and includes a first side plate, a second side plate and a first connection plate. The first side plate and the second side plate are arranged in a circumferential direction of the opening, the first connection plate is connected between the first side plate and the second side plate, and at least a part of the first connection plate is arcuate. The first side plate includes a first plate portion, a second plate portion and a third plate portion, the second plate portion is connected between the first plate portion and the first connection plate, and the third plate portion is located at a side of the first plate portion close to the opening.
    Type: Application
    Filed: June 3, 2024
    Publication date: September 26, 2024
    Inventors: Wei CHEN, Chuan LI, Zhijun GUO, Yuyong LEI, Donglai ZHENG
  • Patent number: 12101724
    Abstract: Methods and apparatuses of power control for additional SRS are disclosed. A method at abase unit comprises transmitting power control parameters for transmitting additional SRS by higher layers; and transmitting TPC command by DCI format 3B for additional SRS.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 24, 2024
    Assignee: Lenovo (Beijing) Limited
    Inventors: Bingchao Liu, Chenxi Zhu, Haipeng Lei, Wei Ling
  • Patent number: 12085090
    Abstract: An air blower, including a volute, a centrifugal wind wheel, and a motor. The volute includes an end plate, a side plate extending from an edge of the end plate, and a cavity formed by the end plate and the side plate; the centrifugal wind wheel is disposed in the cavity; the end plate includes an air inlet, and two ends of the side plate are disposed side by side to form an air outlet; the end plate further includes a support beam opposite to the air inlet, and the motor is disposed on the support beam.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: September 10, 2024
    Assignee: ZHONGSHAN BROAD-OCEAN MOTOR CO., LTD.
    Inventors: Hongyu Jia, Huijun Zhan, Shaner Zhang, Xuanfeng Wen, Wei Lei
  • Publication number: 20240294598
    Abstract: The invention relates to the field of biomedicine, in particular to an enhanced synthetic T-cell receptor and antigen receptor (STAR) targeting CD19 and CD20, a T cell comprising the synthetic T-cell receptor antigen receptor and the use thereof.
    Type: Application
    Filed: May 25, 2021
    Publication date: September 5, 2024
    Inventors: Wei RUI, Jiasheng WANG, Lei LEI, Li YU, Xueqiang ZHAO, Xin LIN
  • Publication number: 20240289316
    Abstract: The disclosure discloses a method, apparatus, device, medium and product for managing activity data within an application. The method includes: obtaining a queue message in a preset activity data reporting event message queue, and storing activity data corresponding to the queue message into a first preset database of at least one data storage space having a business association with the activity data; and managing the activity data according to duration of the activity data stored in the first preset database and/or a management operation of a user for the activity data; where the first preset database is a key-value database that meets a first preset storage performance standard.
    Type: Application
    Filed: February 28, 2024
    Publication date: August 29, 2024
    Inventors: Yuxiang Huang, Jian Lei, Wei Huang, Xinhao Zhang
  • Patent number: 12073162
    Abstract: A method of modifying an integrated circuit layout includes determining whether a first conductive line and a second conductive line are subject to a parasitic capacitance above a parasitic capacitance threshold. The method further includes adjusting the integrated circuit layout by moving the first conductive line in the integrated circuit layout in response to determining to move the first conductive line. The method further includes inserting an isolation structure between the first and second conductive lines in the integrated circuit layout in response to determining not to move the first conductive line.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: August 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheok-Kei Lei, Jerry Chang Jui Kao, Chi-Lin Liu, Hui-Zhong Zhuang, Zhe-Wei Jiang, Chien-Hsing Li
  • Publication number: 20240284089
    Abstract: The present invention discloses a device of a polymeric bone conduction sound transmission component, a headset and a headset system, wherein a plurality of components of a sound generating unit are directly mounted on a housing; during operation of the device, only some of the components vibrate, and weight of the vibrating components is small, which can reduce the possibility of loose connection of the vibrating components.
    Type: Application
    Filed: February 1, 2024
    Publication date: August 22, 2024
    Inventors: Hao Zhang, Ronghua Zhu, Wei Zhao, Shundong Pan, Yuqing Lei