Patents by Inventor Wei Lei

Wei Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230235655
    Abstract: A wellbore staged operation method, includes running, after a first well drifting operation is performed on a wellbore, a pipe string (100) in the wellbore, wherein the pipe string (100) includes, along a direction from bottom to top, a floating hoop (2), a plug seat (7), a toe-end sliding sleeve (3), and a fracturing sliding sleeve (4); performing a cementing operation, wherein cement slurry pumped into an inner chamber of the pipe string (100) enters an annulus between the pipe string and the wellbore through the plug seat (7) and the floating hoop (2) to form a cement sheath, the cement sheath isolating the toe-end sliding sleeve (3) from the fracturing sliding sleeve (4); performing a second drifting operation to ensure the toe-end sliding sleeve (3) of the pipe string (100) exposed; performing a pressure test for the pipe string; and performing staged fracturing constructions.
    Type: Application
    Filed: June 10, 2021
    Publication date: July 27, 2023
    Inventors: Wei LEI, Zhimin HOU, Haifeng DONG, Yancheng YAN, Lin LAN, Xingwen WANG, Xiaogang WANG, Zhiguo QIAO, Zhou FANG
  • Publication number: 20230236222
    Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Che-Hsien Huang, Shih-Chia Chiu, Yi-Chieh Lin, Wun-Jian Lin
  • Publication number: 20230134230
    Abstract: Methods for forming tungsten gap fill on a feature. A method for forming tungsten gap fill in a feature can include: treating a first layer on a substrate having a portion of the first layer exposed through the feature; depositing a tungsten liner layer atop the treated portion of the first layer in the feature using a physical vapor deposition (PVD) process; and depositing a tungsten fill layer into the feature and atop the tungsten liner layer using a chemical vapor deposition (CVD) process.
    Type: Application
    Filed: July 9, 2022
    Publication date: May 4, 2023
    Inventor: Wei Lei
  • Patent number: 11624758
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: April 11, 2023
    Assignee: MEDIATEK INC.
    Inventors: Sheng-Wei Lei, Chang-Lin Wei, Ying-Chou Shih, Yeh-Chun Kao, Yen-Ju Lu, Po-Sen Tseng
  • Publication number: 20230088552
    Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Borui Xia, Anthony Chih-Tung Chan, Shiyu Yue, Wei Lei, Aravind Miyar Kamath, Mukund Sundararajan, Rongjun Wang, Adolph Miller Allen
  • Publication number: 20230023235
    Abstract: Embodiments of methods and associated apparatus for filling a feature in a substrate are provided herein. In some embodiments, a method of filling a feature in a substrate includes: depositing a seed layer of tungsten nitride in the feature via a physical vapor deposition (PVD) process; depositing a liner layer of tungsten on the seed layer of tungsten nitride in the feature via a PVD process; and subsequently filling the feature with a tungsten bulk fill via a chemical vapor deposition (CVD) process.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 26, 2023
    Inventors: Xi CEN, Yun TAEWOONG, Shirish A. PETHE, Kai WU, Nobuyuki SASAKI, Wei LEI
  • Publication number: 20220397600
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
    Type: Application
    Filed: May 3, 2022
    Publication date: December 15, 2022
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Chih-Yang Liu, Che-Hsien Huang, Yi-Chieh Lin
  • Publication number: 20220380888
    Abstract: Methods of processing a substrate in a PVD chamber are provided herein. In some embodiments, a method of processing a substrate in a PVD chamber, includes: sputtering material from a target disposed in the PVD chamber and onto a substrate, wherein at least some of the material sputtered from the target is guided to the substrate through a magnetic field provided by one or more upper magnets disposed about a processing volume of the PVD chamber above a support pedestal for the substrate in the PVD chamber, one or more first magnets disposed about the support pedestal and providing an increased magnetic field strength at an edge region of the substrate, and one or more second magnets disposed below the support pedestal that increase a magnetic field strength at a central region of the substrate.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Inventors: Goichi YOSHIDOME, Suhas BANGALORE UMESH, Sushil Arun SAMANT, Martin Lee RIKER, Wei LEI, Kishor Kumar KALATHIPARAMBIL, Shirish A. PETHE, Fuhong ZHANG, Prashanth KOTHNUR, Andrew TOMKO
  • Publication number: 20220336227
    Abstract: Methods for producing a reduced contact resistance for cobalt-titanium structures. In some embodiments, a method comprises depositing a titanium layer using a chemical vapor deposition (CVD) process, depositing a first cobalt layer on the titanium nitride layer using a physical vapor deposition (PVD) process, and depositing a second cobalt layer on the first cobalt layer using a CVD process.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 20, 2022
    Inventors: TAKASHI KURATOMI, AVGERINOS GELATOS, TAE HONG HA, XUESONG LU, SZUHENG HO, WEI LEI, MARK LEE, RAYMOND HUNG, XIANMIN TANG
  • Publication number: 20220325410
    Abstract: Methods of depositing a metal film are discussed. A metal film is formed on the bottom of feature having a metal bottom and dielectric sidewalls. Formation of the metal film comprises exposure to a metal precursor and an alkyl halide catalyst while the substrate is maintained at a deposition temperature. The metal precursor has a decomposition temperature above the deposition temperature. The alkyl halide comprises carbon and halogen, and the halogen comprises bromine or iodine.
    Type: Application
    Filed: June 23, 2022
    Publication date: October 13, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Byunghoon Yoon, Liqi Wu, Joung Joo Lee, Kai Wu, Xi Cen, Wei Lei, Sang Ho Yu, Seshadri Ganguli
  • Patent number: 11424132
    Abstract: Methods and apparatus for producing a reduced contact resistance for cobalt-titanium structures. In some embodiments, a method comprises depositing a titanium layer using a chemical vapor deposition (CVD) process, depositing a titanium nitride layer on the titanium layer using an atomic layer deposition (ALD) process, depositing a first cobalt layer on the titanium nitride layer using a physical vapor deposition (PVD) process, and depositing a second cobalt layer on the first cobalt layer using a CVD process.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: August 23, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Takashi Kuratomi, Avgerinos Gelatos, Tae Hong Ha, Xuesong Lu, Szuheng Ho, Wei Lei, Mark Lee, Raymond Hung, Xianmin Tang
  • Patent number: 11417568
    Abstract: Methods and apparatus for selectively depositing a tungsten layer atop a dielectric surface.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: August 16, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Wei Lei, Yi Xu, Yu Lei, Tae Hong Ha, Raymond Hung, Shirish A. Pethe
  • Publication number: 20220213901
    Abstract: An air blower, including a volute, a centrifugal wind wheel, and a motor. The volute includes an end plate, a side plate extending from an edge of the end plate, and a cavity formed by the end plate and the side plate; the centrifugal wind wheel is disposed in the cavity; the end plate includes an air inlet, and two ends of the side plate are disposed side by side to form an air outlet; the end plate further includes a support beam opposite to the air inlet, and the motor is disposed on the support beam.
    Type: Application
    Filed: November 3, 2021
    Publication date: July 7, 2022
    Inventors: Hongyu JIA, Huijun ZHAN, Shaner ZHANG, Xuanfeng WEN, Wei LEI
  • Patent number: 11371524
    Abstract: A windmill, including a first end plate, a second end plate, and a plurality of primary blades disposed between the first end plate and the second end plate. The first end plate includes a central part provided with a base connected to a motor shaft. The second end plate includes a central part provided with an air inlet; the space between every two adjacent blades forms an air channel. The plurality of primary blades each includes an outmost end with respect to the central part of the first end plate, and the outmost end extends out of an outer edge of the second end plate. The connection line of every two adjacent outmost ends of the plurality of primary blades forms a circle, and the diameter D1 of the circle is larger than the diameter D2 of the second end plate.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: June 28, 2022
    Assignee: ZHONGSHAN BROAD-OCEAN MOTOR CO., LTD.
    Inventors: Yanhu Lin, Miao Zhang, Wei Lei
  • Patent number: 11286556
    Abstract: Methods for selectively depositing on surfaces are disclosed. Some embodiments of the disclosure utilize an organometallic precursor that is substantially free of halogen and substantially free of oxygen. Deposition is performed to selectively deposit a metal film on a non-metallic surface over a metallic surface. Some embodiments of the disclosure relate to methods of gap filling.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: March 29, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Byunghoon Yoon, Wei Lei, Sang Ho Yu
  • Publication number: 20220068709
    Abstract: Apparatus and methods to provide electronic devices comprising tungsten film stacks are provided. A tungsten liner formed by physical vapor deposition is filled with a tungsten film formed by chemical vapor deposition directly over the tungsten liner.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 3, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Feihu Wang, Joung Joo Lee, Xi Cen, Zhibo Yuan, Wei Lei, Kai Wu, Chunming Zhou, Zhebo Chen
  • Patent number: 11236590
    Abstract: A device for perforating, packing, and fracturing and a tubing string comprising the device are disclosed, wherein the device comprises an upper connector, a nozzle sleeve, a mandrel, a packer, a lower connector, a first inner sleeve provided inside the upper connector, and a second inner sleeve provided inside the nozzle sleeve, further wherein the upper connector is provided with a fracturing hole, and a nozzle is provided at the nozzle sleeve.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 1, 2022
    Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, SINOPEC SOUTHWEST OIL & GAS COMPANY
    Inventors: Zhenwei Gan, Bin Qi, Zhimin Hou, Shunqu Hu, Wei Lei, Chen Chen, Zhi Xie, Qiang Wang, Wei Zhao, Yijun Zhou
  • Publication number: 20210317570
    Abstract: Methods for selectively depositing on surfaces are disclosed. Some embodiments of the disclosure utilize an organometallic precursor that is substantially free of halogen and substantially free of oxygen. Deposition is performed to selectively deposit a metal film on a non-metallic surface over a metallic surface. Some embodiments of the disclosure relate to methods of gap filling.
    Type: Application
    Filed: April 14, 2020
    Publication date: October 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Byunghoon Yoon, Wei Lei, Sang Ho Yu
  • Publication number: 20210320034
    Abstract: Methods and apparatus for selectively depositing a tungsten layer atop a dielectric surface.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 14, 2021
    Inventors: Wei LEI, Yi XU, Yu LEI, Tae Hong HA, Raymond HUNG, Shirish A. PETHE
  • Patent number: D986057
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: May 16, 2023
    Assignee: Hangzhou Zheda Dixun Biological Gene Engineering Co., Ltd.
    Inventors: Zhoujie Wu, Yi Liu, Yue Xu, Wei Lei, Chunyan Zhou, Yun Ling