Patents by Inventor Wei-Lin Chen

Wei-Lin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190252259
    Abstract: The present invention provides a method for forming a semiconductor structure. The method including: Firstly, a substrate is provided, a first region and a second region are defined thereon, next, a gate dielectric layer and a work function metal layer are sequentially formed on the substrate within the first region and within the second region. Afterwards, a dielectric layer is formed on the work function metal layer within the second region, a hydrogen gas treatment is then performed on the substrate, and the work function metal layer is removed within the first region.
    Type: Application
    Filed: February 11, 2018
    Publication date: August 15, 2019
    Inventors: Chia-Lin Lu, Chun-Lung Chen, Kun-Yuan Liao, Chun-Hsien Lin, Wei-Hao Huang, Kai-Teng Cheng
  • Publication number: 20190222211
    Abstract: This disclosure presents a power switching module combining a novel gate driver with a photonic isolated power source which can output a high voltage and high power at the same time, and thus can drive a power semiconductor device. The disclosed power switching module could simplify the switched mode power supply structure to (1) replace the isolated power supply module; (2) simplify circuitry of the gate driver by integrating gate driver signaling opto-electronics; and (3) provide a module with power semiconductor device under switched mode power supply structure.
    Type: Application
    Filed: January 14, 2019
    Publication date: July 18, 2019
    Inventors: Mei-huan Yang, Cheng-liang Wu, Remigio Perales, Kun-hsien Chen, Wei-sheng Chao, Ying-lin Tseng, I-tsung Chen
  • Patent number: 10339847
    Abstract: A display apparatus including a display panel and a driver circuit is provided. The display panel includes a display region and a non-display region. The non-display region includes a plurality of dummy pixels connected to one another. The driver circuit provides gate driving voltages and a test data voltage, so as to make the dummy pixels connected to one another generate a charging rate test signal in response to the test data voltage.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 2, 2019
    Assignee: E Ink Holdings Inc.
    Inventors: Wen-Yu Kuo, Guan-Ru Huang, Pei-Lin Huang, Wei-Tsung Chen
  • Publication number: 20190192437
    Abstract: The disclosure provides a powder form and a hydrogel composition for alleviating degenerative joint and tendon tear. The powder form consists essentially of a 120-380 parts by weight biodegradable copolymer; 15-75 parts by weight urea; and 100 parts by weight platelet-rich plasma; wherein the biodegradable copolymer has a structure of formula (I) or formula (II): wherein A comprises a hydrophilic polyethylene glycol polymer; B comprises a hydrophobic polyester polymer; BOX is bifunctional group monomer of 2, 2?-bis(2-oxazoline) used for coupling the blocks AB or BAB; and n is an integer greater than or equal to 0.
    Type: Application
    Filed: December 27, 2017
    Publication date: June 27, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Hsin SHEN, Wen-Shiang CHEN, Chueh-Hung WU, Ming-Kuan SUN, Yu-Chi WANG, Sen-Lu CHEN, Wei-Lin YU, Lih-Tao HSU, Shih-Ping LIN
  • Patent number: 10328286
    Abstract: A beam shaping assembly for neutron capture therapy includes a beam inlet, a target having nuclear reaction with an incident proton beam from the beam inlet to produce neutrons forming a neutron beam, a moderator adjoining to the target, a reflector surrounding the moderator, a thermal neutron absorber adjoining to the moderator, a radiation shield arranged inside the beam shaping assembly and a beam outlet. The material of the moderator is subjected to a powder sintering process using a powder sintering device so as to change powders or a power compact into blocks. The reflector leads the neutrons deviated from the main axis back. The thermal neutron absorber is used for absorbing thermal neutrons so as to avoid overdosing in superficial normal tissue during therapy. The radiation shield is used for shielding leaking neutrons and photons so as to reduce dose of the normal tissue not exposed to irradiation.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: June 25, 2019
    Assignee: NEUBORON MEDTECH LTD.
    Inventors: Yuan-hao Liu, Wei-lin Chen, Pei-yi Lee, Ming-chuan Chang, Wenyu Xu
  • Publication number: 20190187035
    Abstract: A particulate matter measuring device includes a gas transporting actuator, a micro particle sensor and a laser module. The micro particle sensor is disposed corresponding in position to the gas transporting actuator. The laser module is disposed between the gas transporting actuator and the micro particle sensor and emits a laser beam between the gas transporting actuator and the micro particle sensor. The air flowing between the gas transporting actuator and the micro particle sensor is irradiated by the laser beam. The micro particle sensor analyzes sizes of suspended particles in the air and calculates concentrations of the suspended particles. The air is ejected at high speed by the gas transporting actuator to perform a cleaning operation on a surface of the micro particle sensor so as to remove the suspended particles on the surface of the micro particle sensor and maintain accuracy of the micro particle sensor.
    Type: Application
    Filed: November 6, 2018
    Publication date: June 20, 2019
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan MOU, Shih-Chang CHEN, Jia-Yu LIAO, Yung-Lung HAN, Chi-Feng HUANG, Chang-Yen TSAI, Chiu-Lin LEE, Hsuan-Kai CHEN, Wei-Ming LEE
  • Patent number: 10325912
    Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: June 18, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ryan Chia-Jen Chen, Li-Wei Yin, Tzu-Wen Pan, Yi-Chun Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang
  • Publication number: 20190179450
    Abstract: An electronic device such as a device with a display may have a force sensor. The force sensor may include capacitive electrodes separated by a deformable layer such as a layer of an elastomeric polymer. The display or other layers in the electronic device may deform inwardly under applied force from a finger of a user or other external object. As the deformed layers contact the deformable layer, the deformable layer is compressed and the spacing between the capacitive electrodes of the force sensor decreases. This causes a measurable rise in the capacitance signal and therefore the force signal output of the force sensor. To prevent the deformable layer from sticking to the inner surface of the display layers, air flow promotion structures may be interposed between the deformable layer and the inner surface of the display. The air flow promotion structures may include spacer pads with anti-stick surfaces.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 13, 2019
    Inventors: Wei Lin, Henry E. Herman, III, Po-Jui Chen, Robert W. Rumford, Steve L. Terry, Yindar Chuo
  • Publication number: 20190172949
    Abstract: A method of fabricating a fin structure with tensile stress includes providing a structure divided into an N-type transistor region and a P-type transistor region. Next, two first trenches and two second trenches are formed in the substrate. The first trenches define a fin structure. The second trenches segment the first trenches and the fin. Later, a flowable chemical vapor deposition is performed to form a silicon oxide layer filling the first trenches and the second trenches. Then, a patterned mask is formed only within the N-type transistor region. The patterned mask only covers the silicon oxide layer in the second trenches. Subsequently, part of the silicon oxide layer is removed to make the exposed silicon oxide layer lower than the top surface of the fin structure by taking the patterned mask as a mask. Finally, the patterned mask is removed.
    Type: Application
    Filed: January 18, 2019
    Publication date: June 6, 2019
    Inventors: Kai-Lin Lee, Zhi-Cheng Lee, Wei-Jen Chen, Ting-Hsuan Kang, Ren-Yu He, Hung-Wen Huang, Chi-Hsiao Chen, Hao-Hsiang Yang, An-Shih Shih, Chuang-Han Hsieh
  • Patent number: 10310941
    Abstract: A data encoding method, a memory control circuit unit and a memory storage device are provided. The method includes: writing a first data into a first physical programming units; writing a second data into a second physical programming units; encoding by using the first data without using the second data to generate a first encoded data; encoding by using the second data and a first sub-data of the first data to generate a second encoded data; and writing the first encoded data and the second encoded data into a third physical programming unit and a fourth physical programming unit.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: June 4, 2019
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Wei Lin, Chih-Kang Yeh, Yu-Cheng Hsu, Szu-Wei Chen
  • Patent number: 10312118
    Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: June 4, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Shan Wu, Yi-Ting Hu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang, Pin-Yi Shin, Wen-Ming Chen, Wei-Chih Chen, Chih-Yuan Chiu
  • Publication number: 20190165137
    Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin and a second fin on a substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes a liner on a first sidewall of the first fin, and an insulating fill material on a sidewall of the liner and on a second sidewall of the first fin. The liner is further on a surface of the first fin between the first sidewall of the first fin and the second sidewall of the first fin.
    Type: Application
    Filed: March 1, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ryan Chia-Jen CHEN, Ming-Ching CHANG, Yi-Chun CHEN, Yu-Hsien LIN, Li-Wei YIN, Tzu-Wen PAN, Cheng-Chung CHANG, Shao-Hua HSU
  • Publication number: 20190163363
    Abstract: A data accessing method, a memory controlling circuit unit and a memory storage device are provided. The method includes: reading a first physical programming unit by using a first read voltage to obtain first data; reading the first physical programming unit by using a second read voltage to obtain second data; inputting a first state parameter corresponding to the first data and a second state parameter corresponding to the second data into a numerical calculation engine, and determining a third reading voltage for reading the first physical programming unit by the numerical calculation engine.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 30, 2019
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Wei Lin, An-Cheng Liu, Lih Yuarn Ou, Szu-Wei Chen
  • Patent number: 10290697
    Abstract: A method of manufacturing a semiconductor device and the semiconductor device are provided in which a plurality of layers with cobalt-zirconium-tantalum are formed over a semiconductor substrate, the plurality of layers are patterned, and multiple dielectric layers and conductive materials are deposited over the CZT material. Another layer of CZT material encapsulates the conductive material.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: May 14, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chien-Chih Chou, Chin-Yu Ku, Chen-Shien Chen
  • Publication number: 20190139817
    Abstract: A method and structure for packaging a semiconductor device are provided. In an embodiment a first substrate is bonded to a second substrate, which is bonded to a third substrate. A thermal interface material is placed on the second substrate prior to application of an underfill material. A ring can be placed on the thermal interface material, and an underfill material is dispensed between the second substrate and the third substrate. By placing the thermal interface material and ring prior to the underfill material, the underfill material cannot interfere with the interface between the thermal interface material and the second substrate, and the thermal interface material and ring can act as a physical barrier to the underfill material, thereby preventing overflow.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 9, 2019
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin
  • Publication number: 20190008373
    Abstract: The present application provides an arthroscopic system, which comprises an disposable arthroscope having a distal end and a proximal end, and comprising a light source, a lens set, an image sensor, a transmitter, and a control interface. The present application eliminates the possibility of infecting the patient with contaminated devices by its cost-effectively disposable arthroscope. The present application also provides a method for image rotating in an arthroscopic system.
    Type: Application
    Filed: September 12, 2018
    Publication date: January 10, 2019
    Inventors: Chung-Sheng Chen, Ching-Chuan Jiang, Chien-Hsiang Chang, Wei-lin Chen
  • Patent number: 10164156
    Abstract: Structures and formation methods of an image sensor structure are provided. The image sensor structure is provided. The image sensor structure includes a substrate, a photodiode component in the substrate, and a grid structure over the substrate. The grid structure includes a bottom dielectric element over the substrate, a reflective element over the bottom dielectric element, and an upper dielectric element over the reflective element. The reflective element has a sidewall which is anti-corrosive in a basic condition and an acidic condition. The image sensor structure also includes a color filter element over the substrate and surrounded by the grid structure. The color filter element is aligned with the photodiode component.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ching-Chung Su, Hung-Wen Hsu, Wei-Chuang Wu, Wei-Lin Chen, Jiech-Fun Lu
  • Patent number: 10157693
    Abstract: A neutron moderation material for use in a BNCT beam shaping assembly. The neutron moderation material comprises three elements, i.e., Mg, Al, and F, wherein the mass fraction of the Mg element is 3.5%-37.1%, the mass fraction of the Al element is 5%-90.4%, and the mass fraction of the F element is 5.8%-67.2%; the sum of the weights of the Mg, Al, and F elements is 100% of the total weight of the neutron moderation material. The neutron moderation material may be doped with a small amount of 6Li-containing substances, and the addition of the 6Li-containing substances effectively decreases the content of ?-rays in epithermal neutron beams.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: December 18, 2018
    Assignee: NEUBORON MEDTECH LTD.
    Inventors: Yuan-Hao Liu, Wei-Lin Chen
  • Publication number: 20180286907
    Abstract: Structures and formation methods of an image sensor structure are provided. The image sensor structure is provided. The image sensor structure includes a substrate, a photodiode component in the substrate, and a grid structure over the substrate. The grid structure includes a bottom dielectric element over the substrate, a reflective element over the bottom dielectric element, and an upper dielectric element over the reflective element. The reflective element has a sidewall which is anti-corrosive in a basic condition and an acidic condition. The image sensor structure also includes a color filter element over the substrate and surrounded by the grid structure. The color filter element is aligned with the photodiode component.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Chung SU, Hung-Wen HSU, Wei-Chuang WU, Wei-Lin CHEN, Jiech-Fun LU
  • Publication number: 20180277278
    Abstract: Disclosed is a method for evaluating an irradiation angle of a beam, including a step of sampling the irradiation angle of the beam, wherein the irradiation angle of the beam is defined as being the direction of the vector of the irradiation point of the beam to the pre-set point of the tumor; and a step of calculating the track of the beam passing through the organs, wherein it is determined whether the tumor is fully covered within the effective treatment depth, and if so, entering the steps of calculating the evaluation coefficient, recording the irradiation conditions and calculating the results, and returning to the step of sampling the irradiation angle of the beam; and if not, entering the step of giving the worst evaluation coefficient and returning to the step of sampling the irradiation angle of the beam.
    Type: Application
    Filed: May 29, 2018
    Publication date: September 27, 2018
    Inventors: Yuan-Hao Liu, Wei-Lin Chen