Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: A conjugate cam reducer includes input and output units disposed at two opposite sides of a transmission unit along an output axis. The transmission unit includes input-side and output-side cam discs having first and second grooved surfaces. The input unit includes an input disc having a plurality of first receiving grooves registered with the first grooved surfaces to receive input rollers, and an eccentric shaft rotated to drive rotation of the transmission unit in an eccentric cam motion. The output unit includes an output disc having an inner peripheral wall which engages with the output-side cam disc, and a plurality of second receiving grooves which are registered with the second grooves to receive output rollers. An outer diameter of each first toothed surface and an outer diameter of each second toothed surface is gradually increased along a direction parallel to the output axis.

Abstract: A card edge connector includes: a connector base having a card slot and plural terminals; a latch located at one end of the connector base for locking a card; and a releasing member. The releasing member includes two levers and a moving member, the levers are connected with the connector base in a pivoting manner, a first end of the lever is connected with the latch and an opposite second end of the lever is coupled to the moving member, wherein when the card is inserted into the slot and presses against the moving member downwards, the moving member drives the second ends of the levers to move downward, resulting in the first ends moving upwards to push the latch to lock with the card, and when the card is pulled out the moving member resets and drives the levers to release the latch from the card.

Abstract: An imaging optical lens system includes eight lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The seventh lens element has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the seventh lens element has at least one convex critical point in an off-axis region thereof.

Abstract: A method of manufacturing a semiconductor device includes forming a fin structure over a substrate, forming a sacrificial gate structure over the fin structure, and etching a source/drain (S/D) region of the fin structure to form an S/D recess. The fin structure includes first semiconductor layers and second semiconductor layers alternately stacked. The method further includes depositing an insulating dielectric layer in the S/D recess, depositing an etch protection layer over a bottom portion of the insulating dielectric layer, and partially removing the insulating dielectric layer. The method further includes growing an epitaxial S/D feature in the S/D recess. The bottom portion of the insulating dielectric layer interposes the epitaxial S/D feature and the substrate.

Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a plurality of nanostructures formed over a substrate, and an inner spacer layer between two adjacent nanostructures. The semiconductor structure includes a source/drain (S/D) structure formed adjacent to the inner spacer layer, and a barrier layer adjacent to the inner spacer layer. The barrier layer extends from the first position to the second position, and the first position is between the inner spacer layer and the nanostructure, and the second position is between the nanostructures and the S/D structure.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a first vertical structure and a second vertical structure formed over the substrate, and a conductive rail structure between the first and second vertical structures. A top surface of the conductive rail structure can be substantially coplanar with top surfaces of the first and the second vertical structures.

Abstract: A method for forming a thin film resistor with improved thermal stability is disclosed. A substrate having thereon a first dielectric layer is provided. A resistive material layer is deposited on the first dielectric layer. A capping layer is deposited on the resistive material layer. The resistive material layer is then subjected to a thermal treatment at a pre-selected temperature higher than 350 degrees Celsius in a hydrogen or deuterium atmosphere. The capping layer and the resistive material layer are patterned to form a thin film resistor on the first dielectric layer.

Abstract: An axial-flow heat dissipation fan including a frame, a hub, and a plurality of blades is provided. The frame has an air inlet and an air outlet. The hub is rotatably arranged in the frame. The blades disposed at side of the hub respectively and rotate along with the hub. Each of the blades has a front surface facing toward the air inlet and a rear surface facing toward the air outlet. A surface roughness of the front surface is different from a surface roughness of the rear surface.

Abstract: A method for forming an interconnection structure includes depositing a dielectric layer over a first interconnect layer, wherein the first interconnect layer comprises a first metallization layer; forming a via opening in the dielectric layer, and forming a conductive via in the via opening. Forming the via opening includes: etching a recess in the dielectric layer above the first metallization layer; etching a first lateral recess in the dielectric layer at a sidewall of the recess; and after etching the first lateral recess, etching the recess downward to expose the first metallization layer.

Abstract: An antenna module and a portable electric device are provided. The antenna module includes a flexible substrate, a first antenna circuit and a second antenna circuit. Each of an L-shaped bent portion and a U-shaped bent portion of the flexible substrate has a first end and a second end opposite to each other. The first end of the L-shaped bent portion is connected to a first main body of the flexible substrate. The first end of the U-shaped bent portion is connected to the second end of the L-shaped bent portion. The second end of the U-shaped bent portion is connected to a second main body of the flexible substrate. The first antenna circuit and the second antenna circuit are respectively disposed on the first main body and the second main portion. The portable electric device includes a casing and the antenna module disposed at a corner.

Abstract: An optical system, comprising: (i) multiple input optical fibers; (ii) an optical mode multiplexer/demultiplexer coupled to said input optical fibers with, said optical mode multiplexer/demultiplexer comprising a plurality of metamaterial structures having length and forming at least one stage of metamaterials, the at least one stage of metamaterials is being situated on a surface of the optical mode multiplexer/demultiplexer facing the input optical fibers, and the at least one stage of metamaterials is oriented at angles between 60 and 120 degrees relative to the axis of the input fibers; and the metasurfaces are structured to receive a first optical signal having a first mode from at least one of said multiple input optical fibers and convert the first mode to a different mode.

Abstract: A quantum memory device includes: a waveguide configured to spatially confine paths of photons therein; a memory cell that includes a micro-ring resonator (MRR), a frequency tuner, and a quantum memory material portion, wherein the MRR includes a first segment that is parallel to a segment of the waveguide, wherein the frequency tuner is configured to modulate a photon resonance frequency in the MRR by modifying an effective refractive index within, or around, a second segment of the MRR, and wherein the quantum memory material portion includes a quantum memory material having a ground state and an excitation state that stores photons therein and located within or on a third segment of the MRR; and a control circuit configured to modulate the photon resonance wavelength in the MRR during a first step of a photon capture operation to match a predefined wavelength, and to generate captured photons in the MRR.

Abstract: A package structure and a formation method are provided. The method includes forming a capacitor element over a first chip structure and forming a dielectric layer over the capacitor element. The method also includes forming a conductive bonding structure in the dielectric layer. A top surface of the conductive bonding structure is substantially coplanar with a top surface of the dielectric layer. The conductive bonding structure penetrates through the capacitor element and is electrically connected to the capacitor element. The method further includes bonding a second chip structure to the dielectric layer and the conductive bonding structure through dielectric-to-dielectric bonding and metal-to-metal bonding.

Abstract: The invention relates to a power tool that can be held with one hand for reversing, comprising: a casing having a grip part and a manipulation port; a driving device having a control member; the control member is capable of controlling an actuation direction of the driving device; a power source disposed below the driving device and capable of driving the driving device; a reversing assembly disposed at a periphery of the power source and having a reversing member; the reversing member controls the control member to generate changes of displacement, a driving direction of the driving device is changed by action of turning the reversing assembly that is away from the driving device, and there is an appropriate manipulating distance between the grip part and the manipulation port, so that a user is capable of manipulating by holding and reversing the power tool with one hand at a same position, and the control member is capable of being driven to perform reversing when the driving device is driven.

Abstract: A structurally integral multilaminar planer device is provided where the layers are bonded without use of adhesive. The device includes a perforated metal plate and a transductive ceramic layer. The perforated metal plate and transductive ceramic layer are bonded by a conductive metal ink that is subject to a thermal cycle process.

Abstract: A method of making an optical device. The method comprises providing a semiconductor wafer, providing an array of emitters located on a first side of the wafer and providing one or more optical components on a second, opposite side of the wafer, wherein the or each optical component is arranged to split light from an associated emitter of the array of emitters. The method further comprises emitting light with the associated emitter, receiving light emitted by the associated emitter and transmitted through the optical component on the second side of the wafer, and determining an alignment between the one or more optical components and the array of emitters from the received light.

Abstract: A method for forming a chip package structure is provided. The method includes providing a first substrate and a second substrate. The first substrate includes a first semiconductor base and a first bonding line over a front surface of the first semiconductor base, and the second substrate includes a second semiconductor base and a second bonding line over the second semiconductor base. The method includes bonding the second substrate to the first substrate. The first bonding line is in contact with the second bonding line. The method includes forming a conductive line over a back surface of the first semiconductor base. The conductive line is thicker than the first bonding line. The method includes forming a conductive bump over the back surface of the first semiconductor base. The conductive line is between the conductive bump and the first semiconductor base.

Abstract: A probe card monitoring system is adapted for any one of a probe card including a reinforcement frame and a printed circuit board or a prober including a head plate and a clamping mechanism, and includes at least one sensor and a control unit. The at least one sensor is disposed in one of the probe card and the prober to measure a distance between the probe card and the prober in at least one axial direction. The control unit is coupled to the at least one sensor and is configured to issue an alarm. A probe card monitoring method is also provided.