Abstract: A stator of a brushless motor has an iron core, a bobbin, and a winding assembly. The iron core has multiple stator poles mounted on an interior annular surface of a core body and spaced apart from each other. The bobbin is mounted on one of two open ends of the core body and has a substrate, at least one neutral connector mounted on an upper surface of the substrate, and at least one neutral solder pad mounted in the at least one neutral connector. The winding assembly is formed by one wire wound on multiple stator poles and the connectors. The winding assembly is electrically connected to the at least one neutral solder pad.

Abstract: The present disclosure relates to an apparatus that includes a bottom electrode and a dielectric structure. The dielectric structure includes a first dielectric layer on the bottom electrode and the first dielectric layer has a first thickness. The apparatus also includes a blocking layer on the first dielectric layer and a second dielectric layer on the blocking layer. The second dielectric layer has a second thickness that is less than the first thickness. The apparatus further includes a top electrode over the dielectric structure.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: A test circuit testing a storage circuit and including a controller, a pattern-generator circuit, a comparing circuit, and a first register is provided. The controller is configured to generate a plurality of internal test signals. The pattern-generator circuit writes test data into the storage block of the storage circuit according to the internal test signal and reads the storage block to generate read data. The comparing circuit compares the test data and the read data to generate a test result. The first register stores the test result. The controller determines whether the storage circuit is working normally according to the test result stored in the first register.

Abstract: A brushless motor stator includes a stator core and a stator winding. The stator core has a stator frame, a coil carrier and multiple pole shoes. The coil carrier is mounted on one of the two openings of the stator frame and has a tooth base and multiple teeth. The teeth are formed on a top surface of the tooth base. The pole shoes are formed on the inner annular surface of the stator frame. The stator winding is formed by using a single wire to wind around the tooth base, the multiple teeth and the multiple pole shoes, and passing through three of the multiple slots of the coil carrier to extend beyond the outer annular surface of the stator frame to form three extended segments to correspond to U-phase, V-phase and W-phase output terminals of a motor, thereby reducing the number of spot-welding on a wiring board.

Abstract: Embodiments of the disclosure provide a package structure and method of forming the same. The package structure includes a first die, a first encapsulant, a first RDL structure, a die stack structure and a second encapsulant. The first encapsulant laterally encapsulates the first die. The first RDL structure is electrically connected to the first die, and disposed on a first side of the first die and the first encapsulant. The die stack structure is electrically connected to the first die and disposed on a second side of the first die opposite to the first side. The second encapsulant is located over the first encapsulant and laterally encapsulating the die stack structure. A sidewall of the first encapsulant is aligned with a sidewall of the second encapsulant.

Abstract: A meta-lens having a phase profile includes a substrate and a plurality of nanostructures disposed on the substrate. Each individual nanostructure of the nanostructures imparts a light phase shift that varies depending on a location of the individual nanostructure on the substrate. The light phase shifts of the nanostructures define the phase profile of the meta-lens. The varying light phase shifts can be realized by, e.g., changing orientations of nanofins or changing diameters of nanopillars.

Abstract: A semiconductor package includes dies, a redistribution structure, a conductive structure and connectors. The conductive plate is electrically connected to contact pads of at least two dies and is disposed on redistribution structure. The conductive structure includes a conductive plate and a solder cover, and the conductive structure extend over the at least two dies. The connectors are disposed on the redistribution structure, and at least one connector includes a conductive pillar. The conductive plate is at same level height as conductive pillar. The vertical projection of the conductive plate falls on spans of the at least two dies.

Abstract: Embodiments of the present disclosure provide an inverter vent and a loudspeaker having the same. Preferably, air flows within the inverted vent in a 360 degrees full-circumferential direction. This design can improve the efficiency of the loudspeaker, reduce the wind noise, and increase the bass ductility.

Abstract: An optical device comprises a metasurface including a plurality of nanostructures. The nanostructures define a phase profile and a group delay profile at a design wavelength. The phase profile and the group delay profile determine and control the functionalities and the chromatic dispersion of the metasurface.

Abstract: An optical device comprises a first meta-lens and a second meta-lens. The first meta-lens includes a first plurality of nanostructures that define a first phase profile of the first meta-lens. The second meta-lens includes a second plurality of nanostructures that define a second phase profile of the second meta-lens. A combination of the first meta-lens having the first phase profile and the second meta-lens having the second phase profile is configured to achieve a diffraction-limited focusing and correct an aberration of light transmitted through the optical device.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.

Abstract: An optical device includes: (1) a substrate; and (2) multiple meta-lenses disposed on the substrate, each meta-lens of the meta-lenses including multiple nanofins disposed on a respective region of the substrate, the nanofins together specifying a phase profile of the meta-lens.

Abstract: A semiconductor device includes a first die embedded in a molding material, where contact pads of the first die are proximate a first side of the molding material. The semiconductor device further includes a redistribution structure over the first side of the molding material, a first metal coating along sidewalls of the first die and between the first die and the molding material, and a second metal coating along sidewalls of the molding material and on a second side of the molding material opposing the first side.

Abstract: An optical device for aberration correction (e.g., chromatic aberration correction) is disclosed. The optical device includes an optical component (e.g., a spherical lens) and a metasurface optically coupled to the optical component. The metasurface includes a plurality of nanostructures that define a phase profile. The phase profile corrects an aberration (e.g., chromatic aberration) caused by the optical component. The resulting optical device becomes diffraction-limited (e.g., for the visible spectrum) with the metasurface.

Abstract: Provided is an electronic device, including a main body, a first functional module, a linkage mechanism, and a second functional module. The first functional module is slidably provided on the main body between a first position and a second position. The linkage mechanism is provided on the main body and is connected to the first functional module. The second functional module is linked to the linkage mechanism and is provided on the main body in a turnover manner, in which when the first functional module is located at the first position, the second functional module is covered by the first functional module, and when the first functional module moves to the second position and the second functional module is exposed, the second functional module is driven by the linkage mechanism to be turned up.

Abstract: The invention relates to a power tool with an electrically controlled commutating assembly comprising: an electrically controlled commutating assembly and a control unit; the electrically controlled commutating assembly has an electromagnetic unit; the electromagnetic unit is capable of performing a change in displacement due to electromagnetic action; the control unit has a control member, the control member is capable of changing a working direction of a power tool, and displacement of the electromagnetic unit is capable of actuating the control member of the control unit to make the power tool switch the working direction.

Abstract: A cable-driven beater mechanism for a percussion instrument has a base, a transmission shaft pivotally mounted on the base, a beater connected to the transmission shaft, a cable transmission assembly, a restoring spring and a cable. An elongated guiding slot is formed in the standing plate. The cable transmission assembly is pivotally mounted on the base and protrudes into the guiding slot. The cable and the transmission shaft are connected via the cable transmission assembly. Pulling force from a player is transferred via the cable to pivot the transmission shaft and the beater. The restoring spring returns the transmission shaft and the beater to an original position. The cable moves along a straight line during operation to reduce rubbing and repeated bending of the cable, which prolongs service life of the cable, reduces noise during operation, and allows the beater to respond more swiftly to the pulling force.

Abstract: The present disclosure relates to an apparatus that includes a bottom electrode and a dielectric structure. The dielectric structure includes a first dielectric layer on the bottom electrode and the first dielectric layer has a first thickness. The apparatus also includes a blocking layer on the first dielectric layer and a second dielectric layer on the blocking layer. The second dielectric layer has a second thickness that is less than the first thickness. The apparatus further includes a top electrode over the dielectric structure.

Abstract: A semiconductor package includes dies, a redistribution structure, a conductive structure and connectors. The conductive plate is electrically connected to contact pads of at least two dies and is disposed on redistribution structure. The conductive structure includes a conductive plate and a solder cover, and the conductive structure extend over the at least two dies. The connectors are disposed on the redistribution structure, and at least one connector includes a conductive pillar. The conductive plate is at same level height as conductive pillar. The vertical projection of the conductive plate falls on spans of the at least two dies.