Patents by Inventor Wei-Ting Chen

Wei-Ting Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949002
    Abstract: In an embodiment, a method includes: forming a fin extending from a substrate, the fin having a first width and a first height after the forming; forming a dummy gate stack over a channel region of the fin; growing an epitaxial source/drain in the fin adjacent the channel region; and after growing the epitaxial source/drain, replacing the dummy gate stack with a metal gate stack, the channel region of the fin having the first width and the first height before the replacing, the channel region of the fin having a second width and a second height after the replacing, the second width being less than the first width, the second height being less than the first height.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: I-Hsieh Wong, Yen-Ting Chen, Wei-Yang Lee, Feng-Cheng Yang, Yen-Ming Chen
  • Patent number: 11942993
    Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: March 26, 2024
    Assignee: Molex, LLC
    Inventors: Kuen-Ting Tsai, Wei-Hung Chen, Zuon-Min Chuang, Yao-Wen Liang
  • Patent number: 11940597
    Abstract: An image capturing optical lens system includes four lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an object-side surface being convex in a paraxial region thereof. The third lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The fourth lens element has negative refractive power.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: March 26, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuan-Ting Yeh, Wei-Yu Chen
  • Publication number: 20240088033
    Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Kai Chan, Chung-Hao Tsai, Chuei-Tang WANG, Wei-Ting Chen
  • Publication number: 20240088078
    Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Chung-Hao Tsai, Yih Wang, Wei-Ting Chen, Chuei-Tang Wang, Chen-Hua Yu
  • Publication number: 20240079486
    Abstract: A semiconductor structure includes a barrier layer over a channel layer, and a doped layer over the barrier layer. A gate electrode is over the doped layer and a doped interface layer is formed between the barrier layer and the doped layer. The doped interface layer includes a dopant and a metal. The metal has a metal concentration that follows a gradient function from a highest metal concentration to a lowest metal concentration.
    Type: Application
    Filed: March 27, 2023
    Publication date: March 7, 2024
    Inventors: Wei-Ting CHANG, Ching Yu CHEN, Jiang-He XIE
  • Patent number: 11916376
    Abstract: An electrostatic discharge clamp is shown, which includes a clamping circuit, a driving circuit, a capacitor and resistor network, and a bias circuit. The clamping circuit has a plurality of transistors connected in a cascode configuration. The driving circuit is coupled to the gates of the transistors of the clamping circuit. The capacitor and resistor network introduces an RC delay in response to an electrostatic discharge event to control the driving circuit to turn on the transistors of the clamping circuit for electrostatic discharging. The bias circuit biases the driving circuit to turn off the transistors of the clamping circuit when the capacitor and resistor network does not detect the electrostatic discharge event.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: February 27, 2024
    Assignee: MEDIATEK INC.
    Inventors: Jie-Ting Chen, Wei-Lun Sun
  • Patent number: 11916077
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Patent number: 11913472
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Patent number: 11915942
    Abstract: A method of exposing a wafer to a high-tilt angle ion beam and an apparatus for performing the same are disclosed. In an embodiment, a method includes forming a patterned mask layer over a wafer, the patterned mask layer including a patterned mask feature; exposing the wafer to an ion beam, a surface of the wafer being tilted at a tilt angle with respect to the ion beam; and moving the wafer along a scan line with respect to the ion beam, a scan angle being defined between the scan line and an axis perpendicular to an axis of the ion beam, a difference between the tilt angle and the scan angle being less than 50°.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Cheng Chen, Wei-Ting Chien, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20240027009
    Abstract: A quick coupling set includes a socket and a mating plug. The socket has a rotation-restraining structure while the mating plug has a mating rotation-restraining structure. In the coupling of the socket and the mating plug, the rotation-restraining structure of the socket only allow the rotation-restraining structure of the mating plug to relatively rotate in a rotation direction, so as to complete the coupling of the socket and the mating plug. Other plugs which do not match the socket lack of a rotation-restraining structure matching that of the socket, and cannot relatively rotate in the rotation direction with respect to the socket and cannot achieve any coupling with the socket, which results in the socket and the mating plug being protected against misconnection.
    Type: Application
    Filed: November 21, 2022
    Publication date: January 25, 2024
    Applicant: Wistron Corporation
    Inventors: Jui-An Chiu, Hsin-Tzu Chen, Wei-Ting Chen
  • Patent number: 11874713
    Abstract: An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: January 16, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Ting Chen, Tzu-Chien Lai, I-Hsuan Tsai, Chien Chiu, I-Lung Chen, Tsai-Sheng Yang
  • Publication number: 20240007758
    Abstract: A device for immersive capture of streaming video and imaging and a method thereof are disclosed. In the device, a distance parameter is determined based on a detection image captured by a first image capturing unit and having a filming target, rotation angles of the second image capturing units are calculated based on the distance parameter, and unit distances between the second image capturing units and the first image capturing unit, respectively. After the second image capturing units are controlled to rotate based on the rotation angles respectively, a stream combination including the first image stream and the second image streams generated by the first image capturing unit and the second image capturing units in synchronization with each other can be generated, so as to achieve the technical effect of reducing complexity of setting up streaming environment that provides multiple filming angles and reducing trouble for installers.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 4, 2024
    Inventor: Wei-Ting CHEN
  • Publication number: 20240007611
    Abstract: A stereoscopic display device for matching polarized viewing angles and video streams and a stereoscopic display method are disclosed. In the stereoscopic display device, time-synchronized video streams are obtained from the multi-source video stream, and images of the n-th video stream are outputted to the n-th, (M+n)-th, (2M+n)-th . . . display pixel columns of a display module based on a capture angle of the n-th video stream, to make the images of the n-th video stream displayed on the n-th, (M+n)-th, (2M+n)-th . . . display pixel columns of the display module be viewed by a different viewing angle through parallax barriers controlled by the display module. As a result, the effect of displaying 3D video stream on the existing 3D digital photo frame can be to achieved.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 4, 2024
    Inventor: Wei-Ting CHEN
  • Patent number: 11854928
    Abstract: A semiconductor package includes an integrated circuit (IC) structure, an insulating encapsulation laterally covering the IC structure, and a redistribution structure disposed on the insulating encapsulation and the IC structure. The redistribution structure is electrically connected to the IC structure. The IC structure includes a first die, a capacitor structure, a dielectric layer laterally covering the first die and the capacitor structure, and a second die disposed on the dielectric layer, the first die, and the capacitor structure. The second die interacts with the capacitor structure, where a bonding interface between the second die and the first die is substantially coplanar with a bonding interface between the second die and the dielectric layer. A manufacturing method of a semiconductor package is also provided.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Tzu-Chun Tang, Wei-Ting Chen, Chung-Hao Tsai
  • Patent number: 11833642
    Abstract: The invention relates to a power tool with an electrically controlled commutating assembly comprising: an electrically controlled commutating assembly and a control unit; the electrically controlled commutating assembly has an electromagnetic unit; the electromagnetic unit is capable of performing a change in displacement due to electromagnetic action; the control unit has a control member, the control member is capable of changing a working direction of a power tool, and displacement of the electromagnetic unit is capable of actuating the control member of the control unit to make the power tool switch the working direction.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: December 5, 2023
    Assignee: TECHWAY INDUSTRIAL CO., LTD.
    Inventors: Fu-Hsiang Chung, Hong Fang Chen, Wei-Ting Chen, Shih-Wei Hung, Kuo Chou Li
  • Patent number: 11835680
    Abstract: An optical device comprises a first meta-lens and a second meta-lens. The first meta-lens includes a first plurality of nanostructures that define a first phase profile of the first meta-lens. The second meta-lens includes a second plurality of nanostructures that define a second phase profile of the second meta-lens. A combination of the first meta-lens having the first phase profile and the second meta-lens having the second phase profile is configured to achieve a diffraction-limited focusing and correct an aberration of light transmitted through the optical device.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: December 5, 2023
    Assignee: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Benedikt Groever, Wei-Ting Chen, Federico Capasso
  • Patent number: 11790501
    Abstract: A training method for video stabilization and an image processing device using the same are proposed. The method includes the following steps. An input video including low dynamic range (LDR) images is received. The LDR images are converted to high dynamic range (HDR) images by using a first neural network. A feature extraction process is performed to obtain features based on the LDR images and the HDR images. A second neural network for video stabilization is trained according to the LDR images and the HDR images based on a loss function by minimizing a loss value of the loss function to generate stabilized HDR images in a time-dependent manner, where the loss value of the loss function depends upon the features. An HDR classifier is constructed according to the LDR images and the HDR images. The stabilized HDR images are classified by using the HDR classifier to generate a reward value, where the loss value of the loss function further depends upon the reward value.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: October 17, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventors: Jen-Huan Hu, Wei-Ting Chen, Yu-Che Hsiao, Shih-Hsiang Lin, Po-Chin Hu, Yu-Tsung Hu, Pei-Yin Chen
  • Publication number: 20230304626
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Inventors: PEI-CHI CHU, Cheng-Lin HO, CHI-CHIA HUANG, Wei-Ting CHEN
  • Publication number: 20230296204
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a distal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The distal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the distal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the distal clamping plate, and the connecting seat therebetween into a locked condition.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Inventors: PEI-CHI CHU, Cheng-Lin HO, CHI-CHIA HUANG, Wei-Ting CHEN