Patents by Inventor Wei-Ting Chen
Wei-Ting Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11753634Abstract: A method of applying heat to living tissue mainly uses a device for performing heat treatment on at least a portion of the living tissue in high-low-high temperature steps. In high temperature step, the temperature of the at least a portion of the living tissue is heated and kept between 39-46° C., and the heating period is no longer than 30 minutes. In low temperature step, the at least a portion of the living tissue is cooled, and the low temperature period should not be greater than a natural cooling time interval. In addition, the low temperature period must also be shorter than the heating period. Thus, the present invention allows the abnormal cells to be selectively restored or apoptotic without damaging the normal cells.Type: GrantFiled: January 10, 2020Date of Patent: September 12, 2023Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Chih-Yu Chao, Wei-Ting Chen, Chueh-Hsuan Lu, Chih-Hsiung Hsieh, Yu-Yi Kuo, Guan-Bo Lin, Yi-Kun Sun
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Publication number: 20230275142Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure, and the gate stack includes a work function layer and a metal filling over the work function layer. The semiconductor device structure further includes an isolation element over the semiconductor substrate and adjacent to the gate stack. The isolation element is in direct contact with the work function layer and the metal filling.Type: ApplicationFiled: May 5, 2023Publication date: August 31, 2023Inventors: Che-Cheng Chang, Jui-Ping Chuang, Chen-Hsiang Lu, Yu-Cheng Liu, Wei-Ting Chen
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Publication number: 20230248391Abstract: A consumable component of an injecting physiological monitor includes a housing, an injecting module, a physiological monitor, and a carrier. The injecting module is movably assembled on the housing. The physiological monitor is disposed in the housing and located on a movement path of the injecting module. A part of a structure of the physiological monitor is accommodated in a part of a structure of the injecting module. The carrier is disposed in the housing and located on a movement path of the injecting module and the physiological monitor. The carrier and the physiological monitor are separated from each other and located on opposite sides of the housing. The housing and the injecting module are adapted to be assembled to an injector. The injector is adapted to drive the physiological monitor to be assembled to the carrier through the injecting module.Type: ApplicationFiled: December 13, 2022Publication date: August 10, 2023Applicant: COMPAL ELECTRONICS, INC.Inventors: Wei-Ting Chen, Tzu-Chien Lai, I-Hsuan Tsai, Chien Chiu
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Patent number: 11722020Abstract: A stator of a brushless motor has an iron core, a bobbin, and a winding assembly. The iron core has multiple stator poles mounted on an interior annular surface of a core body and spaced apart from each other. The bobbin is mounted on one of two open ends of the core body and has a substrate, at least one neutral connector mounted on an upper surface of the substrate, and at least one neutral solder pad mounted in the at least one neutral connector. The winding assembly is formed by one wire wound on multiple stator poles and the connectors. The winding assembly is electrically connected to the at least one neutral solder pad.Type: GrantFiled: April 26, 2021Date of Patent: August 8, 2023Assignee: Techway Industrial Co., Ltd.Inventors: Fu Hsiang Chung, Hong Fang Chen, Shih Wei Hung, Wei Ting Chen, Yu Chin Lin
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Patent number: 11713843Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.Type: GrantFiled: March 10, 2021Date of Patent: August 1, 2023Assignee: Reliance International Corp.Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen
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Publication number: 20230229213Abstract: An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.Type: ApplicationFiled: August 3, 2022Publication date: July 20, 2023Applicant: COMPAL ELECTRONICS, INC.Inventors: Wei-Ting Chen, Tzu-Chien Lai, I-Hsuan Tsai, Chien Chiu, I-Lung Chen, Tsai-Sheng Yang
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Patent number: 11682716Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure, and the gate stack includes a work function layer and a metal filling over the work function layer. The semiconductor device structure further includes an isolation element over the semiconductor substrate and adjacent to the gate stack. The isolation element is in direct contact with the work function layer and the metal filling.Type: GrantFiled: June 15, 2020Date of Patent: June 20, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Che-Cheng Chang, Jui-Ping Chuang, Chen-Hsiang Lu, Yu-Cheng Liu, Wei-Ting Chen
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Patent number: 11640776Abstract: An arcuate display device, including an arcuate display surface, a plurality of display units, an image source, and a controller, is provided. The display units are configured on the arcuate display surface in an array manner, and each of the display units includes a plurality of pixels. The controller is configured to receive a plurality of pixel signals from the image source to generate a plurality of frame signals respectively corresponding to the display units. Each of the frame signals includes the pixel signals, a plurality of first dummy signals, and a plurality of second dummy signals, in which the pixel signals respectively correspond to the pixels. A sum of an amount of the pixel signals, an amount of the first dummy signals, and an amount of the second dummy signals in each of the frame signals is same. A driving method of the arcuate display device is also provided.Type: GrantFiled: August 25, 2022Date of Patent: May 2, 2023Assignee: AUO CorporationInventors: Yu-Chu Chen, Po Chun Lin, Chun-Hui Huang, Yu-Chi Kang, Yi-Hsiang Hu, Wei-Ting Chen
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Patent number: 11621613Abstract: The present invention relates to an electric motor and an electric tool equipped with the electric motor. The electric motor includes a rotor, a stator, a coil module wound around the stator, a Hall unit and a wiring circuit unit. The Hall unit includes a Hall circuit board disposed around a rotating shaft of the rotor, and a Hall module for sensing rotation of the rotor. The wiring circuit unit is independent of the Hall circuit board and includes a three-phase power source interface. The wiring circuit unit electrically connects coils of the coil module to the power source interfaces respectively by groups. By separately disposing the Hall unit and the wiring circuit unit independently, a volume of the Hall circuit board can be reduced, and an area blocking an airflow path of a heat dissipation unit can be reduced, so heat dissipation effect of the electric motor and the electric tool can be improved.Type: GrantFiled: May 21, 2020Date of Patent: April 4, 2023Assignee: TECHWAY INDUSTRIAL CO., LTD.Inventors: Fu-Hsiang Chung, Hong Fang Chen, Wei-Ting Chen, Wei-Lin Hsu
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Publication number: 20230085821Abstract: Systems, devices, and techniques for performing wavelength division multiplexing or demultiplexing using one or more metamaterials in an optical communications systems are described. An optical device may be configured to shift one or more phase profiles of an optical signal using one or more stages of metamaterials to multiplex or demultiplex wavelengths of optical signals. The optical device may be an example of a stacked design with two or more stages of metamaterials stacked on top of one another. The optical device may be an example of a folded design that reflects optical signals between different stages of metamaterials.Type: ApplicationFiled: January 29, 2021Publication date: March 23, 2023Inventors: Federico Capasso, Wei-Ting Chen, Paulo Clovis Dainese, Jr., Kangmei Li, Ming-Jun Li, Jaewon Oh, Jun Yang
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Publication number: 20230088292Abstract: An optical system, comprising: (i) multiple input optical fibers; (ii) an optical mode multiplexer/demultiplexer coupled to said input optical fibers with, said optical mode multiplexer/demultiplexer comprising a plurality of metamaterial structures having length and forming at least one stage of metamaterials, the at least one stage of metamaterials is being situated on a surface of the optical mode multiplexer/demultiplexer facing the input optical fibers, and the at least one stage of metamaterials is oriented at angles between 60 and 120 degrees relative to the axis of the input fibers; and the metasurfaces are structured to receive a first optical signal having a first mode from at least one of said multiple input optical fibers and convert the first mode to a different mode.Type: ApplicationFiled: January 29, 2021Publication date: March 23, 2023Inventors: Federico Capasso, Wei-Ting Chen, Paulo Clovis Dainese, Jr., Kangmei Li, Ming-Jun Li, Jaewon Oh, Jun Yang
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Patent number: 11600431Abstract: A structure includes an encapsulating material, and a coil including a through-conductor. The through-conductor is in the encapsulating material, with a top surface of the through-conductor coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor coplanar with a bottom surface of the encapsulating material. A metal plate is underlying the encapsulating material. A slot is in the metal plate and filled with a dielectric material. The slot has a portion overlapped by the coil.Type: GrantFiled: November 9, 2020Date of Patent: March 7, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo, Chen-Hua Yu
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Publication number: 20230062136Abstract: A semiconductor package includes an integrated circuit (IC) structure, an insulating encapsulation laterally covering the IC structure, and a redistribution structure disposed on the insulating encapsulation and the IC structure. The redistribution structure is electrically connected to the IC structure. The IC structure includes a first die, a capacitor structure, a dielectric layer laterally covering the first die and the capacitor structure, and a second die disposed on the dielectric layer, the first die, and the capacitor structure. The second die interacts with the capacitor structure, where a bonding interface between the second die and the first die is substantially coplanar with a bonding interface between the second die and the dielectric layer. A manufacturing method of a semiconductor package is also provided.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Tzu-Chun Tang, Wei-Ting Chen, Chung-Hao Tsai
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Publication number: 20230054228Abstract: Systems, devices, and techniques for performing wavelength division multiplexing or demultiplexing using one or more metamaterials in an optical communications systems are described. An optical device may be configured to shift one or more phase profiles of an optical signal using one or more stages of metamaterials to multiplex or demultiplex wavelengths of optical signals. The optical device may be an example of a stacked design with two or more stages of metamaterials stacked on top of one another. The optical device may be an example of a folded design that reflects optical signals between different stages of metamaterials.Type: ApplicationFiled: January 29, 2021Publication date: February 23, 2023Inventors: Federico Capasso, Wei-Ting Chen, Paulo Clovis Dainese, JR., Kangmei Li, Ming-Jun Li, Jaewon Oh, Jun Yang
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Patent number: 11551648Abstract: A saxophone has a body tube, a high-F #structure, and a side-Bb structure. The body tube has a high-F #tone hole and a side-Bb hole. The high-F #structure opens or closes the high-F #tone hole. The side-Bb structure has a side-Bb tone-hole cover, a side-Bb driving assembly, an auxiliary key, and a main key. The main key is separated from the auxiliary key. The auxiliary key is disposed above a high F #key of the high-F #structure along a vertical line. The auxiliary key and the main key are separately arranged around a centerline of the body tube. The auxiliary key and the main key correspond in height position. Both of the auxiliary key and the main key are connected to the side-Bb driving assembly and drive the side-Bb tone-hole cover to close or open the side-Bb tone hole.Type: GrantFiled: November 29, 2021Date of Patent: January 10, 2023Assignee: Reliance International Corp.Inventors: Sheng-Chieh Yang, Ching-Shyan Yen, Wei-Ting Chen
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Patent number: 11527486Abstract: A semiconductor device includes a first die embedded in a molding material, where contact pads of the first die are proximate a first side of the molding material. The semiconductor device further includes a redistribution structure over the first side of the molding material, a first metal coating along sidewalls of the first die and between the first die and the molding material, and a second metal coating along sidewalls of the molding material and on a second side of the molding material opposing the first side.Type: GrantFiled: December 14, 2020Date of Patent: December 13, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen, Chieh-Yen Chen
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Publication number: 20220388131Abstract: The invention relates to a power tool that can be held with one hand for reversing, comprising: a casing having a grip part and a manipulation port; a driving device having a control member; the control member is capable of controlling an actuation direction of the driving device; a power source disposed below the driving device and capable of driving the driving device; a reversing assembly disposed at a periphery of the power source and having a reversing member; the reversing member controls the control member to generate changes of displacement, a driving direction of the driving device is changed by action of turning the reversing assembly that is away from the driving device, and there is an appropriate manipulating distance between the grip part and the manipulation port, so that a user is capable of manipulating by holding and reversing the power tool with one hand at a same position.Type: ApplicationFiled: May 27, 2022Publication date: December 8, 2022Inventors: Fu-Hsiang CHUNG, Wei-Ting CHEN, Zong Hua LI, Kai Chien YANG
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Publication number: 20220384332Abstract: A semiconductor structure including at least one integrated circuit component is provided. The at least one integrated circuit component includes a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate includes at least one first embedded capacitor.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Ting Chen, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang
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Patent number: 11456251Abstract: A semiconductor structure including at least one integrated circuit component is provided. The at least one integrated circuit component includes a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate includes at least one first embedded capacitor.Type: GrantFiled: September 25, 2020Date of Patent: September 27, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Ting Chen, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang
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Publication number: 20220290799Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.Type: ApplicationFiled: March 10, 2021Publication date: September 15, 2022Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen