Patents by Inventor Wei Wu

Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250120251
    Abstract: A light emitting diode, a display substrate and a display device. In the light emitting diode, the first light emitting structure includes a first hole transport layer, a first light emitting layer and a first electron transport layer; the second light emitting structure includes a second hole transport layer and a second light emitting layer, an absolute value of a first energy level difference between a LUMO energy level of the first light emitting layer and a LUMO energy level of the first electron transport layer is less than an absolute value of a second energy level difference between a HOMO energy level of the second light emitting layer and a HOMO energy level of the second hole transport layer.
    Type: Application
    Filed: November 30, 2022
    Publication date: April 10, 2025
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Changyen WU, Juanjuan YOU, Wei QUAN, Cheng XU, Dandan ZHOU
  • Publication number: 20250118607
    Abstract: The present disclosure has a substrate for power semiconductor packaging and a package containing such a substrate. The substrate includes: a first metal layer for contacting with a semiconductor device, a second metal layer for contacting with a heat dissipation device, an electrical insulation layer disposed between the first metal layer and the second metal layer, and a first graphene bulk layer disposed between the electrical insulation layer and the first metal layer, a first surface of the first graphene bulk layer is in contact with a first surface of the first metal layer, and a second surface of the first graphene bulk layer opposite to the first surface is in contact with a first surface of the electrical insulation layer. Compared to the conventional substrate, the novel substrate of the present disclosure exhibits much lower thermal resistance, higher mechanical strength, and enhanced corrosion resistance.
    Type: Application
    Filed: October 7, 2024
    Publication date: April 10, 2025
    Applicants: Nexperia Technology (Shanghai) Ltd., NEXPERIA B.V.
    Inventors: Wei Gong, Xiangshui Wu, Song Cui, Chunlin Zhu, Ke Jiang
  • Publication number: 20250118862
    Abstract: A cell for use in an electrochemical cell, that includes a positive electrode, a negative electrode, an electrolyte, and a separator in the form of a zeolite-based material comprising one or more naturally occurring or synthetically synthesized zeolites applied directly to at least one of the positive electrode and the negative electrode. The positive electrode configured so that non-reactive metal ions are reversibly extracted there from and inserted therein. The negative electrode configured to reversibly accept and release the non-reactive metal ions. The electrolyte positioned between and in contact with the negative electrode and the positive electrode, such that the electrolyte supports a reversible flow of the non-reactive metal ions between the positive electrode and the negative electrode. The separator being configured to electrically isolate the positive electrode from the negative electrode, while being permeable to the reversible flow of the non-reactive metal ions there through.
    Type: Application
    Filed: September 28, 2022
    Publication date: April 10, 2025
    Inventors: Bing Tan, Wei Wu, David Shepard, Ashwin Sankaran, Yunkui Li
  • Publication number: 20250118594
    Abstract: The semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a first dielectric layer, a first metal layer, a second metal layer, a first etching stop layer, a second etching stop layer, a second dielectric layer, a first via and a second via. The first metal layer and the second metal are embedded in the first dielectric layer. The first etching stop layer is disposed on the first dielectric layer. The second etching stop layer is disposed on the first etching stop layer. The second dielectric layer is disposed on the second etching stop layer. The first via and the second via are embedded in the second dielectric layer. A width of the second etching stop layer is smaller a width of the first etching stop layer.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 10, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Wei SU, Hsin-Ping CHEN, Yung-Hsu WU, Li-Ling SU, Chan-Yu LIAO, Shao-Kuan LEE, Ting-Ya LO, Hsin-Yen HUANG, Hsiao-Kang CHANG
  • Publication number: 20250119825
    Abstract: Apparatus, methods, and computer-readable media for facilitating determining or predicting a communication state of a UE based on, for example, measurements performed at the UE are disclosed herein. The communication state of the UE, such as an HST state or a non-HST state, may also be associated with a mobility state, such as stationary or moving. The UE may communicate based on the communication state. An example method for wireless communication at a UE includes establishing a connection with a network node. The example method also includes measuring one or more signals received from the network node over a time period. The example method also includes communicating with the network node based on a communication state of the UE, the communication state of the UE based at least in part on a history of measurements performed on the one or more signals received over the time period.
    Type: Application
    Filed: March 29, 2022
    Publication date: April 10, 2025
    Inventors: Jie MAO, Hong YU, Wei LI, Nanrun WU, Jie ZHU, Xinyu WANG, Tom CHIN
  • Publication number: 20250118598
    Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a first dielectric layer, a first conductive feature, a second dielectric layer, and a barrier layer. The first conductive feature is disposed on the first dielectric layer, the second dielectric layer is disposed on the first dielectric layer and surrounds the sidewalls of the first conductive feature, the barrier layer is disposed between the first dielectric layer and the second dielectric layer and between the sidewalls of the first conductive feature and the second dielectric layer.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 10, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Shao-Kuan LEE, Kuang-Wei YANG, Gary HSU WEI LIU, Yen-Ju WU, Jing-Ting SU, Hsin-Yen HUANG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
  • Publication number: 20250118402
    Abstract: A generation method and generation apparatus of a medical report are provided. In the method, the writing style is analyzed from multiple historical texts, where the writing style includes multiple common words in the historical text and the contextual relationships that connect those common words; the medical data is converted into draft text that conforms to the template text, where the template text is a report that conforms to a preset style; and by using the draft text and writing style as input data of the language model, an output report that conforms to the writing style is generated, where the language model selects sentences that conform to the writing style.
    Type: Application
    Filed: October 25, 2023
    Publication date: April 10, 2025
    Applicant: Wistron Medical Technology Corporation
    Inventors: Han Chun Kuo, Shih Feng Huang, Chih Yi Chien, Chun Chun Tsai, Shao Wei Wu, Yu Fen Lin
  • Patent number: 12272568
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: April 8, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
  • Patent number: 12273108
    Abstract: The invention introduces an apparatus and a method for expanding round keys during data encryption. The method includes: configuring a word-processing circuitry to operate in a first mode to calculate a first intermediate calculation result corresponding to an even-number round key according to a last double word of a 0th double word to a 7th double word in each even-number clock cycle starting from a 2nd clock cycle; and configuring the word-processing circuitry to operate in a second mode to calculate a second intermediate calculation result corresponding to an odd-number round key according to the last double word of the 0th double word to the 7th double word in each odd-number clock cycle starting from a 3rd clock cycle. In the first mode, a first data path is formed in the word-processing circuitry, which includes a word split circuitry, a rotate-word circuitry, a substitute-word circuitry, a round-constant circuitry and a word concatenation circuitry.
    Type: Grant
    Filed: May 4, 2023
    Date of Patent: April 8, 2025
    Assignee: SILICON MOTION, INC.
    Inventors: Wun-Jhe Wu, Po-Hung Chen, Chiao-Wen Cheng, Jiun-Hung Yu, Chih-Wei Liu
  • Patent number: 12271207
    Abstract: A method for controlling a plurality of autonomous robots for performing environment maintenance operations includes: generating a setup command that indicates a selected location, a plurality of selected robots, an available time slot, and a distribution mode signal that indicates whether the selected robots are to be controlled based on the available time slot or an inputted priority section; and generating a plurality of sub-routes based on different parameters, depending on the distribution mode signal. The sub-routes are generated to be connected into an unbroken trail. Then, the sub-routes are transmitted to the selected robots, respectively, so as to control each of the selected robots to move along the respective one of the sub-routes.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: April 8, 2025
    Assignee: URSrobot AI Inc.
    Inventors: Chien-Tung Chen, Chung-Hou Wu, Chao-Cheng Chen, Wen-Wei Chiang, Yi-Jin Lin
  • Patent number: 12270022
    Abstract: Provided is a Pichia pastoris mutant strain for expressing an exogenous gene. Specifically, provided is a Pichia pastoris mutant strain comprising, with respect to Pichia pastoris mutant strain GS115 or CICC32806, one or more of the following six mutations: BQ9382_C1-2260, EKK deletions at positions 308-310, a hypothetical protein; BQ9382_C1-3800, E129K, 60S ribosomal subunit assembly/exported protein LOC1; BQ9382_C1-5700, 1312M, mitochondrial external NADH dehydrogenase, type II NAD(P)H: quinone oxidoreductase; BQ9382_C2-3950, Q145X, an essential protein having a binding partner Psr1p and used for completely activating a general stress response; BQ9382_C3-2220, E188K, a hypothetical protein; and BQ9382_C3-4370, W196X, orotidine 5\?-phosphate decarboxylase. The provided Pichia pastoris mutant strain is an effective commonly employed host for exogenous expression, and can efficiently express different proteins, especially phospholipase and lipase.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: April 8, 2025
    Assignee: WILMAR (SHANGHAI) BIOTECHNOLOGY RESEARCH & DEVELOPMENT CENTER CO., LTD.
    Inventors: Wei Wu, Xiaojun Dai, Haisheng Cao, Meifeng Zhou, Qiwen Niu
  • Patent number: 12273741
    Abstract: Methods and apparatus are provided for a UE to determine a UL spatial relation for an UL transmission in response to an unknown UL spatial relation switch. The UE may determine whether the UL spatial relation is based on an SRS transmission in UL, a CSI-RS in DL, or an SSB in the DL. If the UL spatial relation is based on the SRS transmission, the UE may select the UL spatial relation for the UL transmission corresponding to a Tx beam of the SRS transmission. If the UL spatial relation is based on the CSI-RS or the SSB, the UE may select the UL spatial relation for the UL transmission based on whether the unknown UL spatial relation switch is due to a corresponding resource for beam training not being configured by a communication network or a corresponding beam information being expired.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: April 8, 2025
    Assignee: APPLE INC.
    Inventors: Jie Cui, Yang Tang, Dawei Zhang, Hong He, Chunhai Yao, Chunxuan Ye, Haitong Sun, Weidong Yang, Wei Zeng, Yuchul Kim, Yushu Zhang, Zhibin Wu, Oghenekome Oteri
  • Patent number: 12272679
    Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a circuit substrate and a plurality of micro light-emitting diode structures. The micro light-emitting diode structures each include a micro light-emitting chip and a molding structure. The micro light-emitting chip is electrically bonded to the circuit substrate, and includes a first surface, a second surface, and a peripheral surface. The first surface is located on a side of the micro light-emitting chip facing the circuit substrate. The second surface is disposed opposite to the first surface. The peripheral surface connects the first surface and the second surface. The molding structure surrounds the peripheral surface and encloses the second surface of the micro light-emitting chip. The molding structure extends in a direction away from the circuit substrate and forms an inner side wall. The inner side wall and the second surface constitute an accommodating portion.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: April 8, 2025
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Shiang-Ning Yang, Sheng-Yuan Sun, Loganathan Murugan, Yu-Yun Lo, Bo-Wei Wu
  • Patent number: 12272551
    Abstract: Embodiments of the disclosure relate to methods for selectively removing metal material from the top surface and sidewalls of a feature. The metal material which is covered by a flowable polymer material remains unaffected. In some embodiments, the metal material is formed by physical vapor deposition resulting in a relatively thin sidewall thickness. Any metal material remaining on the sidewall after removal of the metal material from the top surface may be etched by an additional etch process. The resulting metal layer at the bottom of the feature facilitates selective metal gapfill of the feature.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: April 8, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Liqi Wu, Feng Q. Liu, Bhaskar Jyoti Bhuyan, James Hugh Connolly, Zhimin Qi, Jie Zhang, Wei Dou, Aixi Zhang, Mark Saly, Jiang Lu, Rongjun Wang, David Thompson, Xianmin Tang
  • Patent number: 12270851
    Abstract: A switch short-circuited diagnosis method includes steps of: determining an initial voltage interval of multiple voltage intervals according to voltage relationships between voltages of a first phase wire, a second phase wire, and a third phase wire; performing a switch short-circuited diagnosis of a first bidirectional switch module in the three consecutive voltage intervals from the initial voltage interval, and including steps of: turning on a first switch branch, a second switch branch, or a third switch branch of the first bidirectional switch module according to the voltage relationships between the voltages of the first, second and third phase wires, determining whether an overcurrent occurs to diagnose whether the first switch branch, the second switch branch, or the third switch branch of the first bidirectional switch module is in a short-circuited state, and performing the switch short-circuited diagnosis for the next voltage interval.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: April 8, 2025
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Kai-Wei Hu, Ping-Heng Wu, Lei-Chung Hsing
  • Patent number: 12272958
    Abstract: The present invention relates to the technical field of power generation of power systems, and in particular to a power supply and energy storage system using carbon as a medium. The power supply and energy storage system generates energy by reacting carbon dioxide and air, collects carbon monoxide by providing a pressurizing apparatus and a gas storage apparatus, and sends the collected carbon monoxide back to an energy supply apparatus during power consumption peaks, thereby balancing power deficits of loads and renewable energy power generation, considering the stability, reliability, and economic efficiency of the power supply and energy storage system, and improving energy utilization efficiency.
    Type: Grant
    Filed: May 9, 2024
    Date of Patent: April 8, 2025
    Assignees: Ningbo Electric Power Design Institute Co. Ltd, Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, Ningbo Yongyao Power Investment Corporation Co., Ltd
    Inventors: Yan Yao, Wanbing Guan, Zixiang Pei, Junhua Wang, Puyan Wang, Yuzhe Xie, Xuanjun Chen, Yuting Liu, Jun Wu, Wei Xue, Tianchen Fan
  • Publication number: 20250109148
    Abstract: It relates generally to GLP-1 agonists and pharmaceutical compositions comprising the same, as well as methods for treating a GLP-1 associated disease, disorder, or condition.
    Type: Application
    Filed: January 20, 2023
    Publication date: April 3, 2025
    Inventors: Wei HUANG, Hui LEI, Qinghua MENG, Fan WU, Weiqiang XING, Haizhen ZHANG
  • Publication number: 20250111250
    Abstract: A method includes extracting, by an analysis computer, a plurality of first datasets from a plurality of graph snapshots using a structural self-attention module. The analysis computer can then extract at least a second dataset from the plurality of first datasets using a temporal self-attention module across the plurality of graph snapshots. The analysis computer can then perform graph context prediction with at least the second dataset.
    Type: Application
    Filed: December 11, 2024
    Publication date: April 3, 2025
    Applicant: Visa International Service Association
    Inventors: Aravind Sankar, Yanhong Wu, Liang Gou, Wei Zhang, Hao Yang
  • Publication number: 20250107721
    Abstract: A pulse pressure measuring apparatus including a plurality of pressing elements, a plurality of pressure sensors, and a processing unit is provided. The pressing elements are used to press the site to be measured, and each pressing element has a position coordinate Pi (i=1, 2, 3 . . . ). The pressure sensors are configured to respectively measure pressure on the pressing elements to generate measured values of pressure intensity Ii (i=1, 2, 3 . . . ) at the position coordinates Pi (i=1, 2, 3 . . . ). The processing unit utilizes the position coordinates Pi (i=1, 2, 3 . . . ) and the measured values of pressure intensity Ii (i=1, 2, 3 . . . ) to determine the blood vessel locus.
    Type: Application
    Filed: March 28, 2024
    Publication date: April 3, 2025
    Applicant: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
    Inventors: Chih-Ju Lin, Shih-Chieh Yen, Yi-Wei Liu, Wei-Han Wu
  • Publication number: 20250112359
    Abstract: An antenna apparatus includes a first radiating patch with slots and a feed module. There are a plurality of feed modules in correspondence with the slots. The feed module includes a ground component and a feed component. The ground component includes a first conductor patch, a second conductor patch, and a conductor column. The feed component includes a second radiating patch and a first feed member, the second radiating patch and the second conductor patch are spaced from each other. When the foregoing structure is used, integration of an antenna radio frequency system can be improved.
    Type: Application
    Filed: December 11, 2024
    Publication date: April 3, 2025
    Applicants: HUAWEI TECHNOLOGIES CO., LTD., Research Institute of Millimeter Wave and Terahertz Technology
    Inventors: Xiaoyue Xia, Wei Hong, Fan Wu, Chao Yu, Zhihao Jiang, Yu Yao