Abstract: An embodiment method includes: mapping a to-be-transmitted optical channel unit signal of n times a benchmark rate to X first optical channel physical link signals; adding a link sequence indicator overhead to each of the X first optical channel physical link signals, to generate X second optical channel physical link signals; and modulating and sending the X second optical channel physical link signals by using X preset optical modules in a one-to-one manner. A rate of the first optical channel physical link signal is mi times the benchmark rate, n?2, X?2, mi?1, and ? i = 1 X m i = n .

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

Abstract: The invention relates to the technical field of radar detection, in particular to a device for real-time detection of spectrum from airborne hyperspectral imaging LiDAR and method thereof. The device comprises a laser and a reference module; the reference module comprises a first reflecting mirror and a second reflecting mirror with a given transmittance; the first reflecting mirror and the second reflecting mirror are arranged with a focusing mirror and an optical fiber in sequence therebetween. The laser emits a laser light to the first reflecting mirror with a given transmittance, and the beam of the laser light transmitted through the first reflecting mirror after passing the focusing mirror is used as the reference beam after passing the optical fiber. The invention enables detection of the spectral line of each pulse and improves the precision of reflection spectrum of the ground object measured by the system.

Abstract: The present application relates to the field of semiconductor manufacturing technologies, and in particular to a method and an apparatus for automatically processing wafers. The method for automatically processing the wafers includes the following steps: providing several wafers, wherein the wafers operate on a primary path, and the primary path is a path for forming semiconductor structures on the surfaces of the wafers; determining whether there is a need for detecting defects of the wafers, and if yes, automatically switching an operating path of the wafers to a secondary path; detecting the defects of the wafers in the secondary path; and determining whether the defect detection on the wafers is finished, and if yes, automatically switching the operating path of the wafers to the primary path. The application makes it possible to automatically detect the defects of the wafers with different SWR conditions, thereby improving the automation degree of machines.

Abstract: This application provides a communication method and apparatus. According to the method, a first terminal apparatus can determine, based on second information, information that is in first demodulation information and second demodulation information and that is used to demodulate a first data stream, and determine information that is used to demodulate a second data stream. The first data stream is a common stream, and the second data stream is a private stream of the first terminal apparatus. The first terminal apparatus may first demodulate, based on the information that is used to demodulate the first data stream, a signal received by the first terminal apparatus on a first resource, to obtain the first data stream, and then may obtain the second data stream based on the first data stream, the information that is used to demodulate the second data stream, and the signal received on the first resource.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: An electric drive system is actively controlled while an electrified vehicle is being towed. The inverter switches are manipulated to preclude exceeding a maximum voltage of a DC bus and also to preclude exceeding a maximum phase current magnitude. During a transition from an inverter off state to a short-circuit state, field-oriented control is utilized.

Abstract: The present disclosure provides a video generation method, an apparatus, a system, a device and a storage medium. The method is applied to a video generation system, and the video generation system includes a first client and at least one second client. Specifically, the method includes: firstly, the first client creates a first virtual room and sets a target capturing effect for the first virtual room; then, the second client acquires a first video added with the target capturing effect after receiving a notification message that a current user has successfully joined the first virtual room, and uploads the first video to the first virtual room. Further, the first client acquires a target video from the first virtual room and generates a target result video based on the target video, and the target video includes the first video.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: Methods, systems, and devices for wireless communications are described. In some systems, a wireless device may In use non-uniformly distributed bits for amplitude mapping and uniformly distributed bits for sign mapping to support probabilistic constellation shaping (PCS) for transmission of a message. To provide a coding gain with one or more retransmissions of the message, the device may configure redundancy versions based on the non-uniform distribution of one or more symbols. In some examples, the device may include the same set of non-uniformly distributed systematic bits or at least a portion of non-uniformly distributed systematic bits in each redundancy version of the message. Additionally or alternatively, the device may use multiple modulation and coding scheme (MCS) values to modulate one or more of the redundancy versions, where a first MCS value is used to modulate non-uniformly distributed symbols and a second MCS value is used to modulate uniformly distributed symbols.

Abstract: A memory device, a failure bits detector, and a failure bits detection method thereof are provided. The failure bits detector includes a current generator, a current mirror, and a comparator. The current generator generates a first current according to a reference code. The current mirror mirrors the first current to generate a second current at a second end of the current mirror. The comparator compares a first voltage at a first input end with a second voltage at a second input end to generate a detection result.

Abstract: An electrical propulsion system for a vertical take-off and landing (VTOL) aircraft comprises an electrical motor assembly and an inverter assembly. The inverter assembly comprises a housing, a capacitor assembly, at least one printed circuit board assembly (PCBA), and a plurality of positioning pins. The capacitor assembly comprises a center hole, at least one capacitor, a capacitor housing having at least one busbar, and a plurality of through holes in the capacitor housing. The capacitor assembly and the at least one PCBA are positioned inside the housing. The plurality of positioning pins pass through the through the plurality of through holes of the capacitor housing and the at least one PCBA and are connected to the housing.

Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.

Abstract: Provided are a signal processing method based on a many-core chip, an electronic device and a medium. The method includes: determining, according to a time domain signal to be processed and a time-frequency transform type of the time domain signal, a transform kernel matrix of the time domain signal; mapping the transform kernel matrix to a plurality of processing cores of the many-core chip; and mapping the time domain signal to the plurality of processing cores so that the plurality of processing cores determine, according to the transform kernel matrix and the time domain signal, a frequency domain signal corresponding to the time domain signal.

Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different surface areas is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: A group III-N based semiconductor 3D integrated circuit that directly stacks a thin-film transistor on a group III-N based transistor is provided. Since the group III-N based semiconductor 3D integrated circuit integrates the group III-N based transistor and the thin-film transistor without performing a packaging process, the group III-N based semiconductor 3D integrated circuit can reduce the packaging cost and have better circuit performance and reliability.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: An electrical propulsion system includes an electrical motor configured to drive one or more propellers of the aircraft, a capacitor configured to stabilize a direct current (DC) bus voltage, a first inverter circuit coupled to the capacitor and configured to convert the DC bus voltage to alternate current (AC) voltages to drive a first set of stator windings of the electrical motor, in response to a first pulse width modulation (PWM) vector, and a second inverter circuit coupled to the capacitor and configured to convert the DC bus voltage to AC voltages to drive a second set of stator windings of the electrical motor, in response to a second PWM vector. The first PWM vector and the second PWM vector are substantially equal and opposite vectors.