Patents by Inventor Wei Wu

Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137873
    Abstract: Methods, systems, and devices for power backoff techniques for modulation schemes are described. A user equipment (UE) may receive an indication of a constellation distribution parameter and a modulation scheme to be used by the UE for an uplink message on an uplink channel. The UE may determine an uplink transmission power based at least in part on the indicated constellation distribution parameter and the indicated modulation scheme. The UE may transmit the uplink message using the indicated modulation scheme according to the determined uplink transmission power. In some examples, the UE may transmit a report indicating a power headroom parameter and an output power parameter based at least in part on the constellation distribution parameter.
    Type: Application
    Filed: March 9, 2021
    Publication date: April 25, 2024
    Inventors: Kexin XIAO, Liangming WU, Changlong XU, Kangqi LIU, Hao XU, Jian LI, Ruiming ZHENG, Wei LIU
  • Publication number: 20240137253
    Abstract: Wireless communications systems and methods related to an efficient arithmetic coding based multiple composition distribution matcher (MCDM) are provided. A wireless communication device selects, based on a first value representing a sequence of bits, a first composition from a plurality of compositions. Each composition of the plurality of compositions includes a different modulation symbol distribution associated with a modulation scheme. The wireless communication device encodes, based on the first composition, the sequence of bits into a sequence of symbols using arithmetic coding. The wireless communication device transmits a communication signal including the sequence of symbols.
    Type: Application
    Filed: April 27, 2021
    Publication date: April 25, 2024
    Inventors: Liangming WU, Kexin XIAO, Thomas Joseph RICHARDSON, Changlong XU, Ori SHENTAL, Kangqi LIU, Wei LIU, Hao XU
  • Publication number: 20240136293
    Abstract: Provided are a package structure having a joint structure and a method of forming the same. The package structure includes: a first under bump metallurgy (UBM) structure disposed on a first dielectric layer, wherein the first UBM structure at least comprises: a barrier layer embedded in the first dielectric layer; and an upper metal layer disposed over the barrier layer, wherein a sidewall of the barrier layer is laterally offset outward from a sidewall of the upper metal layer, and a portion of a top surface of the barrier layer is exposed by the first dielectric layer; and a solder layer disposed on the first UBM structure and contacting the upper metal layer.
    Type: Application
    Filed: January 31, 2023
    Publication date: April 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Wen-Chih Chiou, Ying-Ching Shih
  • Patent number: 11964881
    Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 23, 2024
    Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Pu-Wei Wu, Yi-Chieh Hsieh, Han-Yi Wang, Kuang-Chih Tso, Tzu-Ying Chan, Chung-Kai Chang, Chi-Shih Chen, Yu-Ting Cheng
  • Patent number: 11966516
    Abstract: Methods and systems for gesture-based control of a device are described. A virtual gesture-space is determined in a received input frame. The virtual gesture-space is associated with a primary user from a ranked user list of users. The received input frame is processed in only the virtual gesture-space, to detect and track a hand. Using a hand bounding box generated by detecting and tracking the hand, gesture classification is performed to determine a gesture input associated with the hand. A command input associated with the determined gesture input is processed. The device may be a smart television, a smart phone, a tablet, etc.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: April 23, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Juwei Lu, Sayem Mohammad Siam, Wei Zhou, Peng Dai, Xiaofei Wu, Songcen Xu
  • Patent number: 11967357
    Abstract: A memory unit with time domain edge delay accumulation for computing-in-memory applications is controlled by a first word line and a second word line. The memory unit includes at least one memory cell, at least one edge-delay cell multiplexor and at least one edge-delay cell. The at least one edge-delay cell includes a weight reader and a driver. The weight reader is configured to receive a weight and a multi-bit analog input voltage and generate a multi-bit voltage according to the weight and the multi-bit analog input voltage. The driver is connected to the weight reader and configured to receive an edge-input signal. The driver is configured to generate an edge-output signal having a delay time according to the edge-input signal and the multi-bit voltage. The delay time of the edge-output signal is positively correlated with the multi-bit analog input voltage multiplied by the weight.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: April 23, 2024
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Meng-Fan Chang, Ping-Chun Wu, Li-Yang Hong, Jin-Sheng Ren, Jian-Wei Su
  • Patent number: 11967596
    Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
  • Patent number: 11968817
    Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
  • Patent number: 11965702
    Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: April 23, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Chun-Li Hsiung, Kuo-Wei Lee, Chien-Cheng Wu, Chun-Lung Wu
  • Patent number: 11967992
    Abstract: A data transmission method in an optical transport network includes: mapping first-type service data to a payload block at a specific location in a plurality of consecutive payload blocks, where the plurality of consecutive payload blocks occupy a payload area of an optical data unit (ODU) frame; mapping second-type service data to a payload block at any location in the plurality of consecutive payload blocks other than the at least one specific location; mapping the ODU frame to an optical transport unit (OTU) frame or a flexible OTN (FlexO) frame; and sending the OTU frame or the FlexO frame. In an applicable scenario, service data is transmitted in a hybrid manner.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: April 23, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wei Su, Qiuyou Wu
  • Patent number: 11967560
    Abstract: An integrated circuit includes conductive rails that are disposed in a first conductive layer and separated from each other in a layout view, signal rails disposed in a second conductive layer different from the first conductive layer, at least one first via coupling a first signal rail of the signal rails to at least one of the conductive rails, and at least one first conductive segment. The first signal rail transmits a supply signal through the at least one first via and the at least one of the conductive rails to at least one element of the integrated circuit. The at least one first via and the at least one first conductive segment are disposed above first conductive layer. The at least one first conductive segment is coupled to the at least one of the conductive rails and is separate from the first signal rail.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Wei Peng, Chia-Tien Wu, Jiann-Tyng Tzeng
  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20240124241
    Abstract: A transporting device can transport at least one product, the transporting device includes a mounting frame, a driving mechanism, a transmitting mechanism including a plurality of bent portions, a plurality of guiding mechanisms, and a supporting mechanism. Each guiding mechanism includes a rotating wheel and a guiding plate. Each bent portion is connected to the rotating wheel. The guiding plate is connected to the rotating wheel. The supporting mechanism can support the product. The driving mechanism is further connected to the rotating wheel and can drive the transmitting mechanism to rotate to drive the supporting mechanism to move. The driving mechanism is further connected to the guiding plate, the guiding plate and the rotating wheel can synchronously rotate to drive the supporting mechanism to pass through the bent portions. The present disclosure further provides a heating device.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Huan ZHANG, Qi KUANG, Hua WAN, Yi LIU, Wei-Wei WU, Jing-Chao YANG, Wen-Jin XIA
  • Publication number: 20240125229
    Abstract: A method and non-transitory storage computer-readable medium for performing a neural operator on one or more wellbore measurements. The method may comprise o obtaining one or more measurements, performing a measurement normalization on the one or more measurements to form one or more normalized measurements, forming a material function with the one or more normalized measurements, and forming a neural operator generated physical response with a neural operator and the material function. The method may further comprise forming a beamforming map with the one or more measurements, and forming a neural operator leak source location map with a neural operator and the one or more measurements.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Applicant: Halliburton Energy Services, Inc.
    Inventors: Xusong Wang, Ahmed Fouda, Xiang Wu, Christopher Michael Jones, Wei Zhang, Junwen Dai
  • Publication number: 20240124298
    Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 18, 2024
    Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Publication number: 20240125234
    Abstract: The present invention relates to the technical field of mine fire prevention and extinguishing, in particular to a liquid nitrogen direct injection and low-temperature foaming intelligent filling system based on mine fire area characteristics and an application method, comprising a liquid nitrogen storage tank, a liquid nitrogen direct injection system and a low-temperature foaming system, wherein the liquid nitrogen storage tank communicates with a liquid nitrogen pressurizing device through a main pipeline; a temperature control unit is arranged on the main pipeline; and the liquid nitrogen pressurizing device is connected with the liquid nitrogen direct injection system and the low-temperature foaming system, respectively, liquid nitrogen is directly injected into a foam liquid, to prepare a low-temperature foam type fire preventing and extinguishing material by means of forced convection, membrane boiling, explosion boiling and nucleate boiling between the liquid nitrogen and water.
    Type: Application
    Filed: December 7, 2023
    Publication date: April 18, 2024
    Inventors: Xiangming HU, Di XUE, Yong ZHOU, Kuibin WU, Wei WANG, Lin ZHU, Peng LI, Xiangdong YAO, Weidong WANG, Wenqi SHAO, Chuncheng CAI, Fusheng WANG, Liwen GUO
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Publication number: 20240122669
    Abstract: An ear canal clamp for small animals includes a base and a clamping mechanism. The clamping mechanism includes two clamping arms movably mounted on the base, a biasing member mounted on the base and constrained between the clamping arms, and two ear canal positioning members mounted respectively to the clamping arms and facing each other. The clamping arms are configured to move toward each other and compress the biasing member to increase the distance between the ear canal positioning members. A biasing force generated by the biasing member when compressed is used to push the clamping arms to move oppositely with respect to each other.
    Type: Application
    Filed: January 11, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei PENG, Chun-Wei WU, Chun-Ying CAI, Yen CHENG