Patents by Inventor Wei Wu

Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071829
    Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming first fin structures and a second fin structures over a substrate, forming a first gate stack and a second gate stack that extend in a first direction across the first fin structures and the second fin structures, respectively, and etching the first gate stack and the second gate stack to form a first trench through the first gate stack and a second trench through the second gate stack. A first dimension of the first trench in the first direction is greater than a second dimension of the second trench in the first direction. The method further includes forming a first gate cutting structure and a second gate cutting structure in the first trench and the second trench, respectively.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Chi-Wei WU, Hsin-Che CHIANG, Jeng-Ya YEH
  • Publication number: 20240071855
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure, a backside dielectric layer, conductive terminals, an electronic device, and an underfill is provided. The semiconductor die laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes redistribution conductive layers and thermal enhancement structures electrically insulated from the redistribution conductive layers, and the thermal enhancement structures are thermally coupled to the semiconductor die. The backside dielectric layer is disposed on the redistribution circuit structure. The conductive terminals penetrate through the backside dielectric layer. The electronic device is disposed over the backside dielectric layer and electrically connected to the redistribution circuit structure through the conductive terminals.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Ying-Ching Shih, Wen-Chih Chiou
  • Publication number: 20240072411
    Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicant: Pegatron Corporation
    Inventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
  • Patent number: 11917772
    Abstract: A power supply with a separable communication module includes a casing with a port; a main board placed in the casing and having a power conversion circuit; a sub-board electrically connected to the power conversion circuit and provided with at least one first connector; and a communication module. The power conversion circuit has at least one electrical connection terminal. A first interface of the first connector faces the port. The communication module includes a first circuit board and a communication circuit disposed on the first circuit board, the first circuit board has an electrical connection part electrically connected to the communication circuit, the electrical connection part has a first state of connecting with the first interface, and a second state of detaching from the first interface.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: February 27, 2024
    Assignee: COTEK ELECTRONIC IND. CO., LTD.
    Inventors: Chun-Wei Wu, Ta-Chang Wei, Chung-Liang Tsai, Shou-Cheng Yeh
  • Patent number: 11916172
    Abstract: An epitaxial structure adapted to a semiconductor pickup element is provided. The semiconductor pickup element has at least one guiding structure and provided with a pickup portion. The epitaxial structure includes a semiconductor layer corresponding to the pickup portion and capable of being picked up by the semiconductor pickup element. The epitaxial structure also includes at least one alignment structure disposed on the semiconductor layer and corresponding to the at least one guiding structure, so that the epitaxial structure and the semiconductor pickup element are positioned relative to each other. The number of the at least one alignment structure matches the number of the at least one guiding structure.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: February 27, 2024
    Assignee: PLAYNITRIDE DISPLAY CO., LTD.
    Inventors: Shiang-Ning Yang, Yi-Min Su, Yu-Yun Lo, Bo-Wei Wu, Tzu-Yu Ting
  • Patent number: 11916271
    Abstract: The present disclosure discloses a stable and high-capacity neutral aqueous redox flow lithium battery based on redox-targeting reaction and belongs to the technical field of flow lithium batteries. The present disclosure solves the technical problem that an existing flow battery can only work at low current density. The flow lithium battery of the present disclosure includes a positive electrode storage tank and a negative electrode storage tank; the positive electrode storage tank is filled with a positive electrolyte; and the negative electrode storage tank is filled with a negative electrolyte. The flow lithium battery is characterized in that the positive electrolyte includes a salt containing [Fe(CN)6]4? and/or [Fe(CN)6]3?, and the positive electrode storage tank is further filled with LFP particles and/or FP particles. The flow lithium battery of the present disclosure has wide application prospects in the field of large-scale energy storage.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: February 27, 2024
    Assignees: HARBIN INSTITUTE OF TECHNOLOGY, CHONGQING RESEARCH INSTITUTE OF HARBIN INSTITUTE OF TECHNOLOGY
    Inventors: Xiaohong Wu, Songtao Lu, Wei Qin, Xin Jia, Yuan Yao, Yang Li
  • Patent number: 11914915
    Abstract: A near eye display system is provided. The near eye display system includes: a frame comprising a main body and two temple arms; at least one near eye sensor mounted on the main body and configured to measure user eye parameters; a first near eye display mounted on the main body and configured to form a first image projected on a first retina of a first eye; a second near eye display mounted on the main body and configured to form a second image projected on a second retina of a second eye; and a processing unit located at least at one of the two temple arms and configured to generate a display control signal based at least on the user eye parameters, wherein the display control signal drives the first near eye display and the second near eye display.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jheng-Hong Jiang, Shing-Huang Wu, Chia-Wei Liu
  • Patent number: 11914788
    Abstract: Methods and systems for gesture-based control of a device are described. A virtual gesture-space is determined in a received input frame. The virtual gesture-space is associated with a primary user from a ranked user list of users. The received input frame is processed in only the virtual gesture-space, to detect and track a hand. Using a hand bounding box generated by detecting and tracking the hand, gesture classification is performed to determine a gesture input associated with the hand. A command input associated with the determined gesture input is processed. The device may be a smart television, a smart phone, a tablet, etc.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: February 27, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Juwei Lu, Sayem Mohammad Siam, Wei Zhou, Peng Dai, Xiaofei Wu, Songcen Xu
  • Patent number: 11913512
    Abstract: A vibration suppression method for a servo motor and a load multistage drive system is provided. For a number N of fixed vibration frequencies and one vibration frequency varying with a load position existing in a multistage drive mechanism, a number of N+1 vibration suppression filters are adopted, and each filter is configured to eliminate a corresponding vibration frequency. Fixed vibration frequencies and a vibration frequency varying with a load position in a multistage drive system are measured by using an offline method, and the varied vibration frequencies are made into a two-dimensional table related to the load positions. The fixed vibration frequencies are eliminated by using fixed-frequency parameter vibration suppression filters; and the varied vibration frequencies are eliminated by using a variable-frequency parameter vibration suppression filter, and the vibration frequencies are obtained in real time according to the load positions and the two-dimensional table.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: February 27, 2024
    Assignee: NANJING ESTUN AUTOMATION COMPANY
    Inventors: Renkai Fan, Kaifeng Yang, Dandan Qi, Wei Qian, Bo Wu
  • Patent number: 11917163
    Abstract: A video recording method and a video recording device are provided. The method includes: obtaining video data to be recorded; dividing, based on the video data, each frame of the video data into a region of interest and a background region by using a preset neural network model; and encoding the region of interest of the video data based on a first encoding bit rate, and the background region based on a second bit rate, and storing the encoded video data into a storage device through a video buffer.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wei Huang, Xianghu Chen, Yong Zhang, Junheng Wu
  • Patent number: 11913324
    Abstract: An apparatus for downhole multi-dimensional imaging includes an acquisition unit configured to acquire a formation resistivity signal, an ultrasonic echo signal and an orientation signal regularly; a sector calculation unit configured to calculate, based on said orientation signal, a sector where a currently acquired signal is from; and a multi-dimensional imaging unit, configured to calculate, based on the signals acquired by the acquisition unit, data of resistivity, distance from a drilling tool to a borehole wall and ultrasonic echo amplitude, and distribute said data into all sectors for feature recognition and extraction, thus obtaining key features characterizing a current formation being drilled, said key features being transmitted to ground for guiding drilling process. The structural complexity and the length of the downhole imaging measurement instrument can be reduced, and feature recognition can be directly performed on the imaging data underground.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: February 27, 2024
    Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, SINOPEC RESEARCH INSTITUTE OF PETROLEUM ENGINEERING
    Inventors: Yijin Zeng, Wei Zhang, Weining Ni, Xin Li, Lipeng Yan, Jinping Wu, Yuefa Hu, Lishuang Wang, Zuyang Zhu, Jintai Mi
  • Publication number: 20240061741
    Abstract: A memory subsystem includes memory devices with space dynamically allocated for improvement of reliability, availability, and serviceability (RAS) in the system. Error checking and correction (ECC) logic detects an error in all or a portion of a memory device. In response to error detection, the system can dynamically perform one or more of: allocate active memory device space for sparing to spare a failed memory segment; write a poison pattern into a failed cacheline to mark it as failed; perform permanent fault detection (PFD) and adjust application of ECC based on PFD detection; or, spare only a portion of a device and leave another portion active, including adjusting ECC based on the spared portion. The error detection can be based on bits of an ECC device, and error correction based on those bits and additional bits stored on the data devices.
    Type: Application
    Filed: December 26, 2020
    Publication date: February 22, 2024
    Inventors: Rajat AGARWAL, Hsing-Min CHEN, Wei P. CHEN, Wei WU, Jing LING, Kuljit S. BAINS, Kjersten E. CRISS, Deep K. BUCH, Theodros YIGZAW, John G. HOLM, Andrew M. RUDOFF, Vaibhav SINGH, Sreenivas MANDAVA
  • Patent number: 11904303
    Abstract: A method of forming an AFX zeolite in a hydrothermal synthesis that exhibits a silica to alumina (SiO2AI2O3) molar ratio (SAR) that is between 8:1 and 26:1; has a morphology that includes one or more of cubic, spheroidal, or rhombic particles with a crystal size that is in the range of about 0.1 micrometer (?m) to 10 ?m. This AFX zeolite also exhibits a Brönsted acidity that is in the range of 1.2 mmol/g to 3.6 mmol/g as measured by ammonia temperature programmed desorption. A catalyst formed by substituting a metal into the framework of the zeolite exhibits about a 100% conversion of NO emissions over the temperature range of 300° C. to 650° C.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 20, 2024
    Assignee: Pacific Industrial Development Corporation
    Inventors: De Gao, Yunkui Li, David Shepard, Jeffery Lachapelle, Wei Wu
  • Patent number: 11908919
    Abstract: A method of manufacturing a semiconductor device includes forming a fin structure in which first semiconductor layers and second semiconductor layers are alternatively stacked; forming a sacrificial gate structure over the fin structure; etching a source/drain (S/D) region of the fin structure, which is not covered by the sacrificial gate structure, thereby forming an S/D space; laterally etching the first semiconductor layers through the S/D space, thereby forming recesses; forming a first insulating layer, in the recesses, on the etched first semiconductor layers; after the first insulating layer is formed, forming a second insulating layer, in the recesses, on the first insulating layer, wherein a dielectric constant of the second insulating layer is less than that of the first insulating layer; and forming an S/D epitaxial layer in the S/D space, wherein the second insulating layer is in contact with the S/D epitaxial layer.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chih-Ching Wang, Jon-Hsu Ho, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Publication number: 20240055324
    Abstract: A package includes a first molding compound layer, a conductive via embedded in the first molding compound layer, a semiconductor device, a redistribution structure and a second molding compound layer. The semiconductor device and the redistribution structure are respectively disposed on opposite sides of the first molding compound layer, wherein the semiconductor device is electrically connected to the redistribution structure through the conductive via. The second molding compound layer is disposed on the first molding compound layer, wherein the semiconductor device is encapsulated by the second molding compound layer.
    Type: Application
    Filed: August 12, 2022
    Publication date: February 15, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Ying-Ching Shih, Wen-Chih Chiou
  • Publication number: 20240056469
    Abstract: A method for predicting an attacked path on enterprise networks includes: obtaining a plurality of accounts, a plurality of machines and network resource data, where the plurality of machines include at least one attacked target; calculating, according to the network resource data, a plurality of evaluated values of executing access on other machines of each account logging in at least one machine; and presenting an attacked path where a machine at least one account logs in accesses the attacked target directly, or indirectly by connecting to other machines, and the machine the at least one account logs in points to the attacked target directly, or indirectly by connecting to other machines.
    Type: Application
    Filed: June 9, 2023
    Publication date: February 15, 2024
    Inventors: Ming-Chang Chiu, Pei-Kan Tsung, Ming-Wei Wu, Cheng-Lin Yang, Che-Yu Lin, Sian-Yao Huang
  • Publication number: 20240050710
    Abstract: A device for shaping an angle of a guide wire includes a support platform configured to provide a support surface for placing the guide wire, and an angled cutter head configured to press and bend the guide wire at an accurate angle. A method for shaping with a device for shaping an angle of a guide wire includes the following steps: placing a guide wire on a support platform, extending out the guide wire by a certain bending length, pressing down on the guide wire with an angled cutter head of which the bottom surface is provided with a certain angle, and preparing the guide wire of which one end has an angle of required accuracy.
    Type: Application
    Filed: January 27, 2022
    Publication date: February 15, 2024
    Inventors: Jian ZHANG, Wei WU
  • Publication number: 20240052561
    Abstract: A digital control method is to accurately calculate the real-time addition amount of each dye in the solution replenishment system in the whole dyeing process based on the initial dyeing rate of each dye, and replenish the dye solution according to the real-time addition amount. A digital control system includes an automatic calculation K0,n value unit, a central processing unit and a replenishment pump. The automatic calculation K0,n value unit is composed of a dye solution concentration detection instrument, a sensor I and a BP neural network model. The BP neural network model is a BP neural network trained by a dye database. The automatic calculation K0,n value unit transmits the K0,n value to the central processing unit, calculates the replenishment amount through the central processing unit, and controls the replenishment pump to replenish the solution.
    Type: Application
    Filed: December 28, 2021
    Publication date: February 15, 2024
    Applicant: DONGHUA UNIVERSITY
    Inventors: Zhiping MAO, Yamin DAI, Hong XU, Yi ZHONG, Hui LU, Linping ZHANG, Xiaofeng SUI, Wei WU
  • Publication number: 20240053949
    Abstract: A multimedia system is provided. The multimedia system includes a plurality of transmission devices and a receiving-end device. Multiple transmission devices respectively has a microphone. The receiving-end device is coupled to the transmission devices. When the microphone of one of the transmission devices is enabled, the receiving-end device outputs at least one control signal to at least another one of the transmission devices to disable the microphone of the at least another one of the transmission devices.
    Type: Application
    Filed: February 17, 2023
    Publication date: February 15, 2024
    Applicant: BENQ CORPORATION
    Inventors: Chen-Chi Wu, Chia-Nan Shih, Chin-Fu Chiang, Jung-Kun Tseng, Chuang-Wei Wu, Chian Yu Yeh
  • Publication number: 20240055315
    Abstract: Disclosed are a semiconductor package and a manufacturing method of a semiconductor package. In one embodiment, the semiconductor package includes an interposer substrate, a plurality of semiconductor dies, one or more heat dissipation elements and an encapsulant. The plurality of semiconductor dies are disposed on the interposer substrate. The one or more heat dissipation elements are disposed on the plurality of semiconductor dies. The encapsulant is disposed on the interposer substrate and surrounds the plurality of semiconductor dies and the one or more heat dissipation elements.
    Type: Application
    Filed: August 12, 2022
    Publication date: February 15, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Ying-Ching Shih, An-Jhih Su, Wen-Chih Chiou