Patents by Inventor Wei Wu

Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919948
    Abstract: The invention provides isoform-selective anti-TGF? antibodies and methods of using the same. In particular, isoform-selective anti-TGF?2, anti-TGF?3, and anti-TGF?2/3 monoclonal antibodies are provided, e.g., for the treatment of fibrosis and other TGF?-related disorders.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: March 5, 2024
    Assignee: GENENTECH, INC.
    Inventors: Wei-Ching Liang, Joseph R. Arron, Daryle Depianto, Wendy Green Halpern, WeiYu Lin, Patrick J. Lupardus, Thirumalai Rajan Ramalingam, Dhaya Seshasayee, Tianhe Sun, Tulika Tyagi, Jia Wu, Yan Wu, Jian Ping Yin
  • Patent number: 11922864
    Abstract: A display device includes a controller, a power management circuit and N display modules. Each of the N display modules includes M driving circuits, and M display arrays respectively connected to the M driving circuits. Each of the M driving circuits is configured to drive a display array connected to the driving circuit, and each of the display arrays includes at least one indicator light. The power management circuit is configured to output a voltage determined by the voltage control signal to the display arrays to supply power to the display array. M driving circuits in each of the display modules are cascaded through serial control lines. The controller is configured to address M driving circuits and read data of M driving circuits through the serial control lines, and send information to the driving circuits through the sharing data line to control the driving circuits and the indicator light.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: March 5, 2024
    Assignee: XIAMEN XM-PLUS TECHNOLOGY CO., LTD
    Inventor: Che-Wei Wu
  • Patent number: 11924705
    Abstract: An antenna device, a positioning system and a positioning method are provided. The positioning method includes: dispersedly arranging a plurality of receivers to form a target area, in which each of the receivers includes the antenna device; receiving a wireless signal from the target area through the antenna device, and generating a difference signal strength and a sum signal strength; calculating, for each of the receivers, a sum-difference ratio between the difference signal strength and the sum signal strength, and estimating a corresponding one of estimated incident angles according to the sum-difference ratio and a comparison table; executing, in response to obtaining the estimated incident angles corresponding to the receivers, a positioning algorithm according to the estimated incident angles, so as to generate a plurality of possible positions; and executing an optimization algorithm to calculate a best estimated position of the possible positions.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: March 5, 2024
    Assignee: PSJ INTERNATIONAL LTD.
    Inventors: Shih-Yi Huang, Hao-Wei Chan, Ruey-Beei Wu
  • Patent number: 11923306
    Abstract: A method for manufacturing a semiconductor structure includes forming a plurality of dummy structures spaced apart from each other, forming a plurality of dielectric spacers laterally covering the dummy structures to form a plurality of trenches defined by the dielectric spacers, filling a conductive material into the trenches to form electrically conductive features, selectively depositing a capping material on the electrically conductive features to form a capping layer, removing the dummy structures to form a plurality of recesses defined by the dielectric spacers, filling a sacrificial material into the recesses so as to form sacrificial features, depositing a sustaining layer on the sacrificial features, and removing the sacrificial features to form air gaps confined by the sustaining layer and the dielectric spacers.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Wei Su, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue
  • Patent number: 11924481
    Abstract: The disclosed computer-implemented method may include (1) accessing a first media data object and a different, second media data object that, when played back, each render temporally sequenced content, (2) comparing first temporally sequenced content represented by the first media data object with second temporally sequenced content represented by the second media data object to identify a set of common temporal subsequences between the first media data object and the second media data object, (3) identifying a set of edits relative to the set of common temporal subsequences that describe a difference between the temporally sequenced content of the first media data object and the temporally sequenced content of the second media data object, and (4) executing a workflow relating to the first media data object and/or the second media data object based on the set of edits. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: March 5, 2024
    Assignee: Netflix, Inc.
    Inventors: Yadong Wang, Chih-Wei Wu, Kyle Tacke, Shilpa Jois Rao, Boney Sekh, Andrew Swan, Raja Ranjan Senapati
  • Patent number: 11922632
    Abstract: A human face data processing method according to an embodiment of the present disclosure includes acquiring a picture of a human face by means of a scanning apparatus, obtaining point cloud information by means of a structured light stripe, and further obtaining a three-dimensional model of the human face, and mapping the three-dimensional model onto a circular plane in an area-preserving manner so as to form a two-dimensional human face image. Three-dimensional data is converted into two-dimensional data, thereby facilitating data storage. In addition, the three-dimensional data uses the area-preserving manner, such that the restoration quality is better when the two-dimensional data is restored to the three-dimension data, thereby facilitating the re-utilization of a three-dimensional image.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: March 5, 2024
    Assignee: BEIJING GMINE VISION TECHNOLOGIES LTD.
    Inventors: Wei Chen, Boyang Wu
  • Patent number: 11923273
    Abstract: A method of manufacturing a semiconductor device, including: forming a plurality of first metal strips extending in a first direction on a first plane; and forming a plurality of second metal strips extending in the first direction on a second plane over the first plane by executing a photolithography operation with a single mask, wherein a first second metal strip (FIG. 1, 131) is disposed over a first first metal strip; wherein the first first metal strip and the first second metal strip are directed to a first voltage source; wherein a distance between the first second metal strip and a second second metal strip immediate adjacent to the first second metal strip is greater than a distance between the second second metal strip and a third second metal strip immediate adjacent to the second second metal strip.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shih-Wei Peng, Chia-Tien Wu, Jiann-Tyng Tzeng
  • Patent number: 11923199
    Abstract: Aspects of the disclosure provide a method. The method includes forming a structure over a substrate, and forming a spacer layer on the structure, wherein the spacer layer has a recess. The method includes forming a mask layer over the spacer layer and in the recess, the mask layer including a first layer, a second layer and a third layer. The method includes patterning the third layer of the mask layer, and etching the first layer and the second layer of the mask layer to form an opening to expose the recess of the spacer layer, wherein the opening in the second layer has a first width; and. The method includes removing the second layer using a wet etchant, wherein the opening in the third layer has a second width, and the second with is greater than the first width.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Nai-Chia Chen, Wan Hsuan Hsu, Chia-Wei Wu, Neng-Jye Yang, Chun-Li Chou
  • Publication number: 20240072899
    Abstract: This application provides a data transmission method and apparatus. The method includes: processing, by a network device, a to-be-sent optical data unit ODU to obtain another ODU, where a bit rate of the another ODU is lower than a bit rate of the ODU; and sending, by the network device, the another ODU. In embodiments of this application, the ODU is processed to obtain the another ODU with a lower bit rate, and this helps reduce a rate increase when service data is transmitted in an OTN, so as to reduce an OTN interface rate and OTN costs.
    Type: Application
    Filed: September 5, 2023
    Publication date: February 29, 2024
    Inventors: Wei SU, Qiuyou WU, Huaping QING
  • Publication number: 20240071855
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure, a backside dielectric layer, conductive terminals, an electronic device, and an underfill is provided. The semiconductor die laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes redistribution conductive layers and thermal enhancement structures electrically insulated from the redistribution conductive layers, and the thermal enhancement structures are thermally coupled to the semiconductor die. The backside dielectric layer is disposed on the redistribution circuit structure. The conductive terminals penetrate through the backside dielectric layer. The electronic device is disposed over the backside dielectric layer and electrically connected to the redistribution circuit structure through the conductive terminals.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Ying-Ching Shih, Wen-Chih Chiou
  • Publication number: 20240066182
    Abstract: The present disclosure provides a fiber membrane and a preparation method and use thereof, and belongs to the field of biological materials. The fiber membrane includes a fiber with a core-shell structure, where a core of the fiber includes simvastatin and a first spinnable polymer, and a shell of the fiber includes hydroxyapatite and a second spinnable polymer. In the fiber, a release of the simvastatin mainly depends on a rate of water invasion. After water invades the fiber, the simvastatin in the fiber leaves the fiber with the diffusion of water. In the present disclosure, a barrier function of the shell prevents moisture from entering the core. Therefore, the simvastatin in the core cannot leave the fiber with the diffusion of water molecules in an early stage, and a release rate of drugs is slowed down in the early stage, thereby controlling sustained release of the drugs.
    Type: Application
    Filed: November 10, 2022
    Publication date: February 29, 2024
    Applicant: SHANGHAI RUIZHIKANG MEDICAL TECHNOLOGY CO., LTD.
    Inventors: Xiaohong CHEN, Yubo LIU, Honglei ZHOU, Wei LI, Fengcang MA, Shaoli FU, Guosen SHAO, Haochen WU
  • Publication number: 20240072411
    Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicant: Pegatron Corporation
    Inventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
  • Publication number: 20240071776
    Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 29, 2024
    Inventors: DEI-CHENG LIU, CHIA-SHUAI CHANG, MING-YEN PAN, JIAN-YU SHIH, JHIH-WEI LAI, SHIH-HAN WU
  • Publication number: 20240073624
    Abstract: A downhole transducer can include at least one single-crystal piezoelectric material, the at least one single-crystal piezoelectric material being positioned in the downhole transducer that is deployed downhole in a wellbore. Additionally, the downhole transducer can include at least one pair of electrodes positioned adjacent to the at least one single-crystal piezoelectric material for determining wellbore parameter measurements using one or more acoustic signals transmitted in the wellbore. The single-crystal piezoelectric material can include PIN-PZN-PT.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Jing Jin, Xiang Wu, Wei Zhang
  • Publication number: 20240071818
    Abstract: A semiconductor device and method of fabricating the same include a substrate, a first epitaxial layer, a first protection layer, and a contact etching stop layer. The substrate includes a PMOS transistor region, and the first epitaxial layer is disposed on the substrate, within the PMOS transistor region. The first protection layer is disposed on the first epitaxial layer, covering surfaces of the first epitaxial layer. The contact etching stop layer is disposed on the first protection layer and the substrate, wherein a portion of the first protection layer is exposed from the contact etching stop layer.
    Type: Application
    Filed: September 22, 2022
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: I-Wei Chi, Te-Chang Hsu, Yao-Jhan Wang, Meng-Yun Wu, Chun-Jen Huang
  • Publication number: 20240071829
    Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming first fin structures and a second fin structures over a substrate, forming a first gate stack and a second gate stack that extend in a first direction across the first fin structures and the second fin structures, respectively, and etching the first gate stack and the second gate stack to form a first trench through the first gate stack and a second trench through the second gate stack. A first dimension of the first trench in the first direction is greater than a second dimension of the second trench in the first direction. The method further includes forming a first gate cutting structure and a second gate cutting structure in the first trench and the second trench, respectively.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Chi-Wei WU, Hsin-Che CHIANG, Jeng-Ya YEH
  • Publication number: 20240067752
    Abstract: The present invention provides anti-HtrA1 antibodies (including bispecific anti-HtrA1 anti-Factor D antibodies) and methods of making and using the same, for example, in methods of treating HtrA1-associated disorders, ocular disorders, and/or complement-associated disorders.
    Type: Application
    Filed: September 26, 2023
    Publication date: February 29, 2024
    Inventors: Robert F. KELLEY, Daniel K. KIRCHHOFER, Joyce LAI, Chingwei V. LEE, Wei-Ching LIANG, Michael T. LIPARI, Kelly M. LOYET, Tao SAI, Menno VAN LOOKEREN CAMPAGNE, Yan WU, Germaine FUH
  • Publication number: 20240074282
    Abstract: The present application provides a displaying base plate and a displaying device, which relates to the technical field of displaying. The displaying device can ameliorate the problem of screen greening caused by electrostatic charges, thereby improving the effect of displaying. The displaying base plate includes an active area and a non-active area connected to the active area, the non-active area includes an edge region and a first-dam region, and the first-dam region is located between the active area and the edge region; the displaying base plate further includes: a substrate; an anti-static layer disposed on the substrate, wherein the anti-static layer is located at least within the edge region; and a driving unit and a touch unit that are disposed on the substrate, wherein the driving unit is located within the active area.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yu Zhao, Yong Zhuo, Wei He, Yanxia Xin, Qun Ma, Xiping Li, Jianpeng Liu, Kui Fang, Cheng Tan, Xueping Li, Yihao Wu, Xiaoyun Wang, Haibo Li, Xiaoyan Yang
  • Publication number: 20240070308
    Abstract: Embodiments of the present disclosure relate to a permission setting method and apparatus, a device, and a medium. The method includes: displaying a permission customization control, in response to a trigger operation on a permission setting object of task information, the permission setting object including a first information object and/or a second information object, the second information object being subordinate to the first information object; displaying a permission editing interface, in response to a trigger operation on the permission customization control, and receiving customization permission information via the permission editing interface; and displaying the customization permission information corresponding to the permission setting object. Therefore, a hierarchy structure based on the task information satisfies a setting need for content-based permission customization, and improves a permission management efficiency.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 29, 2024
    Inventors: Wenzong MA, Liang CHEN, Yingtao LIU, Wei REN, Qiushuo HUANG, Yuejiang YUAN, Hao HUANG, Jianhui WU, Yalong ZOU, Linghui ZHOU, Mengzhang WU, Yanhui ZHAO, Xinlei GUO
  • Publication number: 20240066177
    Abstract: The present disclosure provides a hydrophilic fiber membrane with a sustained-release drug, and belongs to the field of biological materials. The present disclosure provides a hydrophilic fiber membrane with a sustained-release drug, including a fiber with a core-shell structure, where a core of the fiber includes curcumin and a first spinnable polymer, and a shell of the fiber includes polyethylene glycol and a second spinnable polymer; and in the shell, the polyethylene glycol and the second spinnable polymer have a mass ratio of not greater than 1:12. In the present disclosure, the fiber membrane has a core-shell structure, the curcumin is provided in the core, and the shell prevents a rapid release of the curcumin in an early stage, thereby delaying a release rate of the curcumin to prevent the drug from forming a burst release in the early stage and causing toxic reactions.
    Type: Application
    Filed: November 11, 2022
    Publication date: February 29, 2024
    Applicant: SHANGHAI RUIZHIKANG MEDICAL TECHNOLOGY CO., LTD.
    Inventors: Xiaohong CHEN, Yubo LIU, Honglei ZHOU, Wei LI, Fengcang MA, Shaoli FU, Guosen SHAO, Haochen WU