Patents by Inventor Wei Yu

Wei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11664515
    Abstract: The present invention provides a methanol solid oxide fuel cell and a power generation system comprising the same, wherein the fuel cell is a tubular SOFC cell stack, the tubular SOFC cell stack comprises a plurality of tubular SOFC single cells, and a side wall of an inner pipe of the tubular SOFC single cell at a fuel inlet is of a porous layer structure; an inner wall of the inner pipe is coated with a methanol pyrolysis catalyst layer, and the thickness of the catalyst layer gradually increases along a moving direction of the fuel in the inner pipe. The methanol solid oxide fuel cell can effectively relieve carbon deposition of the anode of the methanol SOFC, and can ensure that the temperature of the whole cell is more uniform and the cell performance is more stable.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: May 30, 2023
    Assignee: JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Wei Kong, Si Yu Lu, Man Zhang, Leitao Han, Alexei Levtsev, Andrey Makeev, Anatoly Lysyakov
  • Patent number: 11664451
    Abstract: A semiconductor device and a method of forming the same are provided. A semiconductor device according to an embodiment includes a P-type field effect transistor (PFET) and an N-type field effect transistor (NFET). The PFET includes a first gate structure formed over a substrate, a first spacer disposed on a sidewall of the first gate structure, and an unstrained spacer disposed on a sidewall of the first spacer. The NET includes a second gate structure formed over the substrate, the first spacer disposed on a sidewall of the second gate structure, and a strained spacer disposed on a sidewall of the first spacer.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: May 30, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kai-Chieh Yang, Li-Yang Chuang, Pei-Yu Wang, Wei Ju Lee, Ching-Wei Tsai, Kuan-Lun Cheng
  • Patent number: 11664287
    Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: May 30, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    Inventors: Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng
  • Patent number: 11662551
    Abstract: An optical lens assembly includes four lens elements which are, in order from an object side to an image side along an imaging optical path: a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has positive refractive power. The second lens element has an image-side surface being concave in a paraxial region thereof. The third lens element has an object-side surface being concave in a paraxial region thereof. The fourth lens element with negative refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, and at least one of the object-side surface and the image-side surface of the fourth lens element has at least one inflection point in an off-axis region thereof.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: May 30, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuo-Jui Wang, Kuan Chun Wang, Hung-Shuo Chen, Jin Sen Wang, Syuan Ruei Lai, Wei-Yu Chen
  • Patent number: 11665933
    Abstract: An organic light-emitting diode display may have thin-film transistor circuitry formed on a substrate. The display and substrate may have rounded corners. A pixel definition layer may be formed on the thin-film transistor circuitry. Openings in the pixel definition layer may be provided with emissive material overlapping respective anodes for organic light-emitting diodes. A cathode layer may cover the array of pixels. A ground power supply path may be used to distribute a ground voltage to the cathode layer. The ground power supply path may be formed from a metal layer that is shorted to the cathode layer using portions of a metal layer that forms anodes for the diodes, may be formed from a mesh shaped metal pattern, may have L-shaped path segments, may include laser-deposited metal on the cathode layer, and may have other structures that facilitate distribution of the ground power supply.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: May 30, 2023
    Assignee: Apple Inc.
    Inventors: Chin-Wei Lin, Stephen S. Poon, Warren S. Rieutort-Louis, Cheng-Ho Yu, ChoongHo Lee, Doh-Hyoung Lee, Ting-Kuo Chang, Tsung-Ting Tsai, Vasudha Gupta, Younggu Lee
  • Patent number: 11665274
    Abstract: Embodiments of this application disclose a call method and an apparatus. In the call method, when a user does not actively select an audio device as a voice pickup device and a voice play device, after establishing a call connection to another electronic device, an electronic device selects, from available audio devices, an audio device that meets a user expectation as the voice pickup device and the voice play device. According to technical solutions provided in the embodiments of this application, user experience in a call process can be improved.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: May 30, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Fusheng Li, Shengfeng Zhou, Yi Yu, Wei Yuan
  • Patent number: 11664595
    Abstract: The disclosure provides an integrated wideband antenna, comprising a first conductor layer, a first conductor patch, a second conductor patch, a feeding conductor structure and a signal source. The first conductor patch has a first coupling edge and a first connecting edge. The first connecting edge electrically connects with the first conductor layer through a first shorting structure. The second conductor patch has a second coupling edge and a second connecting edge. The second connecting edge electrically connects with the first conductor layer through a second shorting structure. The second coupling edge is spaced apart from the first coupling edge at a third interval forming a resonant open slot. The feeding conductor structure is located within the resonant open slot and has a first conductor line, a second conductor line and a third conductor line. The first conductor line is spaced apart from the first coupling edge with a first coupling interval.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: May 30, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kin-Lu Wong, Wei-Yu Li, Wei Chung
  • Publication number: 20230161139
    Abstract: An imaging optical lens assembly includes nine lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element. The first lens element has positive refractive power. The eighth lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The ninth lens element has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the ninth lens element has at least one convex critical point in an off-axis region thereof.
    Type: Application
    Filed: January 24, 2023
    Publication date: May 25, 2023
    Applicant: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu CHEN
  • Publication number: 20230161121
    Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.
    Type: Application
    Filed: July 6, 2022
    Publication date: May 25, 2023
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Yi-Tseng LIN, Chih-Wei YU, Chien-Tzu WU, Kuen-Da JENG, Min-Sheng KAO
  • Publication number: 20230161196
    Abstract: A display device includes a first light-emitting module and a second light-emitting module. Each light-emitting module has a substrate, a plurality of LED dies arranged on the substrate, a reflective layer on the substrate, and a light-transmissive layer. The light-transmissive layer covers the substrate, the plurality of LED dies, and the reflective layer. Both the light-transmissive layer of the first module and the light-transmissive layer of the second module have rough uppermost surfaces. The first light-emitting module has a first reflectivity, the second light-emitting module has a second reflectivity, and a standard deviation between the first reflectivity and the second reflectivity is not greater than 0.5.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 25, 2023
    Inventors: Chong-Yu WANG, Ching-Tai CHENG, Wei-Shan HU
  • Patent number: 11656443
    Abstract: A photographing lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The seventh lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the seventh lens element includes at least one convex shape in an off-axis region thereof. The object-side surface and the image-side surface of the seventh lens element are aspheric.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: May 23, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che Hsueh, Chun-Yen Chen, Wei-Yu Chen
  • Patent number: 11658119
    Abstract: A semiconductor structure includes a first transistor having a first source/drain (S/D) feature and a first gate; a second transistor having a second S/D feature and a second gate; a multi-layer interconnection disposed over the first and the second transistors; a signal interconnection under the first and the second transistors; and a power rail under the signal interconnection and electrically isolated from the signal interconnection, wherein the signal interconnection electrically connects one of the first S/D feature and the first gate to one of the second S/D feature and the second gate.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 23, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng, Wei-Cheng Lin, Wei-An Lai, Ming Chian Tsai, Jiann-Tyng Tzeng, Hou-Yu Chen, Chun-Yuan Chen, Huan-Chieh Su
  • Patent number: 11656440
    Abstract: A photographing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with refractive power has an object-side surface being convex in a paraxial region thereof. Each second, third, fourth and fifth lens element has refractive power. The sixth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof, and both of the surfaces of the sixth lens element are aspheric. The seventh lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface has at least one convex shape in an off-axis region thereof.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: May 23, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu Chen
  • Patent number: 11656974
    Abstract: Embodiments provide enhanced performance diagnosis in a network computing environment. In response to an occurrence of a performance issue for a node while under operating conditions, common logs for applications on the node are analyzed. The applications are respectively registered in advance for diagnosis services. The applications each register rules in advance for the diagnosis services. At a time of the performance issue, debug programs are automatically issued to generate debug level logs respectively for the applications. Debug level logs are analyzed according to the rules to determine a root cause of the performance issue. A potential solution to the root cause of the performance issue is determined using the rules, without having to recreate the operating conditions occurring during the performance issue. The potential solution to rectify the root cause of the performance issue is executed without having to recreate the operating conditions occurring during the performance issue.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: May 23, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jie Yang, Yao Zhao, Fei Tan, Xin Yu Pan, Ling Qin, Pin Yi Liu, Wei Wu, Jiang Yi Liu
  • Patent number: 11658196
    Abstract: A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a plurality of pixel sensors, an isolation grid disposed in the substrate and separating the plurality of pixel sensors from each other, a reflective grid disposed over the isolation grid on the back side of the substrate, an a low-n grid disposed over the back side of the substrate and overlapping the reflective grid from a top view. A width of the low-n grid is greater than a width of the reflective grid.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: May 23, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Keng-Yu Chou, Wei-Chieh Chiang, Chen-Jong Wang, Chien-Hsien Tseng, Kazuaki Hashimoto
  • Patent number: 11657870
    Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: May 23, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hidehiro Fujiwara, Hsien-Yu Pan, Chih-Yu Lin, Yen-Huei Chen, Wei-Chang Zhao
  • Publication number: 20230153944
    Abstract: A super resolution image generating device capable of processing an image flexibly includes a scaling-up circuit, a front-end circuit, a first branch circuit, a second branch circuit, and an arithmetic circuit. The scaling-up circuit scales up the image to generate an enlarged image including N pixel values. The front-end circuit extracts features of the image to generate a front-end feature map. The first branch circuit extracts features of the front-end feature map to generate a first feature map, and scales up the first feature map to generate N first values. The second branch circuit processes the front-end feature map to generate a second feature map, scales up the second feature map to generate N second values, and processes the N second values to generate N processed values. The arithmetic circuit combines the N pixel values, the N first values, and the N processed values to generate a super resolution image.
    Type: Application
    Filed: October 24, 2022
    Publication date: May 18, 2023
    Inventors: KANG-YU LIU, CHIA-WEI YU
  • Publication number: 20230152753
    Abstract: An interchangeable smartwatch system includes a smartwatch body and a band including one or more sensors. The smartwatch body is removable from the band, which permits a user to continue to collect data, such as the user's heartrate, when the smartwatch body is removed from the band. The smartwatch body can receive a wireless charge when removed from the band, and then transfer a charge to the band when the smartwatch body is reconnected to the band.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Inventors: Dhruvi Suresh Fulfagar, Jonathan Jen-Wei Yu, Hallie MacEldowney, Rebecca Megan Frankosky
  • Publication number: 20230151878
    Abstract: A linear transmission device includes a screw, a moving member, a return element, and a sensor. The moving member is set in the screw to form a load path therebetween. The return element is set in the moving member and has a return path connected to the load path. The return path and the load path constitute a circulating path for balls to run. The moving member has an internal thread with an ineffective thread section. The moving member has a receiving groove adjacent to the ineffective thread section. The sensor is embedded in the receiving groove of the moving member without affecting the operation of the balls. Thus, the linear transmission device of the present invention can solve the problem of the sensor protruding from the moving member, so that the configuration of the surrounding space and the stroke of the moving member will not be affected.
    Type: Application
    Filed: November 16, 2021
    Publication date: May 18, 2023
    Inventors: Szu-Wei YU, Chih-Hsiang CHEN, Meng-Ying LIN
  • Publication number: 20230155633
    Abstract: Embodiments of this application provide a data sending method, an apparatus, a device, and a readable storage medium. A server determines a first transmission point from a coordinated set, and determines a first downlink sending weight of the first transmission point. Then, the server determines a second downlink sending weight of a second transmission point based on the first downlink sending weight, and sends the second downlink sending weight to the second transmission point. When sending a data stream to an electronic device, the second transmission point determines a downlink sending weight corresponding to the data stream from a matrix, weights the data stream, and sends the weighted data stream to the electronic device.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 18, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yunfeng SUN, Qingtian XUE, Wei YU, Min WEN, Gang WEI, Qunfang LOU