Patents by Inventor Wei Yu

Wei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149488
    Abstract: In an embodiment, a method includes forming a device region along a first substrate; forming an interconnect structure over the device region and the first substrate; forming a metal pillar over the interconnect structure, forming the metal pillar comprising: forming a base layer over the interconnect structure; forming an intermediate layer over the base layer; and forming a capping layer over the intermediate layer; forming a solder region over the capping layer; and performing an etch process to recess sidewalls of the base layer and the capping layer from sidewalls of the intermediate layer and the solder region.
    Type: Application
    Filed: February 23, 2024
    Publication date: May 8, 2025
    Inventors: Wei-Yu Chen, Chao-Wei Chiu, Hsin Liang Chen, Hao-Jan Shih, Hao-Jan Pei, Hsiu-Jen Lin
  • Publication number: 20250139379
    Abstract: Implementations relate to generating multi-modal response(s) through utilization of large language model(s) (LLM(s)) and other generative model(s). Processor(s) of a system can: receive natural language (NL) based input, generate a multi-modal response that is responsive to the NL based output, and cause the multi-modal response to be rendered. In some implementations, and in generating the multi-modal response, the processor(s) can process, using a LLM, LLM input to generate LLM output, and determine, based on the LLM output, textual content and generative multimedia content for inclusion in the multi-modal response. In some implementations, the generative multimedia content can be generated by another generative model (e.g., an image generator, a video generator, an audio generator, etc.) based on generative multimedia content prompt(s) included in the LLM output and that is indicative of the generative multimedia content.
    Type: Application
    Filed: October 30, 2023
    Publication date: May 1, 2025
    Inventors: Sanil Jain, Wei Yu, Alessandro Agostini, Agoston Weisz, Michael Andrew Goodman, Attila Dankovics, Elle Chae, Evgeny Sluzhaev, Amin Ghafouri, Golnaz Ghiasi, Igor Petrovski, Konstantin Shagin, Marcelo Menegali, Oscar Akerlund, Rakesh Shivanna, Thang Luong, Tiffany Chen, Vikas Peswani, Yifeng Lu
  • Publication number: 20250135391
    Abstract: Systems and methods for extracting components from a gas. A chamber to collect water and another chamber to collect carbon dioxide from a gas are each configured with topologically optimized sorbents. A DAC method for extracting components from a gas includes water and carbon dioxide chambers configured with topologically optimized sorbents to respectively capture water and carbon dioxide.
    Type: Application
    Filed: October 25, 2024
    Publication date: May 1, 2025
    Applicant: Omega Dac Inc.
    Inventors: Jijun Miao, Wei Yu, Michael R. Berry
  • Publication number: 20250134460
    Abstract: An earbud with temperature sensing is provided, and the earbud includes a housing and a first temperature sensor. The housing defines a second opening and a third opening. The first temperature sensor is positioned along an interior surface of the housing and aligned with the second opening in the housing for non-contact temperature sensing. In response to the earbud being positioned for use within an ear of a user, the second opening aligns with an inner side of the tragus close to the ear canal, the cavum conchae, an inner edge of the antitragus, or the cheek close to the ear, such that the first temperature sensor detects a body temperature of the user through the second opening.
    Type: Application
    Filed: January 2, 2025
    Publication date: May 1, 2025
    Inventors: WEI-LUN SUNG, PO-WEI YU, CHIH-MING SUN
  • Publication number: 20250140757
    Abstract: A chip package structure is provided. The chip package structure includes a wiring structure. The chip package structure includes a first chip structure over the wiring structure. The chip package structure includes a first molding layer surrounding the first chip structure. The chip package structure includes a second chip structure over the first chip structure and the first molding layer. The chip package structure includes a second molding layer surrounding the second chip structure and over the first chip structure and the first molding layer. The chip package structure includes a third chip structure over the second chip structure and the second molding layer. The chip package structure includes a third molding layer surrounding the third chip structure and over the second chip structure and the second molding layer. The chip package structure includes a fourth molding layer surrounding the second molding layer and the third molding layer.
    Type: Application
    Filed: December 31, 2024
    Publication date: May 1, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Yu CHEN, An-Jhih SU
  • Patent number: 12288721
    Abstract: A method includes etching a semiconductor substrate to form a trench between a first semiconductor strip and a second semiconductor strip. The first semiconductor strip has a first width at about 5 nm below a top of the first semiconductor strip and a second width at about 60 nm below the top of the first semiconductor strip. The first width is smaller than about 5 nm, and the second width is smaller than about 14.5 nm. The trench is filled with dielectric materials to form an isolation region, which is recessed to have a depth. A top portion of the first semiconductor strip protrudes higher than the isolation region to form a protruding fin. The protruding fin has a height smaller than the depth. A gate stack is formed to extend on a sidewall and a top surface of the protruding fin.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: April 29, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: De-Wei Yu, Ming-Feng Hsieh, Hsueh-Chang Sung, Pei-Ren Jeng, Yee-Chia Yeo, Chien-Chia Cheng
  • Publication number: 20250131321
    Abstract: Systems and methods are provided for efficiently calibrating a data mixture for training machine-learned models (e.g., machine-learned sequence processing models, such as transformer-based models). For example, machine-learned models can be trained over a broad dataset that can include multiple different categories of data. The mixture of data categories within the dataset can influence model performance. To improve the performance of machine-learned models, example implementations of the present disclosure can learn a distribution of data categories using a lightweight proxy model before initiating training of a large primary model. In this manner, for instance, example implementations can obtain an improved training data distribution with less computational expense and can leverage the learned training data distribution to better train a large primary model.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 24, 2025
    Inventors: Wei Yu, Sang Xie, Hieu Hy Pham, Quoc V. Le
  • Patent number: 12283737
    Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: April 22, 2025
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Joseph Poujiong Wang, Wei-Yu Li, Wei Chung, Chun-An Lu, Jiun-Jang Yu
  • Patent number: 12283622
    Abstract: A method for forming a semiconductor device and a semiconductor device formed by the method are disclosed. In an embodiment, the method includes depositing a dummy dielectric layer on a fin extending from a substrate; depositing a dummy gate seed layer on the dummy dielectric layer; reflowing the dummy gate seed layer; etching the dummy gate seed layer; and selectively depositing a dummy gate material over the dummy gate seed layer, the dummy gate material and the dummy gate seed layer constituting a dummy gate.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: April 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: De-Wei Yu, Cheng-Po Chau, Yun Chen Teng
  • Patent number: 12283492
    Abstract: A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
    Type: Grant
    Filed: January 2, 2024
    Date of Patent: April 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen
  • Patent number: 12282429
    Abstract: An apparatus includes a processor core and a memory hierarchy. The memory hierarchy includes main memory and one or more caches between the main memory and the processor core. A plurality of hardware pre-fetchers are coupled to the memory hierarchy and a pre-fetch control circuit is coupled to the plurality of hardware pre-fetchers. The pre-fetch control circuit is configured to compare changes in one or more cache performance metrics over two or more sampling intervals and control operation of the plurality of hardware pre-fetchers in response to a change in one or more performance metrics between at least a first sampling interval and a second sampling interval.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: April 22, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Elnaz Ebrahimi, Ehsan Khish Ardestani Zadeh, Wei-Yu Chen, Liang Peng
  • Patent number: 12280619
    Abstract: A wireless tire pressure monitoring system and a method for operating the tire pressure monitoring system to locate each wireless tire pressure sensor. The wireless host is connected to the wireless receiver. Each wireless tire pressure sensor sends info to the wireless host and the wireless receiver. The wireless host and the wireless receiver allocate the positions of the wheels where the wireless tire pressure sensors are installed by the info received from wireless tire pressure sensors. The wireless receiver analyses and calculates the received info, and forwards the result to the wireless host to process a cross-comparison to precise allocate the positions of the wireless tire pressure sensors. The method does not need to replace or add new wireless tire pressure sensors, and does not need to obtain new serial numbers. The positions of the wireless tire pressure sensor are precisely allocated by the method of the present invention.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: April 22, 2025
    Inventor: Chih-Wei Yu
  • Patent number: 12284654
    Abstract: Some embodiments of the present disclosure provide a deep-learning-based framework for designing components of a downlink precoding system. The components of such a system include downlink training pilots and channel estimation based on receipt of the downlink training pilots. Another component involves channel measurement and feedback strategy at the user equipment. The components include a precoding scheme designed at the base station based on the feedback from the user equipment.
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: April 22, 2025
    Assignees: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO, HUAWEI TECHNOLOGIES CANADA CO., LTD.
    Inventors: Wei Yu, Foad Sohrabi, Kareem Attiah Alboraie, Mohammadhadi Baligh
  • Publication number: 20250121920
    Abstract: A biomimetic turtle includes a trunk, a head movably connected with a front end of the trunk in the front-rear direction, two front limbs disposed on a front section of the trunk and each rotatable relative to the trunk to sway in an up-down direction, and a driving module to drive the head and the front limbs. Each front limb has a curve-shaped rigid portion with a recess, and a deformable flipper portion engaged in the recess and extending rearwardly. With the deformable flipper portion deformed and bent during swaying of the front limbs, a forward propelling force is generated to propel the biomimetic turtle forwardly. The head is operably movable to vary the center of gravity of 10 the biomimetic turtle 100 in the water, and thus the front portion of the biomimetic turtle is inclined upwardly or downwardly to facilitate ascending or descending of the biomimetic turtle.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 17, 2025
    Inventors: Wei-Yu HUANG, Chang-Qi ZHANG, Guan-Hao PAN, Li-Yuan YEH, Tai-Yu CHEN, Ching-Hung LIU, Jian-Jhih HUANG, Ching-Shu LAI
  • Publication number: 20250125237
    Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
    Type: Application
    Filed: December 20, 2024
    Publication date: April 17, 2025
    Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
  • Publication number: 20250122652
    Abstract: A weft-knitted fabric with cut-loop piles comprises a plurality of basic yarn loops and a plurality of cut-loop piles. The plurality of basic yarn loops are formed from at least one basic yarn, the plurality of cut-loop piles are respectively connected to one of the plurality of basic yarn loops, each of the plurality of cut-loop piles is formed by cutting a pile loop formed from one of at least two colored yarns, each of the at least two colored yarns without forming the plurality of cut-loop piles forms at least one of the plurality of basic yarn loops together with the at least one basic yarn, and colors of the at least two colored yarns are different.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 17, 2025
    Inventor: Jen-Wei YU
  • Publication number: 20250123792
    Abstract: A method for handling a display control of a microprocessor in an electronic device includes: receiving a display trigger signal; and controlling a panel device in the electronic device to display a content, in response to the display trigger signal; wherein a central processing unit (CPU) in the electronic device is in a power off state, when controlling the panel device to display the content.
    Type: Application
    Filed: August 25, 2024
    Publication date: April 17, 2025
    Applicant: MEDIATEK INC.
    Inventors: Tsung-Hsin Chen, Chin-Wen Liang, Wei-Chen Lin, Tung-Hung Lin, Shih-Yu Huang, Chen-Wei Yu
  • Patent number: 12277400
    Abstract: Implementations relate to managing multimedia content that is obtained by large language model(s) (LLM(s)) and/or generated by other generative model(s). Processor(s) of a system can: receive natural language (NL) based input that requests multimedia content, generate a response that is responsive to the NL based input, and cause the response to be rendered. In some implementations, and in generating the response, the processor(s) can process, using a LLM, LLM input to generate LLM output, and determine, based on the LLM output, at least multimedia content to be included in the response. Further, the processor(s) can evaluate the multimedia content to determine whether it should be included in the response. In response to determining that the multimedia content should not be included in the response, the processor(s) can cause the response, including alternative multimedia content or other textual content, to be rendered.
    Type: Grant
    Filed: February 28, 2024
    Date of Patent: April 15, 2025
    Assignee: GOOGLE LLC
    Inventors: Sanil Jain, Wei Yu, Ágoston Weisz, Michael Andrew Goodman, Diana Avram, Amin Ghafouri, Golnaz Ghiasi, Igor Petrovski, Khyatti Gupta, Oscar Akerlund, Evgeny Sluzhaev, Rakesh Shivanna, Thang Luong, Komal Singh, Yifeng Lu, Vikas Peswani
  • Patent number: 12277673
    Abstract: An image processing system includes: a first image processing device for performing a first image enhancement process on a source image to generate a first enhanced image; one or more second images processing device, each of which is used to perform a second image enhancement processing on a size-reduced image generated based on the source image, and accordingly to output one or more second enhanced images whose size identical to the source image; and an output controller for analyzing regional frequency characteristics of the source image to generate an analysis result, determining one or more region weights according to the analysis result, and synthesize the first enhanced image with the one or more second enhanced images according to the one or more region weights, thereby to generate an output image.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 15, 2025
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chon Hou Sio, Chia-Wei Yu
  • Lid
    Patent number: D1072561
    Type: Grant
    Filed: September 25, 2024
    Date of Patent: April 29, 2025
    Assignee: Foshan Jiuzhou Technology Co., Ltd.
    Inventor: Wei Yu