Patents by Inventor Wei Yu

Wei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250089334
    Abstract: A semiconductor includes a substrate. A gate structure is disposed on the substrate. A liner oxide contacts a side of the gate structure. A silicon oxide spacer contacts the liner oxide. An end of the silicon oxide spacer forms a kink profile. A silicon nitride spacer contacts the silicon oxide spacer and a tail of the silicon nitride spacer covers part of the kink profile. A stressor covers the silicon nitride spacer and the substrate.
    Type: Application
    Filed: October 13, 2023
    Publication date: March 13, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Fan Li, Chen-Ming Wang, Po-Ching Su, Pei-Hsun Kao, Ti-Bin Chen, Chun-Wei Yu, Chih-Chiang Wu
  • Publication number: 20250087652
    Abstract: A semiconductor package includes an interposer that has a first side and a second side opposing the first side. A semiconductor device that is on the first side of the interposer and an optical device that is on the first side of the interposer and next to the semiconductor device. A first encapsulant layer includes a first portion and a second portion. The first portion of the first encapsulant layer is on the first side of the interposer and along sidewalls of the semiconductor device. A gap is between a first sidewall of the optical device and a second sidewall of the first portion of the first encapsulant layer. A substrate is over the second side of the interposer. The semiconductor device and the optical device are electrically coupled to the substrate through the interposer.
    Type: Application
    Filed: January 5, 2024
    Publication date: March 13, 2025
    Inventors: Wei-Yu Chen, Cheng-Shiuan Wong, Chia-Shen Cheng, Hsuan-Ting Kuo, Hao-Jan Pei, Hsiu-Jen Lin, Mao-Yen Chang
  • Publication number: 20250085512
    Abstract: An optical lens system includes nine lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element. At least one lens surface of the seventh lens element, the eighth lens element and the ninth lens element has at least one critical point in an off-axis region thereof, and each of the seventh lens element, the eighth lens element and the ninth lens element has at least one lens surface being aspheric.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 13, 2025
    Applicant: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu CHEN
  • Patent number: 12248173
    Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: March 11, 2025
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Chung-Hsin Fu, Min-Sheng Kao, ChunFu Wu, Yi-Tseng Lin, Chih-Wei Yu, Chien-Tzu Wu, QianBing Yan, Yueh-Kuo Lin
  • Patent number: 12246561
    Abstract: A wireless tire pressure detector automatic find and locate system and the operation method thereof are provided. The wireless tire pressure detector automatic find and locate system includes a plurality of wireless tire pressure detectors and a wireless host. The wireless host and each wireless tire pressure detector are wirelessly paired and connected through a wireless system, and a first wireless tire pressure detector is designated. The wireless host and the first wireless tire pressure detector detect signal data between the first wireless tire pressure detector and other wireless tire pressure detectors, and the first wireless tire pressure detector transmits the data to the wireless host for analyzing and positioning to localize each wireless tire pressure detector.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: March 11, 2025
    Inventor: Chih-Wei Yu
  • Patent number: 12248126
    Abstract: A photographing optical lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element has negative refractive power. The third lens element has positive refractive power. The fourth lens element has negative refractive power. The sixth lens element has an image-side surface being convex in a paraxial region thereof. The seventh lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The image-side surface of the seventh lens element has at least one critical point in an off-axis region thereof. There is an air gap in a paraxial region between all adjacent lens elements of the seven lens elements.
    Type: Grant
    Filed: April 3, 2024
    Date of Patent: March 11, 2025
    Assignee: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu Chen
  • Publication number: 20250075258
    Abstract: The present disclosure is directed to methods of using salivary exosomes to detect and treat Sjögren's syndrome in a subject.
    Type: Application
    Filed: July 18, 2022
    Publication date: March 6, 2025
    Inventors: Sudipto Kumar CHAKRABORTTY, Steven LANG, Yevgenia Leona Khodor TOLAN, Martina RAUSCHER, Vasisht TADIGOTLA, Wei YU, Athena S. PAPAS, Johan Karl Olov SKOG, Brian C. HAYNES, Shuran XING
  • Publication number: 20250079228
    Abstract: A semiconductor processing apparatus includes a wafer chuck configured to hold a wafer on a top surface thereof. A plurality of lift-pin holes vertically extends through a chuck body of the wafer chuck. A plurality of lift pins are located in the plurality of lift-pin holes. A plurality of vacuum seal assemblies is located on a bottom portion of a respective one of the plurality of lift pins. Each vacuum seal assembly within the plurality of vacuum seal assemblies includes a respective set of ring segments that are configured to be assembled into a respective contiguous structure under a condition of an upward gas flow within a respective lift-pin hole selected from the plurality of lift-pin holes. Leaks in a vacuum seal between the wafer and the wafer chuck can be remedied by formation of at least one contiguous structure that provides an additional vacuum seal.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 6, 2025
    Inventors: Wei-Yu Tsai, Hung-Jui Kuo, Ming-Tan Lee
  • Publication number: 20250068423
    Abstract: Described herein is a graphics processor comprising first circuitry configured to execute a decoded instruction and second circuitry configured to second circuitry configured to decode an instruction into the decoded instruction. The second circuitry is configured to determine a number of registers within a register file that are available to a thread of the processing resource and decode the instruction based on that number of registers.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 27, 2025
    Applicant: Intel Corporation
    Inventors: Jorge Eduardo Parra Osorio, Jiasheng Chen, Supratim Pal, Vasanth Ranganathan, Guei-Yuan Lueh, James Valerio, Pradeep Golconda, Brent Schwartz, Fangwen Fu, Sabareesh Ganapathy, Peter Caday, Wei-Yu Chen, Po-Yu Chen, Timothy Bauer, Maxim Kazakov, Stanley Gambarin, Samir Pandya
  • Publication number: 20250067963
    Abstract: An imaging optical lens system includes eight lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The seventh lens element has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the seventh lens element has at least one convex critical point in an off-axis region thereof.
    Type: Application
    Filed: November 12, 2024
    Publication date: February 27, 2025
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Kuan-Ting YEH, Wei-Yu CHEN
  • Publication number: 20250070077
    Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.
    Type: Application
    Filed: November 7, 2024
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung
  • Publication number: 20250072060
    Abstract: Provided are a semiconductor structure and a manufacturing method thereof. The manufacturing method of the semiconductor structure includes the following. A gate structure is formed on a substrate. A tilt implanting process is performed to implant group IV elements into the substrate to form a doped region, and the doped region is located on two sides of the gate structure and partially located under the gate structure. A part of the substrate on two sides of the gate structure is removed to form a first recess. A cleaning process is performed on the surface of the first recess. A wet etching process is performed on the first recess to form a second recess. A semiconductor layer is formed in the second recess.
    Type: Application
    Filed: November 11, 2024
    Publication date: February 27, 2025
    Applicant: United Microelectronics Corp.
    Inventors: Kuang-Hsiu Chen, Wei-Chung Sun, Chao Nan Chen, Chun-Wei Yu, Kuan Hsuan Ku, Shao-Wei Wang
  • Patent number: 12236903
    Abstract: A display device and a backlight control method of the display device are provided. When a duration of an image occlusion period is shorter than a preset duration, a backlight driving circuit is controlled to respectively provide a first pulse current and a second pulse current in a first light emitting period and a second light emitting period in each frame period, so as to drive a backlight unit to provide a first backlight and a second backlight. Here, the first pulse current is greater than the second pulse current.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: February 25, 2025
    Assignee: Qisda Corporation
    Inventors: Chun-Chang Wu, Yi-Zong Jhan, Jen-Hao Liao, Tse-Wei Fan, Wei-Yu Chen, Fu-Tsu Yen, Feng-Lin Chen
  • Publication number: 20250061874
    Abstract: A server includes a chassis and a plurality of hard disk drive modules. The chassis includes a body, a partition, a cover plate, and at least one sound deadening structure. The body includes an opening and an accommodating space. The partition is disposed at the opening. The partition includes a first side surface, a second side surface opposite to the first side surface, and at least one flow channel. The first side surface faces the accommodating space, and the flow channel penetrates the first and the second side surfaces. The cover plate is disposed at the opening. The cover plate includes a plurality of ventilation holes. The sound deadening structure is disposed between the second side surface of the partition and the cover plate. The sound deadening structure includes a sound absorbing element and a reflecting element. The hard disk drive modules are accommodated in the accommodating space.
    Type: Application
    Filed: May 6, 2024
    Publication date: February 20, 2025
    Inventors: Chih-Chung HO, Chih-Wei YU
  • Publication number: 20250062139
    Abstract: Embodiments of the present disclosure provide a furnace for semiconductor processing that includes an inner tube defining a reaction chamber and including a sidewall defined along a longitudinal axis of the inner tube and including one or more slits defined through the sidewall in a radial direction with respect to the longitudinal axis. The one or more slits include at least one of a first slit with a width in a range between 10 mm and 100 mm, or a plurality of separate slits with a total number in a range between 2 and 15. The inner tube includes a closed end substantially enclosing the reaction chamber and an open end opposite the closed end with respect to the longitudinal axis. The reaction chamber is configured to be loaded with one or more semiconductor wafers via the open end.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 20, 2025
    Inventors: De-Wei YU, Chien-Chia CHENG, Ming-Hua YU, Hsueh-Chang SUNG, Chii-Horng LI
  • Publication number: 20250060567
    Abstract: A photographing optical lens system includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is convex in a paraxial region thereof. The seventh lens element has negative refractive power. The object-side surface of the seventh lens element is concave in a paraxial region thereof. At least one of all lens surfaces of the seven lens elements is aspheric and has at least one inflection point.
    Type: Application
    Filed: October 31, 2024
    Publication date: February 20, 2025
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Tzu-Chieh KUO, Wei-Yu CHEN
  • Patent number: 12232256
    Abstract: A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: February 18, 2025
    Assignee: Industrial Technology Research Institute
    Inventors: I-Hung Chiang, Hung-Hsien Ko, Min-Hsiung Liang, Te-Hsun Lin, Chen-Tsai Yang, Hao-Wei Yu
  • Patent number: 12230597
    Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: February 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20250053751
    Abstract: Implementations relate to generating multi-modal response(s) through utilization of large language model(s) (LLM(s)). Processor(s) of a system can: receive natural language (NL) based input, generate a multi-modal response that is responsive to the NL based output, and cause the multi-modal response to be rendered. In some implementations, and in generating the multi-modal response, the processor(s) can process, using a LLM, LLM input (e.g., that includes at least the NL based input) to generate LLM output, and determine, based on the LLM output, textual content for inclusion in the multi-modal response and multimedia content for inclusion in the multi-modal response. In some implementations, the multimedia content can be obtained based on a multimedia content tag that is included in the LLM output and that is indicative of the multimedia content. In various implementations, the multimedia content can be interleaved between segments of the textual content.
    Type: Application
    Filed: January 16, 2024
    Publication date: February 13, 2025
    Inventors: Oscar Akerlund, Evgeny Sluzhaev, Golnaz Ghiasi, Thang Luong, Yifeng Lu, Igor Petrovski, Agoston Weisz, Wei Yu, Rakesh Shivanna, Michael Andrew Goodman, Apoorv Kulshreshtha, Yu Du, Amin Ghafouri, Sanil Jain, Dustin Tran, Vikas Peswani, YaGuang Li
  • Publication number: 20250054934
    Abstract: An integrated circuit (IC) package includes a first integrated circuit (IC) device. An interconnection structure is disposed over the first IC device in a cross-sectional side view. The interconnection structure includes a plurality of interconnection components. A cavity is disposed in the interconnection structure in the cross-sectional side view. A second IC device is disposed at least partially within the cavity in the cross-sectional side view. The second IC device is electrically coupled to the first IC device through at least a subset of the interconnection components of the interconnection structure. A non-metallic material partially fills the cavity. The second IC device is at least partially surrounded by the non-metallic material in the cross-sectional side view and in a top view.
    Type: Application
    Filed: August 7, 2023
    Publication date: February 13, 2025
    Inventors: Wei-Yu Chou, Yang-Che Chen, Yi-Lun Yang, Ting-Yuan Huang, Hsiang-Tai Lu