Patents by Inventor Wen Chang

Wen Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926678
    Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: March 12, 2024
    Assignee: Immunwork Inc.
    Inventors: Tse-Wen Chang, Hsing-Mao Chu, Wei-Ting Tian, Yueh-Hsiang Yu
  • Patent number: 11927628
    Abstract: The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chu-Feng Liao, Hung-Ping Cheng, Yuan-Yao Chang, Shuo-Wen Chang
  • Publication number: 20240079524
    Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 7, 2024
    Inventors: Wei-Jen HSUEH, Shih-Chang LEE, Kuo-Feng HUANG, Wen-Luh LIAO, Jiong-Chaso SU, Yi-Chieh LIN, Hsuan-Le LIN
  • Publication number: 20240079278
    Abstract: A method includes forming a pad layer. The pad layer includes a first portion over a first part of a semiconductor substrate, and a second portion over a second part of the semiconductor substrate. The first portion has a first thickness, and the second portion has a second thickness smaller than the first thickness. The semiconductor substrate is then annealed to form a first oxide layer over the first part of the semiconductor substrate, and a second oxide layer over the second part of the semiconductor substrate. The pad layer, the first oxide layer, and the second oxide layer are removed. A semiconductor layer is epitaxially grown over and contacting the first part and the second part of the semiconductor substrate.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 7, 2024
    Inventors: Jhih-Yong Han, Wen-Yen Chen, Yi-Ting Wu, Tsai-Yu Huang, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20240079600
    Abstract: The present application provides a cathode plate, a secondary battery, a battery module, a battery pack, and an electric device. The cathode plate includes: a current collector, a conductive coating, and a cathode active layer. The conductive coating is arranged on at least one surface of the current collector. The conductive coating includes a conductive agent having a weight content of 20% to 50% and a binder having a weight content of 50%˜80%. The cathode active layer is arranged on a surface of the conductive coating away from the current collector, and a cathode active material in the cathode active layer is at least one of a lithium manganate-based cathode material, a ternary cathode material, and a quaternary cathode material.
    Type: Application
    Filed: October 31, 2023
    Publication date: March 7, 2024
    Inventors: Cuiping Zhang, Changlong Han, Chenghua Fu, Miaomiao Ren, Wen Chang, Peng Fan
  • Publication number: 20240077392
    Abstract: According to the present disclosure, a measuring method of liquid mixture purity includes steps as follows. A storage tank is provided, wherein the storage tank is configured for storing a liquid mixture including formic acid and water. A calculating unit is provided, wherein a plurality of formic acid purity values are saved in the calculating unit. A pressure-decreasing and heating step is performed by reducing a pressure of the storage tank and heating the storage tank. A measuring step is performed by measuring in the inner space of the storage tank to obtain a pressure value, and measuring the liquid mixture simultaneously to obtain a temperature value. A calculating step is performed by inputting the pressure value and the temperature value into the calculating unit, wherein the calculating unit outputs one of the formic acid purity values corresponding thereto.
    Type: Application
    Filed: April 11, 2023
    Publication date: March 7, 2024
    Inventors: Kuo-Liang YEH, Ya-Ju CHANG, Jung-Kuei PENG, Sheng-Tang CHANG, Min-Wen WENG, Wen-Ting HUANG
  • Publication number: 20240077479
    Abstract: A detection system and method for the migrating cell is provided. The system is configured to detect a migrating cell combined with an immunomagnetic bead. The system includes a platform, a microchannel, a magnetic field source, a coherent light source and an optical sensing module. The microchannel is configured to allow the migrating cell to flow in it along a flow direction. The magnetic field source is configured to provide magnetic force to the migrating cell combined with the immunomagnetic bead. The magnetic force includes at least one magnetic force component and the magnetic force component is opposite to the flow direction of the microchannel. The coherent light source is configured to provide the microchannel with the coherent light. The optical sensing module is configured to receive the interference light caused by the coherent light being reflected by the sample inside the microchannel.
    Type: Application
    Filed: August 10, 2023
    Publication date: March 7, 2024
    Applicant: DeepBrain Tech. Inc
    Inventors: Han-Lin Wang, Chia-Wei Chen, Yao-Wen Liang, Ting-Chun Lin, Yun-Ting Kuo, You-Yin Chen, Yu-Chun Lo, Ssu-Ju Li, Ching-Wen Chang, Yi-Chen Lin
  • Publication number: 20240071813
    Abstract: A dielectric structure is formed over a layer than contains a conductive component. An opening is formed in the dielectric structure. The opening exposes an upper surface of the conductive component. A first deposition process is performed that deposits a first conductive layer over the dielectric structure and partially in the opening. A treatment process is performed on a first portion of the first conductive layer formed over the dielectric structure. The treatment process introduces a non-metal material to the first portion of the first conductive layer. After the treatment process has been performed, a second deposition process is performed that at least partially fills the opening with a second conductive layer without trapping a gap therein.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Tzu-Yu Lin, Yao-Wen Chang
  • Patent number: 11916867
    Abstract: A system and method for intelligent message routing is provided. The system and method include a) storing, in one or more storage devices, a plurality of transmission rules for transmitting messages, b) receiving a message to be transmitted to a participant, c) comparing the message to the plurality of transmission rules, d) determining a first channel to transmit the message to a computer device associated with the participant based on the comparison, e) converting the message into a first message for transmission on the first channel, and f) transmitting the first message over the first channel.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: February 27, 2024
    Assignee: State Farm Mutual Automobile Insurance Company
    Inventors: Andrew Oliveira, Wen Ding, Benjamin E. Byrd, Holly Lambert, John Martinez, Jonathan Chang, Jose G. Aranguren, Maurice Pruna, Shagun Kariwala
  • Patent number: 11914436
    Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: February 27, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hung-Wen Chang, Ai-Tsung Li, Shih-Han Chen
  • Publication number: 20240063158
    Abstract: A method of making a semiconductor structure includes forming a first contact pad over an interconnect structure. The method further includes forming a second contact pad over the interconnect structure, wherein the second contact pad is electrically separated from the first contact pad. The method further includes depositing a first buffer layer over the interconnect structure, wherein the first buffer layer partially covers the second contact pad, and an edge of the second contact pad extends beyond the first buffer layer.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 22, 2024
    Inventors: Gulbagh SINGH, Chih-Ming LEE, Chi-Yen LIN, Wen-Chang KUO, C. C. LIU
  • Publication number: 20240063561
    Abstract: A medical device assembly is provided, including a main body and a battery-charging module detachably connected to the main body. A plurality of first conductive pins and two metal parts are disposed on the main body. The metal parts have high magnetic permeability, and they are not permanent magnets. A plurality of second conductive pins and two magnets are disposed on the battery-charging module, wherein the magnets are disposed in locations corresponding to the metal parts.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 22, 2024
    Inventors: Jung-Wen CHANG, Chien-Hung LIN
  • Patent number: 11908878
    Abstract: An image sensor includes a pixel and an isolation structure. The pixel includes a photosensitive region and a circuitry region next to the photosensitive region. The isolation structure is located over the pixel, where the isolation structure includes a conductive grid and a dielectric structure covering a sidewall of the conductive grid, and the isolation structure includes an opening or recess overlapping the photosensitive region. The isolation structure surrounds a peripheral region of the photosensitive region.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung, Sheng-Chan Li
  • Patent number: 11904603
    Abstract: An example printer including: a platen roller; a bushing connected to the platen roller, the bushing having a wing extending radially from the bushing; and a lower frame including: a channel to receive the platen roller in an operational position in which the platen roller is configured to feed media for a print head of the printer; an end piece defining an end of the channel, the end piece having an opening to receive the bushing when the platen roller is in the operational position; and a tab on the end piece, the tab positioned to interface with the wing of the bushing to secure the bushing in the opening such that the platen roller is maintained in the operational position within the channel.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: February 20, 2024
    Assignee: Zebra Technologies Corporation
    Inventors: Randal Mun Hon Wong, Shu-Hsun Chiang, Kuan-Ying Lu, Chia-Wen Chang, Hsinghan Tsai
  • Publication number: 20240053669
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, a first absorber layer disposed on the capping layer, a first multilayer disposed over the first absorber layer, a second absorber layer disposed on the first multilayer layer, and a second multilayer, which is an uppermost layer of the reflective mask, disposed over the second absorber layer.
    Type: Application
    Filed: March 20, 2023
    Publication date: February 15, 2024
    Inventors: Wen-Chang HSUEH, Ta-Cheng LIEN, Hsin-Chang LEE
  • Patent number: 11897959
    Abstract: An antibody or antibody fragment having a heavy chain variable region and/or light chain variable region that specifically binds to Axl protein. Immuoconjugages, pharmaceutical compositions and kits comprising the antibodies and antibody fragments are also provided. Also disclosed are methods of treating Axl-expressing cancers using the antibodies, antibody fragments, immunoconjugates and pharmaceutical compositions of the present invention.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: February 13, 2024
    Assignee: BIOATLA, INC.
    Inventors: Jay M. Short, Hwai Wen Chang, Gerhard Frey
  • Patent number: 11901387
    Abstract: A semiconductor device according to the present disclosure includes a semiconductor layer, a plurality of metal isolation features disposed in the semiconductor layer, a metal grid disposed directly over the plurality of metal isolation features, and a plurality of microlens features disposed over the metal grid.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung, Sheng-Chan Li
  • Publication number: 20240038265
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a lower electrode disposed within a dielectric structure over a substrate. A ferroelectric data storage structure is disposed over the lower electrode and an upper electrode is disposed over the ferroelectric data storage structure. One or more stressed sidewall spacers are arranged on opposing sides of the upper electrode. The ferroelectric data storage structure has an orthorhombic phase concentration that varies from directly below the one or more stressed sidewall spacers to laterally outside of the one or more stressed sidewall spacers.
    Type: Application
    Filed: January 5, 2023
    Publication date: February 1, 2024
    Inventors: Tzu-Yu Lin, Yao-Wen Chang
  • Patent number: D1016282
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: February 27, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Barry Lam, Chia-Yuan Chang, Jung-Wen Chang, Juan-Jung Li
  • Patent number: D1016283
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: February 27, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Barry Lam, Chia-Yuan Chang, Jung-Wen Chang, Kao-Yu Hsu