Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11721762
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming FinFET device structure are provided. The FinFET structure includes a substrate and an isolation structure formed on the substrate. The FinFET structure also includes a fin structure extending above the substrate, and the fin structure is embedded in the isolation structure. The FinFET structure further includes an epitaxial structure formed on the fin structure, the epitaxial structure has a pentagon-like shape, and an interface between the epitaxial structure and the fin structure is lower than a top surface of the isolation structure.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: August 8, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Zhe-Hao Zhang, Tung-Wen Cheng, Che-Cheng Chang, Yung-Jung Chang, Chang-Yin Chen
  • Publication number: 20230243697
    Abstract: The present application discloses a light sensor circuit, which comprises a photodiode and a capacitor unit. The cathode of the photodiode is controlled by a capacitive unit to maintain the same or close voltage level as the anode of the photodiode, which significantly reduces the effect of the dark current of the photodiode. Thus, the light sensor circuit can effectively maintain the performance and accuracy of an analog-to-digital converter applying the light sensor circuit. The circuit design difficulty and manufacturing cost are also significantly reduced.
    Type: Application
    Filed: October 6, 2022
    Publication date: August 3, 2023
    Inventors: WEN-CHENG CHEN, KAI-HSIANG CHAN, SHENG-WEN HUANG
  • Patent number: 11712089
    Abstract: A harness system includes an upper buckle, an upper strap and a restraining assembly including an anti-sliding structure and a beam structure. A through slot is formed on the upper buckle. The upper strap passes through the through slot. The beam structure is slidably disposed on the upper buckle. The anti-sliding structure is disposed on at least one of the beam structure and a wall of the through slot. The upper strap is engaged by the anti-sliding structure for restraining a sliding movement of the upper buckle relative to the upper strap and toward a shoulder portion when the upper strap is forced to drive the beam structure to slide relative to the upper buckle and toward the wall of the through slot.
    Type: Grant
    Filed: November 25, 2021
    Date of Patent: August 1, 2023
    Assignee: Wonderland Switzerland AG
    Inventors: Yen-Lin Lee, Kai-Wen Cheng, Chih-Wei Wang
  • Patent number: 11713242
    Abstract: In some embodiments, a sensor is provided. The sensor includes a microelectromechanical systems (MEMS) substrate disposed over an integrated chip (IC), where the IC defines a lower portion of a first cavity and a lower portion of a second cavity, and where the first cavity has a first operating pressure different than an operating pressure of the second cavity. A cap substrate is disposed over the MEMS substrate, where a first pair of sidewalls of the cap substrate partially define an upper portion of the first cavity, and a second pair of sidewalls of the cap substrate partially define an upper portion of the second cavity. A sensor area comprising a movable portion of the MEMS substrate and a dummy area comprising a fixed portion of the MEMS substrate are both disposed in the first cavity. A pressure enhancement structure is disposed in the dummy area.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: August 1, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Fei-Lung Lai, Kuei-Sung Chang, Shang-Ying Tsai
  • Publication number: 20230239449
    Abstract: A stereoscopic image generating method is provided. The method includes: processing a first image to obtain depth data of each pixel in the first image, and generating a first depth-information map, wherein the first depth-information map includes depth information corresponding to each pixel; performing uniform processing on a plurality of edge pixels which are within a predetermined width from a plurality of edges of the first depth-information map, so that the processed edge pixels have the same depth information to establish a second depth-information map; setting a pixel offset corresponding to each pixel in the first image based on the depth information corresponding to each pixel of the second depth-information map; performing pixel offset processing on the first image to generate a second image; and outputting the first image and the second image to the display unit to display a stereoscopic image.
    Type: Application
    Filed: October 19, 2022
    Publication date: July 27, 2023
    Inventors: Chih-Haw TAN, Wen-Cheng HSU, Shih-Hao LIN, Sergio CANTERO CLARES
  • Publication number: 20230239458
    Abstract: A method for generating stereoscopic images is provided. The method includes: creating a three-dimensional mesh to obtain a stereoscopic scene and capturing a two-dimensional image of the stereoscopic scene; performing image preprocessing to obtain a first image in response to the two-dimensional image not being a side-by-side image; utilizing a graphics processing pipeline to perform depth estimation on the first image to obtain a depth image, to update the three-dimensional mesh according to a depth setting of the depth image, and to map the three-dimensional mesh to a corresponding coordinate system; utilizing the graphics processing pipeline to project the first image onto the mapped three-dimensional mesh to obtain an output three-dimensional mesh, and to capture an output side-by-side image from the output three-dimensional mesh; and utilizing the graphics processing pipeline to weave a left-eye and right-eye image into an output image, and to display the output image.
    Type: Application
    Filed: November 10, 2022
    Publication date: July 27, 2023
    Inventors: Sergio CANTERO CLARES, Wen-Cheng HSU, Shih-Hao LIN, Chih-Haw TAN
  • Publication number: 20230240036
    Abstract: In example implementations, an apparatus is provided. The apparatus includes a riser card body, a first interface, a first 2×8 slot on a surface of the riser card body, and a second 2×8 slot on a same side of the surface of the riser card body as the first 2×8 slot. The first interface includes a first set of fingers and a second set of fingers at an end of the riser card body to connect to a peripheral component interconnect e×press (PC1e) slot of a motherboard. The first 2×8 slot and the second 2×8 slot are positioned perpendicular to the PCIe slot of the motherboard.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventors: Yu Lih Chuang, Yen-Tang Chang, Heather Louise Burnam Volesky, Jonathan D. Bassett, Wen Bin Lin, Chao-Wen Cheng
  • Publication number: 20230239450
    Abstract: A stereoscopic image generation box, a stereoscopic image display method and a stereoscopic image display system are provided. The stereoscopic image generation box includes an image receiving and detecting unit, a depth information analysis unit, an image processing unit, a synthesis unit and a data transmission unit. The image receiving and detecting unit is used for receiving a two-dimensional image from an image source. The depth information analysis unit is used for obtaining a depth information according to the two-dimensional image. The image processing unit is used for converting the two-dimensional image into a left-eye image and a right-eye image according to the depth information. The synthesizing unit is used for synthesizing the left-eye image and the right-eye image to generate a stereoscopic image. The data transmission unit is used for outputting the stereoscopic image to a display, so that the display can directly display the stereoscopic image.
    Type: Application
    Filed: January 13, 2023
    Publication date: July 27, 2023
    Applicant: Acer Incorporated
    Inventors: Wen-Cheng Hsu, Chao-Kuang Yang
  • Patent number: 11707876
    Abstract: A polyester film and a method for producing the same are provided. The polyester film includes a heat resistant layer. The heat resistant layer includes a high temperature resistant resin material and a polyester resin material. The high temperature resistant resin material and the polyester resin material are melted and kneaded with each other via a twin screw granulator. The twin-screw granulator has a twin-screw temperature between 250° C. and 320° C., and the twin-screw granulator has a twin-screw rotation speed between 300 rpm and 800 rpm, so that the high temperature resistant resin material is dispersed in the polyester resin material with a particle size of between 50 nm and 200 nm.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: July 25, 2023
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Wen-Cheng Yang, Te-Chao Liao, Hao-Sheng Chen, Chien-Chih Lin
  • Patent number: 11705519
    Abstract: A semiconductor device includes a Fin FET device. The Fin FET device includes a first fin structure extending in a first direction and protruding from an isolation insulating layer, a first gate stack including a first gate electrode layer and a first gate dielectric layer, covering a portion of the first fin structure and extending in a second direction perpendicular to the first direction, and a first source and a first drain, each including a first stressor layer disposed over the first fin structure. The first fin structure and the isolation insulating layer are disposed over a substrate. A height Ha of an interface between the first fin structure and the first stressor layer measured from the substrate is greater than a height Hb of a lowest height of the isolation insulating layer measured from the substrate.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: July 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yen Yu, Che-Cheng Chang, Tung-Wen Cheng, Zhe-Hao Zhang, Bo-Feng Young
  • Patent number: 11703475
    Abstract: A method includes mounting an integrated electro-microfluidic probe card to a device area on a bio-sensor device wafer, wherein the electro-microfluidic probe card has a first major surface and a second major surface opposite the first major surface. The method further includes electrically connecting at least one electronic probe tip extending from the first major surface to a corresponding conductive area of the device area. The method further includes stamping a test fluid onto the device area. The method further includes measuring via the at least one electronic probe tip a first electrical property of one or more bio-FETs of the device area based on the test fluid.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: July 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng, Chun-Wen Cheng
  • Publication number: 20230220235
    Abstract: A method for manufacturing a heat sealable polyester film is provided. A part of a recycled polyester material is physically reproduced to obtain physically regenerated polyester chips. Another part of a recycled polyester material is chemically reproduced to obtain chemically regenerated polyester chips. Modified polyester chips, the physically regenerated polyester chips and the chemically regenerated polyester chips are mixed to form a raw material mixture, and the modified polyester chips are formed from the recycled polyester material. The raw material mixture is used to form a heat sealable layer. A base layer is disposed onto the heat sealable layer so as to obtain the heat sealable polyester film. A heat sealing temperature of the heat sealable polyester film ranges from 120° C. to 230° C.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 13, 2023
    Inventors: Wen-Cheng Yang, TE-CHAO LIAO, Chia-Yen Hsiao, CHING-YAO YUAN
  • Patent number: 11700651
    Abstract: A method of radio bearer transmission in dual connectivity for a network in a long term evolution (LTE) system is disclosed. The method comprises generating at least a packet data convergence protocol protocol data unit (PDCP PDU) by a PDCP entity of the network corresponding to a radio bearer (RB), and assigning each PDCP PDU with an identity, wherein the identity indicates which PDCP entity the PDCP PDU belongs to.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: July 11, 2023
    Assignee: ACER INCORPORATED
    Inventors: Hung-Chen Chen, Ching-Wen Cheng
  • Publication number: 20230212364
    Abstract: A method for manufacturing a polyester film for embossing that is made from a recycled polyester material. A part of the recycled polyester material is physically reproduced to obtain physically regenerated polyester chips. The physically regenerated polyester chips include physically regenerated regular polyester chips. Another part of the recycled polyester material is chemically reproduced to obtain chemically regenerated polyester chips. The chemically regenerated polyester chips include chemically regenerated regular polyester chips and chemically regenerated electrostatic pinning polyester chips. The physically regenerated polyester chips and the chemically regenerated polyester chips are mixed to form a base material. The base material is used to form a base layer that having a main component of regenerated polyethylene terephthalate. A surface coating layer is formed onto the base layer. A material of the surface coating layer includes a main resin, fillers, and melamine.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 6, 2023
    Inventors: Wen-Cheng Yang, TE-CHAO LIAO, Chia-Yen Hsiao, Yu-Chi Hsieh
  • Publication number: 20230213915
    Abstract: Examples for controlling an operating speed of a cooling device based on an operating mode of a processing unit, are described. In an example, a current value of a monitored current signal is determined. Based on the comparison of the current value with a predefined threshold value, a switch in an operating mode of the processing unit is determined. Thereafter, the computing device may be caused to increase the operating speed of the cooling device to a designated speed.
    Type: Application
    Filed: June 19, 2020
    Publication date: July 6, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chao-Wen Cheng, Yu-Fan Chen, Mo-Hsuan Lin
  • Publication number: 20230206924
    Abstract: A voice wakeup method is applied to wake up an electronic apparatus. The voice wakeup method includes executing a speaker identification function to analyze user voice and acquire a predefined identification of the user voice, executing a voiceprint extraction function to acquire a voiceprint segment of the user voice, executing an on-device training function via the voiceprint segment to generate an updated parameter, and utilizing the updated parameter to calibrate a speaker verification model, so that the speaker verification model is used to analyze a wakeup sentence and decide whether to wake up the electronic apparatus.
    Type: Application
    Filed: June 30, 2022
    Publication date: June 29, 2023
    Applicant: MEDIATEK INC.
    Inventors: Chao-Ling Hsu, Yiou-Wen Cheng, Cheng-Kuan Wei
  • Publication number: 20230203333
    Abstract: A printable substrate including a polymer substrate and a coating layer is provided. The coating layer covers the polymer substrate. The thickness of the coating layer is 0.1 ?m to 30 ?m. The surface impedance value of the coating layer is 107 ohms to 1012 ohms. The maximum printable temperature of the printable substrate is 100° C. to 190° C. After printing on the coating layer of the printable substrate, the result of an adhesion test for the printable substrate is 3B to 5B.
    Type: Application
    Filed: July 14, 2022
    Publication date: June 29, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wen-Cheng Yang, Ching-Yao Yuan, Yu-Chi Hsieh
  • Publication number: 20230198755
    Abstract: The invention introduces an apparatus for detecting errors during data encryption. The apparatus includes an encoding circuitry and an error detection circuitry. The encoding circuitry is arranged operably to realize an encryption algorithm including multiple rounds, in which of each round encodes plaintext or an intermediate encryption result with a round key. The error detection circuitry is arranged operably to: calculate redundant data corresponding to the intermediate encryption result; and output an error signal to a processing unit when finding that the intermediate encryption result does not match the redundant data at a check point during an encryption process.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 22, 2023
    Applicant: Silicon Motion, Inc.
    Inventors: Wun-Jhe WU, Po-Hung CHEN, Chiao-Wen CHENG, Jiun-Hung YU, Chih-Wei LIU
  • Publication number: 20230196737
    Abstract: An image recognition method and an electronic apparatus configured for image recognition are provided. A training sample set is provided to train a recognition model including neural networks to recognize a classification label to which an image to be tested belongs through the trained recognition model. The training sample set includes image sets respectively belonging to users. During the training process, training images corresponding to classification labels are obtained from a first image set in the training sample set as reference images for training; a training image is obtained from a second image set different from the first image set as an input image for training; the reference images for training and the input image for training are obtained as inputs to the neural networks for training. The input to each neural network includes at least one of the reference images for training and the input image for training.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 22, 2023
    Applicants: Industrial Technology Research Institute, Taichung Veterans General Hospital
    Inventors: Yu-An Chiou, Yueh-Se Li, Shih-Fang Yang Mao, Wen-Cheng Chao, Sou-Jen Shih, Shu-Fang Liu, Hui-Jiun Chen, Chieh-Liang Wu
  • Publication number: 20230197097
    Abstract: A sound enhancement method is applied to a communication apparatus with an operation processor for increasing speech quality. The sound enhancement method includes the operation processor utilizing a sound receiver of the communication apparatus to acquire an input source, the operation processor applying a first calibration model to the input source for executing communication calibration and simultaneously analyzing the input source to determine whether to establish a second calibration mode, and the operation processor utilizing the second calibration mode to execute the communication calibration when the second calibration mode is established.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 22, 2023
    Applicant: MEDIATEK INC.
    Inventors: Liang-Che Sun, Yiou-Wen Cheng, Chi-Sheng Wu