Abstract: Herein described is a method of operating an accumulation process in a data processing apparatus. The accumulation process comprises a plurality of accumulations which output a respective plurality of accumulated values, each based on a stored value and a computed value generated by a data processing operation. The method comprises storing a first accumulated value, the first accumulated value being one of said plurality of accumulated values, into a first storage device comprising a plurality of single-bit storage elements; determining that a predetermined trigger has been satisfied with respect to the accumulation process; and in response to the determining, storing at least a portion of a second accumulated value, the second accumulated value being one of said plurality of accumulated values, into a second storage device.

Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.

Abstract: A touchpad module includes a touch member, a bracket, a piezoelectric vibration unit and an elastic element. The bracket is located under the touch member. A portion of the touch member is exposed to a first perforation of the bracket. The piezoelectric vibration unit is aligned with the first perforation of the bracket. The piezoelectric vibration unit has a first surface and a second surface, which are opposed to each other. The elastic element installed on the bracket and contacted with the second surface of the piezoelectric vibration unit. When the piezoelectric vibration unit vibrates, a first reaction force is generated between the first surface of the piezoelectric vibration unit and the portion of the touch member exposed to the first perforation, and a second reaction force is generated between the second surface of the piezoelectric vibration unit and the elastic element.

Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

Abstract: Various embodiments of the present application are directed towards a semiconductor packaging device including a shield structure configured to block magnetic and/or electric fields from a first electronic component and a second electronic component. The first and second electronic components may, for example, be inductors or some other suitable electronic components. In some embodiments, a first IC chip overlies a second IC chip. The first IC chip includes a first substrate and a first interconnect structure overlying the first substrate. The second IC chip includes a second substrate and a second interconnect structure overlying the second substrate. The first and second electronic components are respectively in the first and second interconnect structures. The shield structure is directly between the first and second electronic components.

Abstract: Approaches for controlling the transmit power of antennas of a communication device, are described. The communication device may include a first wireless communication module and a second wireless communication module. In an example, the first wireless communication module may be coupled to a first antenna.

Abstract: Provided herein are methods and compositions for inhibiting p97, for the treatment of a coronavirus infection in a subject, or a symptom thereof. Upon treatment, the coronavirus infection, or a symptom thereof is reduced in the subject.

Abstract: In some embodiments, a field effect transistor (FET) structure comprises a body structure, dielectric structures, a gate structure and a source or drain region. The gate structure is formed over the body structure. The source or drain region is embedded in the body structure beside the gate structure, and abuts and is extended beyond the dielectric structure. The source or drain region contains stressor material with a lattice constant different from that of the body structure. The source or drain region comprises a first region formed above a first level at a top of the dielectric structures and a second region that comprises downward tapered side walls formed under the first level and abutting the corresponding dielectric structures.

Abstract: A control method and a time aware bridge device for a seamless Precision Time Protocol (PTP) are provided. The control method includes: utilizing the time aware bridge device to pre-configure a first control signal source as a master control signal source, and pre-configure a second control signal source as a backup control signal source; utilizing the time aware bridge device to determine whether one or more packets from the master control signal source conform to at least one predetermined rule to generate a determination result; and selectively configuring the second control signal source as the master control signal source according to the determination result.

Abstract: An augmented reality (AR) system and an operation method thereof are provided. The AR system includes a target device and an AR device. The target device senses an attitude of the target device to generate attitude information, and provides a digital content and the attitude information to the AR device. The AR device captures the target device to generate an image. The AR device tracks a target location of the target device in the image to perform an AR application. When performing the AR application, the AR device overlays the digital content on the target location in the image, and correspondingly adjusts an attitude of the digital content in the image based on the attitude information of the target device.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: A portable electronic device, including a first body and a second body, is provided. The second body includes a support structure and a display panel. The support structure is pivotally connected to the first body and is connected to the display panel. The support structure has a first bendable portion. An included angle between the first bendable portion and an edge of the support structure is 45 degrees. The support structure is adapted to be bent along the first bendable portion, so that the second body switches between a first mode and a second mode relative to the first body.

Abstract: A 3D display system and a 3D display method are provided. The 3D display system includes a 3D display, a memory and one or more processors. The memory records a plurality of modules, and the processor accesses and executes the modules recorded by the memory. The modules include a bridge interface module and a 3D display service module. When an application is executed by the processor, the bridge interface module creates a virtual extend screen, and moves the application to the virtual extend screen. The bridge interface module obtains a 2D content frame of the application from the virtual extend screen by a screenshot function. The 3D display service module converts the 2D content frame into a 3D format frame by communicating with a third-party software development kit, and provides the 3D format frame to the 3D display for displaying.

Abstract: Example implementations relate to power supply controllers. In some examples, a controller can include instructions to: set a power threshold for a power supply coupled to a computing component when the computing component is operating in a first state, determine when the computing component is alternating from the first state to a second state, and allow the power supply to exceed the power threshold for a fixed period of time in response to the computing component alternating from the first state to the second state.

Abstract: Some embodiments relate to a memory device. The memory device includes a substrate comprising an inter-metal dielectric layer having a metal line, a dielectric layer over the substrate, a bottom electrode via through the dielectric layer and in contact with the metal line, a bottom electrode over the bottom electrode via, a magnetic tunneling junction (MTJ) element over the bottom electrode, and a top electrode over the MTJ element. A center portion of the bottom electrode directly above the bottom electrode via is thicker than an edge portion of the bottom electrode.

Abstract: An augmented reality (AR) system and an operation method thereof are provided. The AR system includes a target device and an AR device. The AR device captures the target device to generate a picture. The target device provides a digital content to the AR device. The AR device tracks the target device in the picture for an AR application. During the AR application, the AR device overlays the digital content on the target device in the picture.

Abstract: A method includes providing a jig including a predetermined center and a magnetron installed on the jig; rotating the magnetron and obtaining a measured first magnetic flux density at the predetermined center of the jig; defining a first area of the magnetron based on the measured first magnetic flux density; rotating the magnetron and measuring a plurality of second magnetic flux densities within the first area of the magnetron; deriving a measured second magnetic flux density among the plurality of second magnetic flux densities; comparing the measured second magnetic flux density with a predetermined threshold; and performing an operation based on the comparison.

Abstract: Stress memorization techniques (SMTs) for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes forming a capping layer over a fin structure; forming an amorphous region within the fin structure while the capping layer is disposed over the fin structure; and performing an annealing process to recrystallize the amorphous region. The capping layer enables the fin structure to retain stress effects induced by forming the amorphous region and/or performing the annealing process.

Abstract: There is provided a photographing device having two output interfaces that respectively used to output a first image frame and a second image frame. The first image frame is provided to a processor of the photographing device to perform the feature extraction and tag the second image frame accordingly. The tagged second image frame is for the image recording of an external back end.