Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130279320
    Abstract: In an example embodiment, there is disclosed an apparatus comprising a plurality of ports and routing logic coupled with the plurality of ports. The routing logic obtains data representative of a first port configuration for the plurality of ports, the first port configuration comprises data representative of a status for individual ports selected from the plurality of ports, the status indicating whether an individual port selected from the plurality of ports is an open port, an alternate port, or a failed port. The routing logic forwards data in accordance with the first port configuration. The routing logic also obtains data representative of an alternate port configuration for the plurality of ports, the alternate port configuration is to be employed upon determining a predefined link has failed. The alternate configuration comprising a new status for individual ports selected from the plurality of ports.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 24, 2013
    Inventors: Linda Tin-Wen CHENG, Krishna Kumar VAVILALA
  • Publication number: 20130279554
    Abstract: An apparatus for correcting a phase error is provided. The apparatus includes an error estimating module and a correcting module. The error estimating module receives a phase-shift keying signal, and calculates a phase error according to the phase-shift keying signal, a plurality of known candidate signals and Bayesian estimation. The correcting module corrects the phase-shift keying signal according to the phase error.
    Type: Application
    Filed: September 13, 2012
    Publication date: October 24, 2013
    Applicant: MSTAR SEMICONDUCTOR, INC.
    Inventors: Kai-Wen Cheng, Yi-Ying Liao, Tung-Sheng Lin, Tai-Lai Tung
  • Patent number: 8565428
    Abstract: A network device for building up a network connection via a high-definition multimedia interface, includes a scrambler, a descrambler, a comparator and a control unit. The scrambler is utilized for generating a transmission signal according to a first seed. The descrambler is for decoding a receiving signal to generate a second seed. The comparator is for generating a comparing result according to the first seed and the second seed. The control unit is for controlling the network connection according to the comparing result.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: October 22, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventors: Liang-Wei Huang, Shieh-Hsing Kuo, Chun-Hung Liu, Kai-Wen Cheng
  • Patent number: 8561267
    Abstract: A composite-material buckle contains a base including a first segment with an engaging face and a second segment, between the first segment and the second segment being defined two side walls having two symmetrical holes and two symmetrically elongated pivoting portions respectively; a shaft including two ends inserted into the two symmetrical holes respectively; a plastic press member including a pressing portion and an actuating portion secured, and between the pressing portion and the actuating portion being defined a through aperture, the plastic press member including an elastic arm; a metal member connected with the pressing portion of the plastic press member so that the metal member covers the pressing portion and contacts with the engaging face of the base, and the metal member including a number of retaining teeth arranged thereon.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: October 22, 2013
    Assignee: Win Chance Metal Co., Ltd.
    Inventor: Wen Cheng Chang
  • Patent number: 8557006
    Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: October 15, 2013
    Assignee: Epoch Material Co., Ltd.
    Inventors: Hui-Fang Hou, Wen-Cheng Liu, Yen-Liang Chen, Jui-Ching Chen
  • Patent number: 8551798
    Abstract: The present disclosure provides a microstructure device with an enhanced anchor and a narrow air gap. One embodiment of a microstructure device provided herein includes a layered wafer. The layered wafer includes a silicon handle layer, a buried oxide layer formed on the handle layer, and a silicon device layer formed on the buried oxide layer. A top oxide layer is formed on the device layer. The top oxide layer, the device layer, and the buried oxide layer are etched, thereby forming trenches to create an anchor and a microstructure device in the device layer. In process of fabricating the device, a thermal oxide layer is formed along sides of the microstructure device to enclose the microstructure device in the buried oxide layer, the top oxide layer and the thermal oxide layer. Then, a poly layer if formed to fill in the trenches and enclose the anchor. After the poly layer fills in the trenches, the oxide layers enclosing the microstructure device are etched away, releasing the microstructure device.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: October 8, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hsien Lin, Chia-Hua Chu, Chun-Wen Cheng
  • Patent number: 8552547
    Abstract: An embodiment of the invention provides a method for forming an electronic device package, which includes providing a carrier substrate having an upper surface and an opposite lower surface; forming a cavity from the upper surface of the carrier substrate; disposing an electronic device having a conducting electrode in the cavity; forming a filling layer in the cavity, wherein the filling layer surround the electronic device; thinning the carrier substrate from the lower surface to a predetermined thickness; forming at least a through-hole in the electronic device or the in the carrier substrate; and forming a conducting layer over a sidewall of the through-hole, wherein the conducting layer electrically connects to the conducting electrode.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: October 8, 2013
    Inventors: Wen-Cheng Chien, Ching-Yu Ni, Shu-Ming Chang
  • Patent number: 8550345
    Abstract: This invention provides an RFID real-time information system accommodated to a semiconductor supply chain for exchanging real-time information. The RFID real-time information system is characterized by comprising an RFID middleware module for generating a stock and logistic information corresponding to a plurality of carriers and wafers from a tag information; a manufacturing information module for storing an object information corresponding to the plurality of wafers; a real-time information module for integrating the RFID middleware module with the manufacturing information module to generate real-time information corresponding to the plurality of wafers and carriers; and a business-to-business (B2B) e-commerce module comprising a plurality of B2B servers respectively disposed in vendors in the semiconductor supply chain for connecting and exchanging the real-time information through a standard protocol of e-commerce.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: October 8, 2013
    Assignee: Chipmos Technologies Inc.
    Inventors: Cheng-Fang Huang, Pin-Hsun Huang, Chih-Hsiang Wang, Wen-Cheng Hsu, Yi-fang cho, An-Hong Liu, Yi-Chang Lee
  • Patent number: 8554268
    Abstract: A control method for a communication device is provided. The control method includes the steps of: determining whether the communication device is in a wrong communication state when a call of a communication function is made from the communication device, and if the communication device is in the wrong communication state, prohibiting the communication function from being performed by the communication device after the call is finished.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: October 8, 2013
    Assignee: Mediatek Singapore Pte, Ltd.
    Inventors: Maobin Guo, Yiou-Wen Cheng
  • Publication number: 20130256787
    Abstract: A method for contacting MOS devices. First openings in a photosensitive material are formed over a substrate having a top dielectric in a first die area and a second opening over a gate stack in a second die area having the top dielectric, a hard mask, and a gate electrode. The top dielectric layer is etched to form a semiconductor contact while etching at least a portion the hard mask layer thickness over a gate contact area exposed by the second opening. An inter-layer dielectric (ILD) is deposited. A photosensitive material is patterned to generate a third opening in the photosensitive material over the semiconductor contact and a fourth opening inside the gate contact area. The ILD is etched through to reopen the semiconductor contact while etching through the ILD and residual hard mask if present to provide a gate contact to the gate electrode.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 3, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: FEI XIE, WEN CHENG TIEN, YA PING CHEN, LI BIN MAN, KUO JUNG CHEN, YU LIU, TIAN YI ZHANG, SISI XIE
  • Publication number: 20130259692
    Abstract: An exemplary fan includes a hub and an impeller. The hub is made of metal, and includes a flange. The impeller is made of plastic. The impeller is formed around the hub and has the flange embedded therein. A method for manufacturing the fan is also provided.
    Type: Application
    Filed: December 17, 2012
    Publication date: October 3, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: WEN-CHENG CHEN
  • Publication number: 20130258201
    Abstract: A signal processing apparatus includes an initial detecting module, a mixer, a symbol rate detecting module, a judging module and a correcting module. The initial detecting module determines an initial carrier frequency offset of an input signal according to a spectrum of the input signal. The mixer adjusts the input signal according to the initial carrier frequency offset to generate a frequency-compensated signal. The symbol rate detecting module determines a symbol rate of the input signal. The judging module judges whether the initial carrier frequency offset is correct according to the frequency-compensated signal. When a judgment result of the judging module is negative, the correcting module determines a corrected carrier frequency offset according to the symbol rate and the spectrum.
    Type: Application
    Filed: March 18, 2013
    Publication date: October 3, 2013
    Inventors: Chu-Hsin Chang, Kai-Wen Cheng, Yi-Ying Liao, Tung-Sheng Lin, Tai-Lai Tung
  • Patent number: 8546860
    Abstract: This disclosure relates to an active pixel cell including a shallow trench isolation (STI) structure. The active pixel cell further includes a photodiode neighboring the STI structure, where a first stress resulted from substrate processing prior to deposition of a pre-metal dielectric layer increases dark current and white cell counts of a photodiode of the active pixel cell. The active pixel cell further includes a transistor, where the transistor controls the operation of the active pixel cell. The active pixel cell further includes a stress layer over the photodiode, the STI structure, and the transistor, and the stress layer has a second stress that counters the first stress exerted on the substrate, and the second stress reduces the dark current and the white cell counts caused by the first stress.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: October 1, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ru-Shang Hsiao, Nai-Wen Cheng, Chung-Te Lin, Chien-Hsien Tseng, Shou-Gwo Wuu
  • Patent number: 8547985
    Abstract: The disclosure is a network interface controller (NIC) capable of sharing buffers, which is coupled to a host and a network to make the network connection. The NIC includes a transmitting buffer, a transmitting controller, a receiving buffer, and a receiving controller. The transmitting controller controls the transmitting buffer to transmit the transmission data provided by the host to the network. The receiving controller controls the receiving buffer to transmit the reception data received from the network to the host, and determines a storage capacity of the receiving buffer. When the storage capacity is smaller than a set value, the receiving controller transmits a request signal to the transmitting controller, the transmitting controller generates a response signal according to the request signal and a status signal corresponding to the transmitting buffer, and the receiving controller controls whether reception data is stored in the transmitting buffer according to the response signal.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: October 1, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventors: Kuo-Nan Yang, Yen-Hsu Shih, Chia-Ying Chiu, Kai-Wen Cheng
  • Publication number: 20130253867
    Abstract: A signal processing apparatus for receiving a spectral line of an original signal includes a starting point determining module, a searching module and a symbol rate determining module. The starting point determining module finds a maximum energy in the spectral line and determines at least one search starting point according to the maximum energy. From the at least one search starting point, the searching module searches along the spectral line towards a region with a lower energy for at least one minimum energy satisfying a predetermined condition. The symbol rate determining module determines a symbol rate of the original signal according to the at least one minimum energy.
    Type: Application
    Filed: September 13, 2012
    Publication date: September 26, 2013
    Applicant: MSTAR SEMICONDUCTOR, INC.
    Inventors: Chu-Hsin Chang, Kai-Wen Cheng, Yi-Ying Liao, Tung-Sheng Lin, Tai-Lai Tung
  • Patent number: D690649
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: October 1, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D690650
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 1, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D690651
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: October 1, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D691087
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 8, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D691556
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 15, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen