Patents by Inventor Wen Chun Huang
Wen Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250072077Abstract: A semiconductor device and method of fabricating the same, the semiconductor device includes a substrate, a metal gate structure, at least one dummy body, two source/drain regions, and a dielectric layer. The metal gate structure is disposed on the substrate. The at least one dummy body is disposed within the metal gate structure. The source/drain regions are disposed at two sides of the metal gate structure respectively in the substrate. The dielectric layer is disposed on the substrate, around the metal gate structure.Type: ApplicationFiled: September 19, 2023Publication date: February 27, 2025Applicant: United Semiconductor (Xiamen) Co., Ltd.Inventors: Wei-Chun Chang, You-Di Jhang, Han-Min Huang, Chin-Chun Huang, WEN YI TAN
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Publication number: 20250071923Abstract: A card edge connector includes: a connector base having a card slot and plural terminals; a latch located at one end of the connector base for locking a card; and a releasing member. The releasing member includes two levers and a moving member, the levers are connected with the connector base in a pivoting manner, a first end of the lever is connected with the latch and an opposite second end of the lever is coupled to the moving member, wherein when the card is inserted into the slot and presses against the moving member downwards, the moving member drives the second ends of the levers to move downward, resulting in the first ends moving upwards to push the latch to lock with the card, and when the card is pulled out the moving member resets and drives the levers to release the latch from the card.Type: ApplicationFiled: August 19, 2024Publication date: February 27, 2025Inventors: KUO-CHUN HSU, Ming-Yi Gong, Yu-Che Huang, Wen-Lung Hsu, Po-Fu Chen, Xun Wu, Wen-Ting Yu, Chin-Chuan Wu, Wei-Chia Liao
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Publication number: 20250065254Abstract: A method is provided for supporting environmental control in a semiconductor wafer processing space, the method includes: flowing a first gas under pressure in a first direction through a first diffuser tube, thereby generating a first lateral flow of gas through a sidewall of the first diffuser tube; flowing a second gas under pressure in a second direction through a second diffuser tube, thereby generating a second lateral flow of gas through a sidewall of the second diffuser tube, the second direction being opposite the first direction; combining the first and second lateral flows of gas within a housing; and outputting the combined lateral flows of gas from the housing to produce a laminar gas flow covering an opening to the semiconductor wafer processing space.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Jyh-Shiou Hsu, Wen-Hsun Tsai, Chien-Chun Hu, Kuang-Wei Cheng, Sung-Ju Huang
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Publication number: 20250070092Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
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Patent number: 12235543Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and an adhesive material. The frame includes a side wall and a back plate. The working panel is disposed on the back plate. The case is disposed on the frame and adjacent to the working panel. The adhesive material is disposed on the case. The side wall has an outer surface facing away from the working panel. In a cross-section view of the electronic device, a portion of the adhesive material is in contact with the outer surface of the side wall of the frame, and a length of the adhesive material is greater than or equal to 50% of a length of the side wall of the frame along an extension direction.Type: GrantFiled: March 19, 2024Date of Patent: February 25, 2025Assignee: INNOLUX CORPORATIONInventors: Wen-Cheng Huang, Ting-Sheng Chen, Chia-Chun Yang, Chin-Cheng Kuo
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Publication number: 20250062132Abstract: The invention provides an etching method of a semiconductor structure, which comprises providing a substrate with a gate structure, an oxide layer and a first nitride layer beside the gate structure, and performing an etching step to remove the first nitride layer and keep the oxide layer, wherein in the etching step, the etching selectivity ratio of the etched nitride material to the etched oxide material is greater than 300.Type: ApplicationFiled: September 14, 2023Publication date: February 20, 2025Applicant: United Semiconductor (Xiamen) Co., Ltd.Inventors: Yanjie Liu, Bing Du, LaiJiao Liu, Hailong Gu, Chin-Chun Huang, Wen Yi Tan
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Publication number: 20250053039Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.Type: ApplicationFiled: July 11, 2024Publication date: February 13, 2025Applicant: E Ink Holdings Inc.Inventors: Chia-Ming Hsieh, Chi-Mao Hung, Sung-Hui Huang, Chuen-Jen Liu, Liang-Yu Yan, Pei Ju Wu, Po-Chun Chuang, Che-Sheng Chang, Wen-Chung Yang
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Publication number: 20250046720Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a device layer, and a metallization structure. The substrate has a first surface. The device layer is over the first surface of the substrate. The device layer includes a plurality of passive component units. The metallization structure is over the device layer. The metallization structure includes a conductive bridge portion electrically connecting two adjacent passive component units.Type: ApplicationFiled: August 1, 2023Publication date: February 6, 2025Inventors: WEN-LIANG CHEN, CHUNG-CHIANG HUANG, YING-CHUN LIN, YEN-JUN LI
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Patent number: 12219886Abstract: A resistive memory device includes a stacked structure and a copper via conductor structure. The stacked structure includes a first electrode, a second electrode, and a variable resistance layer. The second electrode is disposed above the first electrode in a vertical direction, and the variable resistance layer is disposed between the first electrode and the second electrode in the vertical direction. The copper via conductor structure is disposed under the stacked structure. The first electrode includes a tantalum nitride layer directly connected with the copper via conductor structure.Type: GrantFiled: July 29, 2021Date of Patent: February 4, 2025Assignee: United Semiconductor (Xiamen) Co., Ltd.Inventors: Shuzhi Zou, Dejin Kong, Xiang Bo Kong, Chin-Chun Huang, Wen Yi Tan
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Publication number: 20240429113Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.Type: ApplicationFiled: September 1, 2024Publication date: December 26, 2024Applicant: MEDIATEK INC.Inventors: Shih-Chao Chiu, Chi-Yuan Chen, Wen-Sung Hsu, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang
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Patent number: 12159092Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: July 26, 2023Date of Patent: December 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Publication number: 20240379358Abstract: The present disclosure provides a method of patterning a target material layer over a semiconductor substrate. The method includes steps of forming a spacer feature over the target material layer using a first sub-layout and performing a photolithographic patterning process using a second sub-layout to form a first feature. A portion of the first feature extends over the spacer feature. The method further includes steps of removing the portion of the first feature extending over the spacer feature and removing the spacer feature. Other methods and associated patterned semiconductor wafers are also provided herein.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Inventors: Tsong-Hua Ou, Ken-Hsien Hsieh, Shih-Ming Chang, Wen-Chun Huang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau
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Patent number: 12080614Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.Type: GrantFiled: October 5, 2021Date of Patent: September 3, 2024Assignee: MEDIATEK INC.Inventors: Shih-Chao Chiu, Chi-Yuan Chen, Wen-Sung Hsu, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang
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Publication number: 20230367942Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Inventors: Chia-Ping CHIANG, Ming-Hui CHIH, Chih-Wei HSU, Ping-Chieh WU, Ya-Ting CHANG, Tsung-Yu WANG, Wen-Li CHENG, Hui En YIN, Wen-Chun HUANG, Ru-Gun LIU, Tsai-Sheng GAU
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Patent number: 11790145Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: June 29, 2022Date of Patent: October 17, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Publication number: 20220335192Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: ApplicationFiled: June 29, 2022Publication date: October 20, 2022Inventors: Chia-Ping CHIANG, Ming-Hui CHIH, Chih-Wei HSU, Ping-Chieh WU, Ya-Ting CHANG, Tsung-Yu WANG, Wen-Li CHENG, Hui En YIN, Wen-Chun HUANG, Ru-Gun LIU, Tsai-Sheng GAU
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Patent number: 11392742Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: October 5, 2020Date of Patent: July 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Publication number: 20220130734Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.Type: ApplicationFiled: October 5, 2021Publication date: April 28, 2022Applicant: MEDIATEK INC.Inventors: Shih-Chao Chiu, Chi-Yuan Chen, Wen-Sung Hsu, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang
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Patent number: 11308256Abstract: Implementations of the disclosure provide a method of fabricating an integrated circuit (IC). The method includes receiving an IC design layout; performing optical proximity correction (OPC) process to the IC design layout to produce a corrected IC design layout; and verifying the corrected IC design layout using a machine learning algorithm. The post OPC verification includes using the machine learning algorithm to identify one or more features of the corrected IC design layout; comparing the one or more identified features to a database comprising a plurality of features; and verifying the corrected IC design layout based on labels in the database associated with the plurality of features.Type: GrantFiled: June 22, 2020Date of Patent: April 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hung-Chun Wang, Cheng Kun Tsai, Wen-Chun Huang, Wei-Chen Chien, Chi-Ping Liu
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Patent number: D1063950Type: GrantFiled: May 24, 2021Date of Patent: February 25, 2025Assignee: VIVOTEK INC.Inventors: Kuan-Hung Chen, Kai-Sheng Chuang, Chia-Chi Chang, Yu-Fang Huang, Kai-Ting Yu, Wen-Chun Chen, Shu-Jung Hsu, Tsao-Wei Hung