Patents by Inventor Wen Feng

Wen Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120021244
    Abstract: A process for joining a stainless steel part and a alumina ceramic part, comprising steps of: providing a metal part made of stainless steel, a ceramic part made of alumina ceramic, and a nickel foil; bring the metal part, ceramic part, and nickel foil into contact, with the nickel foil inserted between the metal part and ceramic part; applying a joining pressure of about 20˜60 MPa to the parts to be joined; and simultaneously applying a pulse electric current to the parts while the joining pressure is applied for heating up the parts to a joining temperature of about 950° C. to about 1150° C. at a rate of about 50˜300° C./min, maintaining the joining temperature for about 20˜40 minutes.
    Type: Application
    Filed: April 29, 2011
    Publication date: January 26, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, WEN-FENG HU
  • Publication number: 20120018599
    Abstract: A multi-vacuum mount type support device includes a multi-end connection bar, multiple supporting arms each having one end thereof horizontally pivotally connected to a respective end of the multi-end connection bar by a respective pivot lock, multiple vacuum mount assemblies vertically pivotally connected to the other ends of the supporting arms by respective pivot lock for securing to a flat surface by a vacuum suction force, and a mount connected to one front end of the multi-end connection to hold a holder member for holding an electronic apparatus.
    Type: Application
    Filed: July 26, 2010
    Publication date: January 26, 2012
    Inventor: Wen-Feng Tsai
  • Publication number: 20120021245
    Abstract: A process for joining a carbon steel part and a zirconia ceramic part, comprising steps of: providing a metal part made of carbon steel, a ceramic part made of zirconia ceramic, and a titanium foil; bringing the metal part, ceramic part, and titanium foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a joining pressure of about 10˜50 MPa to the parts to be joined; and simultaneously applying a pulse electric current to the parts while the joining pressure is applied for heating up the parts to a joining temperature of about 800° C. to about 1100° C. at a rate of about 50˜600° C./min, maintaining the joining temperature for about 10˜50 minutes.
    Type: Application
    Filed: April 29, 2011
    Publication date: January 26, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, WEN-FENG HU
  • Patent number: 8101092
    Abstract: A method for controlling ADI-AEI CD difference ratios of openings having different sizes is provided. First, a first etching step using a patterned photoresist layer as a mask is performed to form a patterned Si-containing material layer and a polymer layer on sidewalls thereof. Next, a second etching step is performed with the patterned photoresist layer, the patterned Si-containing material layer and the polymer layer as masks to at least remove an exposed portion of a etching resistive layer to form a patterned etching resistive layer. A portion of a target material layer is removed by using the patterned etching resistive layer as an etching mask to form a first and a second openings in the target material layer. The method is characterized by controlling etching parameters of the first and second etching steps to obtain predetermined ADI-AEI CD difference ratios.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: January 24, 2012
    Assignee: United Microelectronics Corp.
    Inventors: Chih-Wen Feng, Pei-Yu Chou, Chun-Ting Yeh, Jyh-Cherng Yau, Jiunn-Hsiung Liao, Feng-Yi Chang, Ying-Chih Lin
  • Publication number: 20120006952
    Abstract: A dual vacuum mount type support device includes a support arm, two vacuum mount assemblies pivotally connected to the two distal ends of the support arm for securing to the flat surface of a support wall and the flat surface of an object to be supported on the support wall, and two pivot locks for locking the vacuum mount assemblies to the support arm in the respective adjusted position.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 12, 2012
    Inventor: Wen-Feng Tsai
  • Patent number: 8091843
    Abstract: A vacuum mount type support device includes a vacuum mount base member having a multilateral upright shaft, a hard vacuum mount cap member having a cup-like body capped on the top side of the rubber disk of the vacuum mount base member and a through hole for the passing of the multilateral upright shaft, a control device threaded onto the multilateral upright shaft and rotatably to impart a pressure to the vacuum mount cap member against the vacuum mount base member for causing formation of a vacuum suction force, and a device holder fastened to the connector of the vacuum mount base member above the control device for holding an external device.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: January 10, 2012
    Inventor: Wen-Feng Tsai
  • Publication number: 20120001338
    Abstract: An opening structure is disclosed. The opening structure includes: a semiconductor substrate; at least one dielectric layer disposed on the semiconductor substrate, wherein the dielectric layer has a plurality of openings exposing the semiconductor substrate, and each of the openings has a sidewall; a dielectric thin film covering at least a portion of the sidewall of each of the openings; an etch stop layer disposed between the semiconductor substrate and the dielectric layer and extending partially into the openings to isolate the dielectric thin film from the semiconductor substrate; and a metal layer filled in the openings.
    Type: Application
    Filed: September 16, 2011
    Publication date: January 5, 2012
    Inventors: Po-Chao Tsao, Chang-Chi Huang, Ming-Tsung Chen, Feng-Yi Chang, Pei-Yu Chou, Jiunn-Hsiung Liao, Chih-Wen Feng, Ying-Chih Lin
  • Publication number: 20120002440
    Abstract: An edge-type backlight module and a direct-type backlight module with a optical device are provided. The optical device comprises an array layer and a second refractive layer. The array layer has a first refractive index (n1) and contains pluralities of lenticular lens disposed on a base surface side by side. The lenticular lens contains a curving structure with a peak, a trough, a curvature radius (R), a width (P) and an altitude (H) between the peak and the trough. The trough is disposed on the base surface. The array layer has a first critical angle (?1c) relative to the normal of the base surface and satisfies ? 1 ? c = sin - 1 ? ( 1 n 1 ) and H = R 1 + K ? [ 1 - 1 - ( 1 + K ) ? ( P 2 ? R ) 2 ] . The conical constant (K) of the lenticular lens ranges from ?2.1 to ?1.5.
    Type: Application
    Filed: November 11, 2010
    Publication date: January 5, 2012
    Applicant: ENTIRE TECHNOLOGY CO., LTD.
    Inventors: HAO XIANG LIN, YAN ZUO CHEN, WEN FENG CHENG, JUI HSIANG CHANG
  • Patent number: 8089252
    Abstract: An armature winding switch module has a first connection set, a second connection set and a third connection set. The first, the second and the third connection set are respectively connected between a neutral point and a corresponding phase line point and have terminals and contacts. Each two terminals of each connection set are respectively connected to two ends of a corresponding armature winding of a power supply device. The contacts of each connection set are connected among the corresponding terminals. Selectively turning on/off the contacts can connect the armature windings of each connection set in series or in parallel and thereby output required voltage without redoing wiring work. Therefore the present invention avoids second time complicated wiring work and possible connection faults.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: January 3, 2012
    Assignee: Kutai Electronics Industry Co., Ltd.
    Inventor: Wen-Feng Lu
  • Patent number: 8079386
    Abstract: A variable pressure reducing device includes a hollow housing body formed with an inlet opening, an outlet opening spaced apart from the inlet opening, and an inner wall surface. The variable pressure reducing device further includes an intake tube that extends into the housing body from the inlet opening. The intake tube is formed with an inlet channel and is further formed with an outer tube surface that cooperates with the inner wall surface to form an outlet channel in fluid communication with the outlet opening. The variable pressure reducing device also includes a redirection structure movably mounted in the housing body and movable relative to the intake tube between a redirecting state and a sealing state.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: December 20, 2011
    Assignee: Luchan Enterprises Co., Ltd.
    Inventors: Wen-Feng Tsai, Ke-Fu Lin
  • Publication number: 20110303041
    Abstract: A throttle twist grip controller assembly includes a rotatable hand grip, a throttle housing coupled to the hand grip, and a ring potentiometer assembly located in the throttle housing. In one embodiment, the ring potentiometer assembly is fitted and supported on a sleeve associated with the throttle housing. A ring rotor is seated in the ring potentiometer assembly, surrounds the sleeve of the throttle housing, and includes at least a first tab which couples the rotor to the hand grip for rotation with the hand grip. A second tab on the rotor holds a potentiometer conductor. A spring is fitted and supported on the sleeve of the throttle housing. One end of the spring is coupled to the hand grip and the other end is coupled to the throttle housing for returning the hand grip to idle.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 15, 2011
    Inventors: Wen Feng Cheng, Yuan Pin Chen
  • Patent number: 8070042
    Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part, comprising steps of: providing a stainless steel part, a SiC ceramic part, and a Al foil; bringing surfaces of the stainless steel part, SiC ceramic part, and Al foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a pulsed electric current to the stainless steel part, SiC ceramic part, and Al foil, heating the stainless steel part, SiC ceramic part, and Al foil to a joining temperature of about 500-650° C., and simultaneously applying a joining pressure of about 50-100 MPa to the stainless steel part, SiC ceramic part, and Al foil while the current is applied, and maintaining the joining temperature and the joining pressure for about 10-30 minutes.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: December 6, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Wen-Feng Hu
  • Publication number: 20110290955
    Abstract: A cable management member is mounted between two slide rail apparatuses. The cable management member includes an arm assembly and a support member. The arm assembly includes a rear arm, a front arm, and a connecting member pivotably connected to the rear arm and the front arm. First ends of the rear arm and the front arm opposite to the connecting member are correspondingly pivotably connected to a stationary rail and a movable rail of one of the slide rail apparatuses. Opposite ends of the support member are correspondingly connected to the two slide rail apparatuses, and slidable relative to the stationary rails of the corresponding slide rail apparatuses. The connecting member is slidably supported on the support member. The connecting member includes a first positioning button and a second positioning button to restrict the support member therebetween, thereby preventing the support member from disengaging from the connecting member.
    Type: Application
    Filed: July 30, 2010
    Publication date: December 1, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: MO-MING YU, ZE-HONG CHEN, GUANG-HUA GU, WEN-FENG HU
  • Patent number: 8058345
    Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: November 15, 2011
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Chabut
  • Publication number: 20110255305
    Abstract: Provided is a multi-layer light guide apparatus. Various optical paths are formed as a light source emits light into the apparatus. Main structure of the apparatus includes a body and a micro-structured layer. The body has a first layer with first refractive index (n1) and a second layer with second refractive index (n2). The first layer has a first critical angle (?C1). An interface critical angle (?C12) is formed between the associated first layer and second layer. The light then outputs as the light propagates through the layers. The micro-structured layer is formed on a side of the body. It features: n1<n2;0<|?C12??C1|?35°; A third layer with a third index of refraction (n3) is further included. A second interface critical angle (?C23) is formed between the second layer and the third layer. It features: n1<n2<n3;?C23>?C12;0<|?C12??C1|?35°.
    Type: Application
    Filed: September 3, 2010
    Publication date: October 20, 2011
    Applicant: ENTIRE TECHNOLOGY CO., LTD.
    Inventors: YAN ZUO CHEN, CHUNG-HUNG CHIEN, WEN-FENG CHENG, HAO-XIANG LIN
  • Publication number: 20110253647
    Abstract: A rack apparatus includes a pair of opposite first and second slide assemblies, and a cable management structure disposed between the pair of slide assemblies. The cable management structure includes a supporting member with two ends thereof pivotally connected to two first movable rails of the pair of slide assemblies, and an arm assembly supported on the supporting member. The arm assembly includes a foldable main body, and first and second fixing members. Two ends of the main body of the arm assembly are pivotally connected to a stationary rail and a second movable rail of the first slide assembly via the first and second fixing members. The supporting member is slidable with the first movable rails of the two slide assemblies, and supports a portion of the main body of the arm assembly thereon during the spreading open and folding processes of the main body of the arm assembly.
    Type: Application
    Filed: May 25, 2010
    Publication date: October 20, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen)CO., LTD.
    Inventors: MO-MING YU, WEN-FENG HU, ZE-HONG CHEN
  • Publication number: 20110249452
    Abstract: Provided is a compound light-condensing apparatus preferably including a lens body with refractive index n, and light-incident surface and light-ejected surface. The light-ejected surface has one set of Fresnel lens. When an incident light passes through the Fresnel lens structure, a focus with focal length F is formed. Two types of Fresnel lens structure are disposed on a light-ejected surface. More particularly, plural prism bodies are orderly disposed on the second type of Fresnel lens structure. The prism bodies counted from the central line is j and two adjacent prism bodies are spaced by p. The distance Tj is from a base surface to light-ejected surface. An included angle ?j between ejected light and light-ejected surface is formed. By orderly changing the refractive angle of ejected light can be changed for achieving shorter focal length and better light condensation.
    Type: Application
    Filed: April 9, 2010
    Publication date: October 13, 2011
    Inventors: Yan-Zuo Chen, Wen-Feng Cheng, Tzu-Heng Chen
  • Patent number: 8026321
    Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: September 27, 2011
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
  • Publication number: 20110223768
    Abstract: A method for forming contact openings is provided. First, a semiconductor device is formed on a substrate. Next, an etching stop layer, a first dielectric layer and a patterned photoresist layer are sequentially formed on the substrate. Next a portion of the first dielectric layer and a portion of the etching stop layer are removed to form an opening, wherein the portion of the first dielectric layer and the portion of the etching stop layer are not covered by the patterned photoresist layer. Next, the patterned photoresist layer is removed. Next, an over etching process is performed to remove the etching stop layer at a bottom of the opening and expose the semiconductor device in a nitrogen-free environment. The reactant gas of the over etching process includes fluorine-containing hydrocarbons, hydrogen gas and argon gas.
    Type: Application
    Filed: March 10, 2010
    Publication date: September 15, 2011
    Inventors: Ying-Chih LIN, Pei-Yu Chou, Jiunn-Hsiung Liao, Feng-Yi Chang, Chih-Wen Feng, Shang-Yuan Tsai
  • Patent number: D644428
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: September 6, 2011
    Inventor: Wen Feng