Patents by Inventor Wen Fu

Wen Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070024702
    Abstract: A storage apparatus for DTV/ATV/DAB/ANALOG AUDIO BROADCASTING media is provided, including a USB hub or USB serial interface engine (SIE), at least a DTV/ATV/DAB/ANALOG AUDIO BROADCASTING interface converter, a video/audio decoding interface and a plurality of storage media interfaces. The upstream port of the USB hub or the USB serial interface engine is connected to a USB interface of an electronic device. The DTV/ATV/DAB/ANALOG AUDIO BROADCASTING interface converter and a plurality of storage media interfaces are connected respectively to the downstream ports of the USB hub or endpoints of USB serial interface engine. The DTV/ATV/DAB/ANALOG AUDIO BROADCASTING interface converter can convert DTV/ATV/DAB/ANALOG AUDIO BROADCASTING signals into data uploaded through the USB hub or the USB serial interface engine to the electronic device with the USB interface for playing.
    Type: Application
    Filed: July 24, 2006
    Publication date: February 1, 2007
    Inventors: Wen-Ming Huang, Hsin-Ching Yin, Chi-Wei Hsiao, Chi-Hsien Wang, Wen-Fu Tsai, Shu-Hui Gong
  • Publication number: 20070006405
    Abstract: A wafer cleaning system is provided. The wafer cleaning system comprises a first brush, a second brush, a brush motor, and a controller. The second brush is positioned parallel to the first brush. The brush motor moves at least one of the first and second brushes from a first position to a second position according to a driving current of the brush motor.
    Type: Application
    Filed: July 7, 2005
    Publication date: January 11, 2007
    Inventors: Hsien-Ping Feng, Min-Yuan Cheng, Jia-Jia Lin, Chieh-Tsao Wang, Shu-Wen Fu, Steven Lin, Ray Chuang
  • Patent number: 7158358
    Abstract: A present invention provides a PDA with built-in voltage protection, comprising a main device, a socket, and a voltage protection module. The main device performs necessary data processing. The socket connects to an adapter. The voltage protection module is coupled between the main device and the socket, wherein the voltage protection module receives an input voltage from the adapter and allowing the input voltage to be applied to the main device when the input voltage is between a preset maximum voltage and a preset minimum voltage.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: January 2, 2007
    Assignee: Inventec Appliances Corporation
    Inventors: Wen-Fu Chang, Chien-Ju Lee
  • Publication number: 20060224879
    Abstract: A method for starting an operating system rapidly by a hotkey includes the steps of: setting a hotkey for each operating system; executing a BIOS power on self test program; determining whether any hotkey has been pressed during execution of the power on self test program; activating a disk partition section which stores an operating system corresponding to a hotkey if the hotkey has been pressed; loading a master boot record; starting the operating system stored in the activated disk partition section.
    Type: Application
    Filed: March 8, 2006
    Publication date: October 5, 2006
    Inventors: Chang-Wen Fu, Dai-Hua Sun, Zhi-Jun Xiang
  • Publication number: 20060199306
    Abstract: A chip structure and the manufacturing process thereof are provided. The feature of the present application is that the chip structure has a first passivation layer covering a substrate of the chip and exposing each of bonding pads and a portion of the substrate surface, and a second passivation layer covering the sidewalls of the first passivation layer and the portion of substrate surface exposed by the first passivation layer, to prevent moisture infiltration from the edge of the substrate. Therefore, the reliability of the chip structure is enhanced.
    Type: Application
    Filed: December 15, 2005
    Publication date: September 7, 2006
    Inventors: Mon-Chin Tsai, Jian-Wen Lo, Shao-Wen Fu, Chi-Yu Wang
  • Publication number: 20060197191
    Abstract: A chip structure comprising a substrate, a circuitry unit, a plurality of bonding pads, a first passivation layer and a redistribution layer is provided. The circuitry unit is disposed on the substrate, and the bonding pads are disposed on the circuitry unit. Moreover, the first passivation layer is disposed on the circuitry unit and exposes the bonding pads. The redistribution layer of a Ti/Cu/Ti multi-layered structure is disposed on the first passivation layer, and is electrically connected with the bonding pads. In addition, the redistribution layer of a Ti/Cu/Ti multi-layered structure has excellent conductivity such that electrical characteristics of the chip structure are enhanced effectively.
    Type: Application
    Filed: December 13, 2005
    Publication date: September 7, 2006
    Inventors: Mon-Chin Tsai, Chi-Yu Wang, Jian-Wen Lo, Shao-Wen Fu
  • Publication number: 20060195814
    Abstract: A system for multi-project wafer service is provided. The system contains integrator and designer interfaces, an account managing device, a mask tooling information processor, a mask database checking device, and a mask tooling information convertor. The integrator and the designer interfaces provide first and second users with access to the multi-project wafer service. The account managing device manages identification information and corresponding access authority. The mask tooling information processor provides a predefined form to the designer interface, receives the form containing the mask tooling information, and presents the completed form to the integrator interface. The mask database checking device compares the mask tooling information to preset data. The mask tooling information convertor converts the mask tooling information into mask tape-out information.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 31, 2006
    Inventors: Piao-Chuo Tsao, Yi-Hong Tseng, Yun-Wen Fu
  • Publication number: 20060190091
    Abstract: This invention relates to a bone implant that includes a bioinert substrate covered with a ceramic layer containing a plurality of indentations. The total surface area of the indentations is 30-70% of the total surface area of the ceramic layer. This invention also relates to a method of preparing such a bone implant. The method includes: (1) affixing a ceramic layer on the surface of a bioinert substrate; (2) forming a plurality of indentations in the ceramic layer, wherein the total surface area of the indentations is 30-70% of the total surface area of the ceramic layer; and (3) immobilizing a biopolymer onto the ceramic layer via covalent bonding.
    Type: Application
    Filed: February 22, 2005
    Publication date: August 24, 2006
    Inventors: Wen-Fu Lai, Li-Chern Pan, Pau-Yee Lim, Jung-Chou Oung, Chun-Wei Chen
  • Publication number: 20060151957
    Abstract: A dartboard has a board member and a plurality of signs. The board member has a central target and a plurality of target sections on a front side thereof. The signs are detachably mounted on a periphery of the board member associated with the target sections respectively.
    Type: Application
    Filed: January 11, 2005
    Publication date: July 13, 2006
    Inventors: Francis Pan, Juin Chang, Tsung-Chih Tsai, Wen-Fu Chang
  • Patent number: 6986684
    Abstract: An internal structure for a connector with at least a nest-typed positioning seat that is covered with a metallic housing to form a communication connector, and has a connecting board having thereon metallic guide pins and having thereon a circuit board assembly with a resistance-capacitance (RC) element and comprising a first and a second circuit board, each positioning seat is provided between the first and the second circuit boards for receiving coils; connecting lines of the coils are pulled to one side of the seat to connect the assembly, an object of connecting the coils with the circuit board assembly thus is easily attained. Each nest is provided on its periphery with slits of different depths, connecting lines of the coils can be extended through the slits to make electric connecting with the assembly. Thereby a function of wave filtering and abnormal voltage isolating is obtained.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: January 17, 2006
    Assignee: Superworld Electronics Co., Ltd.
    Inventor: Wen-Fu Lien
  • Publication number: 20050285257
    Abstract: The present invention provides an encapsulated device with heat isolating structure and a reflow soldering method thereof. The encapsulated device has a micro heat spreader with vapor chamber formed on the surface, and a cover covers the encapsulated device and wraps the micro heat spreader. A hermetical space is formed to isolate the high temperature when forming the solder balls and performing the SMT process, and prevent the micro heat spreader from being damaged. The present invention can provide an encapsulated device with heat isolating structure and a reflow soldering method thereof to protect the product in the reflow soldering process and improve the yield, and the cover can be reused to lower the cost.
    Type: Application
    Filed: November 9, 2004
    Publication date: December 29, 2005
    Inventors: Jeffrey Chen, Chung-Zen Lin, Wen-Fu Hsu
  • Publication number: 20050271168
    Abstract: A method and an apparatus for auto-tracking and compensating a clock frequency are disclosed. The method is suitable for being applied in USB controllers.
    Type: Application
    Filed: June 3, 2004
    Publication date: December 8, 2005
    Inventors: Wen-Fu Tsai, Chien-Chih Lin, Shih-Chieh Chang
  • Publication number: 20050238801
    Abstract: A method for forming a non-rubbing alignment layer is provided. A vacuum chamber disposed therein with an evaporation source, a substrate, and an ion source is prepared. The substrate has a flat main surface facing the evaporation source. The ion source generates an ion beam that bombards the flat main surface with an oblique incident angle ? with respect to a line normal to the flat main surface. The substrate is rotated at a constant rotation speed. The evaporation source is heated to vaporize inorganic substances of the evaporation source to diffuse and deposit onto the flat main surface substantially along the line normal to the flat main surface, thereby forming the non-rubbing alignment layer. During deposition of the non-rubbing alignment layer, the ion beam emanated from the ion source continues to bombard the flat main surface.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 27, 2005
    Inventors: Chia-Te Lin, Ta-Shuang Kuan, Neng-Yu Tseng, Wen-Fu CHUANG
  • Publication number: 20050169978
    Abstract: This invention relates to a method for preparing a drug-lipid complex that does not have a captured volume or a drug-containing liposome. The method includes dispersing a drug and one or more phospholipids in an aqueous solution to obtain a mixture and grinding the mixture with a mechanic means to obtain a drug-lipid complex that does not have a captured volume or a drug-containing liposome.
    Type: Application
    Filed: January 29, 2004
    Publication date: August 4, 2005
    Inventors: Shu-Wen Fu, Chien-Hsin Cheng, Jui-Ching Cheng, Yun-Yi Hsiau
  • Patent number: 6922183
    Abstract: A multi-domain vertical alignment (MVA) liquid crystal display (LCD), including a first substrate and a second substrate, a common electrode, a number of pixel electrodes, a number of first switches and second switches, and liquid crystals (LCs). The common electrode is formed on one surface of the first substrate. The pixel electrodes are formed on a surface of the second substrate and are opposite to the common electrode. Each of the pixel electrodes includes a slit and a first sub-pixel electrode and a second sub-pixel electrode which are electrically isolated to each other by the slit. Each of the first switches is used for controlling corresponding first sub-pixel electrode, and each of the second switches is used for controlling corresponding second sub-pixel electrode. The liquid crystals (LCs) are sealed between the first substrate and the second substrate.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: July 26, 2005
    Inventors: Chin-Lung Ting, Wen-Fu Huang
  • Publication number: 20050150742
    Abstract: A coin receiver and coin separation module arrangement includes a coin receiver, which has a coin passage in communication between a coin slot and a coin return, and a coin separation module defining a first coin separation passage connected to the coin passage of the receiving module, the coin separation module having a retainer, which is detachably fastened to a retainer of the receiving module to secure the coin separation module to the receiving module and a movable baffle controlled to move in and out of the first coin separation passage and to further control the running direction of coins inserted into the coin slot.
    Type: Application
    Filed: January 12, 2004
    Publication date: July 14, 2005
    Inventor: Wen-Fu Yang
  • Publication number: 20050057295
    Abstract: An ultrawideband (UWB) frequency-tracking method and related device are provided. The method includes the following steps: (a) using an initial frequency seed to automatically track and compensate the clock signal of the USB peripheral device; (b) determining whether the automatic tracking and compensating of the clock signal is successful, for example, within a pre-defined duration; (c) if not successful in step (b), setting a new frequency seed; (d) setting the USB peripheral device off-line; and (e) reconnecting the USB peripheral device and using the new frequency seed to perform the tracking and compensating of the clock signal. The setting off-line step is to disable the pull-up resistor of the D+ signal or the pull-up resistor of the D? signal of the USB peripheral device so that the USB peripheral device becomes off-line.
    Type: Application
    Filed: September 17, 2004
    Publication date: March 17, 2005
    Inventors: Wen-Fu Tsai, Chien-Chih Lin, Shih-Chieh Chang
  • Patent number: 6852331
    Abstract: A method of fabricating a cartilage implant including embedding and growing chondrocytes or mesenchymal stem cells in a three-dimensional substrate. The substrate contains randomly rewound ?-helical monomers of type I collagen.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: February 8, 2005
    Assignee: Taipei Biotechnology Ltd., Inc.
    Inventors: Wen-Fu T. Lai, Ja-Reng Tang, Chien-Tsu Chen
  • Patent number: 6811173
    Abstract: A baby tricycle steering control arrangement is disclosed to include a base frame, a head unit and a steering control bar respectively pivoted to the front and rear sides of the base frame, a swivel member pivoted to the pivot between the front side of the base frame and the head unit and fixedly connected to the head unit, a link received in the base frame and coupled between the bottom end of the steering control bar and the swivel member for enabling the head unit to be controlled by the steering control bar, and a spring member coupled between the swivel member and the base frame and adapted to return the head unit to the middle position automatically after release of biasing force from the steering control bar.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: November 2, 2004
    Inventor: Wen-Fu Shih
  • Patent number: 6811442
    Abstract: A positioning seat with nests for coils for a connector, the connector has on the top thereof a printed circuit board having a resistance-capacitance (RC) element, the printed circuit board is connected thereon with a plurality of coils for wave filtering and abnormal voltage isolating; the coils are positioned by a positioning device formed from the positioning seat and a lateral connecting plate connectable with the seat as well as connecting in advance with metallic guide needles, the positioning seat is shaped in advance to have the nests mutually spaced away and in an amount same as that of the coils; so that each coil is placed in a nest in advance for using in operation of electric connecting with related members and the printed circuit board.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: November 2, 2004
    Assignee: Superworld Electronics Co., Ltd.
    Inventors: Wen-Fu Lien, Cheng-Chou Chiang