Abstract: A method for manufacturing a glass cover is provided, which includes following steps. A glass substrate is provided, wherein the glass substrate has a front surface and a back surface opposite to the front surface, and the front surface has a display region and a non-display region adjacent to the display region. The non-display region of the glass substrate is hazed. A glass cover and an electronic device are also provided. The glass cover is adapted to be disposed at an installation opening of a casing of the electronic device. The glass cover includes a glass substrate. The glass substrate has a front surface and a back surface opposite to the front surface, and the front surface has a display region and a non-display region adjacent to the display region, and the non-display region is hazed.

Abstract: The present disclosure relates to a system and method for evaluating spanning trees. Embodiments may include receiving, using at least one processor, a spanning tree including one or more sinks coupled by one or more edges. Embodiments may further include receiving a user-selected floating parameter. Embodiments may also include interchanging the one or more edges of the spanning tree based upon, at least in part, the user-selected floating parameter.

Abstract: A fan serial connection structure includes a series fan assembly and a connection member assembly. The series fan assembly includes a first fan frame and a second fan frame serially connected with the first fan frame. The connection member assembly includes a first connection member and a second connection member. The first connection member has a first locating section and two first side sections respectively connected with two ends of the first locating section. The second connection member has a second locating section and two second side sections respectively connected with two ends of the second locating section. The first and second locating sections are respectively assembled and connected with two opposite sides of the series fan assembly in the serial connection position. The first and second side sections are respectively assembled and connected with two other opposite sides of the series fan assembly in the serial connection position.

Abstract: The present disclosure relates to a method of improving pattern density with a low OPC (optical proximity correction) cycle time, and an associated apparatus. In some embodiments, the method is performed by performing an initial data preparation process on an IC design including a graphical representation of a layout used to fabricate an integrated chip. The initial data preparation process is performed by using a data preparation element to generate a modified IC design having modified shapes that are modified forms of shapes within the IC design. One or more low-pattern-density areas of the modified IC design are identified using a local density checking element. One or more dummy shapes are added within the one or more low-pattern-density areas using a dummy shape insertion element. The one or more dummy shapes are separated from the modified shapes by a non-zero space.

Abstract: A series fan assembling structure includes a connection assembly, a first fan and a second fan. The connection assembly has a first connection member having a first end face and a second end face opposite to the first end face. A second connection member is disposed at an upper end of the first connection member to outward horizontally extend from the first end face. A third connection member is disposed at a lower end of the first connection member to outward horizontally extend from the second end face. A passage is formed at the centers of the first and second end faces. The first fan is mated with the first end face of the first connection member and horizontally connected with the second connection member. The second fan is mated with the second end face of the first connection member and horizontally connected with the third connection member.

Abstract: A serial fan assembling method includes the steps of providing a first and a second fan; providing a union member having a bottom panel and two side panels, which together define a receiving space having a top forming a first open side and two axially opposite ends respectively forming a second open side; connecting the first fan to the side panels of the union member via the first open side; and connecting the second fan to the side panels of the union member via the first open side, or connecting the second fan to the bottom panel of the union member via one of the second open sides, so that the first and the second fan connected to the union member are serially located in the receiving space and connected to each other.

Abstract: The present disclosure relates to a method of improving pattern density with a low OPC (optical proximity correction) cycle time, and an associated apparatus. In some embodiments, the method is performed by forming an integrated chip (IC) design that is a graphical representation of an integrated chip. One or more low-pattern-density areas of the IC design are identified having a pattern density that results in a processing failure. The low-pattern-density areas are a subset of the IC design. The pattern density is adjusted within the low-pattern-density area by adding one or more dummy shapes within the low-pattern-density areas. A data preparation process is then performed on the IC design to modify shapes of the one or more dummy shapes within the low-pattern-density areas. By introducing dummy shapes into a local area, rather than into an entire integrated chip design, the demands of the subsequent data preparation process are reduced.

Abstract: Provided is an integrated circuit (IC) manufacturing method. The method includes receiving an IC design layout, wherein the IC design layout includes multiple IC regions and each of the IC regions includes an initial IC pattern. The method further includes performing a correction process to a first IC region, thereby modifying the initial IC pattern in the first IC region to result in a first corrected IC pattern in the first IC region, wherein the correction process includes location effect correction. The method further includes replacing the initial IC pattern in a second IC region with the first corrected IC pattern.

Abstract: Provided is an integrated circuit (IC) manufacturing method. The method includes receiving a design layout of an IC, wherein the design layout includes a plurality of non-overlapping IC regions and each of the IC regions includes a same initial IC pattern. The method further includes dividing the IC regions into a plurality of groups based on a location effect analysis such that all IC regions in a respective one of the groups are to have substantially same location effect. The method further includes performing a correction to one IC region in each of the groups using a correction model that includes location effect; and copying the corrected IC region to other IC regions in the respective group. The method further includes storing the corrected IC design layout in a tangible computer-readable medium for use by a further IC process stage.

Abstract: A ring-type fan includes a frame having a receiving space defined between an air inlet and an air outlet thereof and being provided along an inner side of the air outlet with an inward projected wall portion; an impeller assembly rotatably mounted in the receiving space and including spaced impellers outward extended from a hub, and a ring member connected to radially outer ends of the impellers and externally provided with a circle of stop section, which and the projected wall portion together define an air passage between them; and at least one pressure relief section defining an airflow guide on the frame to communicate with the receiving space and the air passage. Any backflow can be guided out of the frame via the air passage and the pressure relief section without interfering with the inflow of air, allowing the ring-type fan to have upgraded heat dissipation performance.

Abstract: Provided is an integrated circuit (IC) manufacturing method. The method includes receiving a design layout of an IC, wherein the design layout includes a plurality of non-overlapping IC regions and each of the IC regions includes a same initial IC pattern. The method further includes dividing the IC regions into a plurality of groups based on a location effect analysis such that all IC regions in a respective one of the groups are to have substantially same location effect. The method further includes performing a correction to one IC region in each of the groups using a correction model that includes location effect; and copying the corrected IC region to other IC regions in the respective group. The method further includes storing the corrected IC design layout in a tangible computer-readable medium for use by a further IC process stage.

Abstract: A fan with integrated vibration absorbing structure includes a fan frame, a hub-blade assembly, and at least one vibration absorber. The fan frame includes a base and at least one side wall formed around the base, and the hub-blade assembly is arranged in the fan frame. The at least one vibration absorber is provided on the at least one side wall to project therefrom for absorbing vibration produced by the fan during the operation thereof. Therefore, with the vibration absorbers integrated into the fan frame, it is no longer necessary to provide any additional vibration-absorbing member while upgraded vibration-absorbing effect can be achieved. Meanwhile, the fan can be more conveniently mounted at reduced mounting cost.

Abstract: An optical thin film includes: a transparent substrate including a first surface and a second surface which is opposite to the first surface; a first light-condensing layer formed on the first surface of the transparent substrate, the first light-condensing layer having a haze value ranging from 5% to 30% and a surface roughness ranging from 0.1 RMS to 1 RMS; and a second light-condensing layer formed on the second surface of the transparent substrate. The second light-condensing layer has a haze value ranging from 70% to 100% and a surface roughness ranging from 1 RMS to 10 RMS.

Abstract: A fan serial connection structure includes a series fan assembly and a connection member. The series fan assembly includes a first fan and a second fan correspondingly serially connected with the first fan. The connection member is disposed on one side of the series fan assembly. The connection member has a first face and a second face opposite to the first face. The first face is correspondingly assembled with the side of the series fan assembly. According to the above structural design, the co-vibration of the series fan is offset or restrained to greatly reduce the vibration of the fan and lower the noise.

Abstract: A fan serial connection structure includes a series fan assembly and a connection member assembly. The series fan assembly includes a first fan frame and a second fan frame serially connected with the first fan frame. The connection member assembly includes a first connection member and a second connection member. The first connection member has a first locating section and two first side sections respectively connected with two ends of the first locating section. The second connection member has a second locating section and two second side sections respectively connected with two ends of the second locating section. The first and second locating sections are respectively assembled and connected with two opposite sides of the series fan assembly in the serial connection position. The first and second side sections are respectively assembled and connected with two other opposite sides of the series fan assembly in the serial connection position.

Abstract: A serial fan assembling method includes the steps of providing a first and a second fan; providing a union member having a bottom panel and two side panels, which together define a receiving space having a top forming a first open side and two axially opposite ends respectively forming a second open side; connecting the first fan to the side panels of the union member via the first open side; and connecting the second fan to the side panels of the union member via the first open side, or connecting the second fan to the bottom panel of the union member via one of the second open sides, so that the first and the second fan connected to the union member are serially located in the receiving space and connected to each other.

Abstract: An optical thin film includes: a transparent substrate including a first surface and a second surface which is opposite to the first surface; a first light-condensing layer formed on the first surface of the transparent substrate, the first light-condensing layer having a haze value ranging from 5% to 30% and a surface roughness ranging from 0.1 RMS to 1 RMS; and a second light-condensing layer formed on the second surface of the transparent substrate. The second light-condensing layer has a haze value ranging from 70% to 100% and a surface roughness ranging from 1 RMS to 10 RMS.

Abstract: A series fan assembling structure includes a connection assembly, a first fan and a second fan. The connection assembly has a first connection member having a first end face and a second end face opposite to the first end face. A second connection member is disposed at an upper end of the first connection member to outward horizontally extend from the first end face. A third connection member is disposed at a lower end of the first connection member to outward horizontally extend from the second end face. A passage is formed at the centers of the first and second end faces. The first fan is mated with the first end face of the first connection member and horizontally connected with the second connection member. The second fan is mated with the second end face of the first connection member and horizontally connected with the third connection member.

Abstract: An anti-vibration serial fan structure includes a first frame having a first assembling side and a second frame having a second assembling for connecting to the first assembling side. The first assembling side is provided with at least one mounting post or mounting hole and at least one male or female connector. The second assembling side is correspondingly provided with at least one mounting hole or mounting post and at least one female or male connector. The male connector has a certain degree of elasticity, so that the engaged male and female connectors provide a vibration-absorbing effect to save additional cushioning elements, enabling the serial fan structure to have lowered assembling cost and minimized defects in assembling.

Abstract: A frame assembly of a ring-type fan with a pressure-releasing function includes a fan wheel, a pressuring-releasing portion, and a frame body. The fan wheel is received in an accommodating space of the frame body. The fan wheel has a hub and a plurality of blades. The pressure-releasing portion is formed on free ends of the blades and has a stopping wall and a flange extending from one end of the stopping wall. A pressure-releasing channel is formed between the stopping wall and an inner wall of the frame body. With the pressure-releasing portion being formed on the free ends of the blades, the present invention is capable of delaying the deceleration, improving the fan performance, and reducing its noise.