Abstract: Disclosed herein are compounds, compositions and methods for treating tumors, particularly tumors that metastasize, via inhibiting tumor cells-induced platelet aggregation. The compound of the present disclosure has the formula (I), wherein, n is 2 or 3.

Abstract: A noise cancellation device includes an anti-noise filter circuit, an output circuit, and a detection circuit. The anti-noise filter circuit provides a corresponding one of transfer functions to process a digital signal, in order to generate a noise cancellation signal, in which the transfer functions are different from each other. The output circuit mixes the noise cancellation signal, a reference signal, and an input signal to generate a mixed signal, and generates a sound output signal based on the mixed signal, in which the digital signal is associated with the sound output signal. The detection circuit controls the anti-noise filter circuit to provide the corresponding one of the transfer functions according to a comparison result of a first ratio and a first threshold value, in which the first ratio is a ratio of a first power of the mixed signal to a second power of the digital signal.

Abstract: An audio processing device includes a first anti-noise filter, an output circuit, and an equalizer circuit. The first anti-noise filter is configured to process a digital signal, in order to generate a noise cancellation signal. The output circuit is configured to mix the noise cancellation signal with an equalized signal to generate a mixed signal, and to generate a sound output signal based on the mixed signal, in which the digital signal is associated with the sound output signal. The equalizer circuit is configured to receive an input signal, and to adjust at least one parameter of the equalizer circuit according to the equalized signal and the digital signal, in order to process the input signal to generate the equalized signal.

Abstract: A head mounted display includes a lens unit, at least one lens temperature sensor, an environment temperature sensor, an environment humidity sensor, a temperature controller, a housing, and a display unit. The lens unit includes a carrier having a touching surface and a back surface opposite to each other and two lenses disposed on the carrier. An enclosed space is formed between a user and the touching surface. The at least one lens temperature sensor is adjacent to the lenses, and the sensors are all disposed on the touching surface. The temperature controller is disposed on the back surface and increases or decreases a temperature of the enclosed space and lens temperatures of the lenses according to sensing actions of the at least one lens temperature sensor, the environment temperature sensor, and the environment humidity sensor, so as to adjust the environment temperature and humidity of the enclosed space.

Abstract: A heat dissipation module applicable to an electronic apparatus is provided. The electronic apparatus includes a heat source. The heat dissipation module includes an evaporator, a first pipe, and a working fluid. The evaporator includes a tank and a first sheet metal installed in the tank. The tank includes a cavity, and the first sheet metal includes a plurality of tabs that are arranged and stand in the cavity. The evaporator is in thermal contact with the heat source so as to absorb heat generated by the heat source. The first pipe is connected to the cavity to form a first loop. The working fluid is filled in the cavity and the first loop. In addition, a method for manufacturing the heat dissipation module is also provided.

Abstract: A fan module and an electronic device using the fan module are provided. The fan module includes a housing, a fan blade assembly, and a fan hub. The housing has a first surface on which plural wind guiding structures are arranged. The fan blade assembly is pivoted to the housing through the fan hub and adapted to rotate along a rotation direction. The wind guiding structures are arranged along a circumferential direction of the fan hub to guide a wind flow into the housing while the fan blade assembly is being rotated.

Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: Disclosed are 5-nitrobenzoate derivatives of Formula I, and the preparation method therefor, wherein R is referred to hydrogen (H), unsubstituted, mono-substituted, di-substituted or tri-substituted benzoyl moiety. 5-Nitrobenzoare derivatives of Formula I do not affect the platelet aggregation, possesses the inhibitory activity related to the tumor cell-induced platelet aggregation (TCIPA), and further specifically inhibits podoplanin-induced platelet aggregation. Therefore, 5-nitrobenzoates of the invention are applicable in its therapeutic use as the novel therapeutic agent in preventing tumor metastasis.

Abstract: A three-dimensional integrated circuit testing apparatus comprises a probe card configured to couple a device-under-test of a three-dimensional integrated circuit with an automatic testing equipment board having a plurality of testing modules, wherein the probe card comprises a plurality of known good dies of the three-dimensional integrated circuit, a plurality of interconnects of the three-dimensional integrated circuit and a plurality of probe contacts, wherein the probe contacts are configured to couple the probe card with testing contacts of the device-under-test of the three-dimensional integrated circuit.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.

Abstract: A blade module and a fan using the same are provided. The blade module includes a rotating shaft and a plurality of blades. Each blade is connected to the rotating shaft and includes a blade body and an airflow guiding portion. The airflow guiding portion is connected to the blade body and has an opening.

Abstract: A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator.

Abstract: A fan module and an electronic device using the fan module are provided. The fan module includes a housing, a fan blade assembly, and a fan hub. The housing has a first surface on which plural wind guiding structures are arranged. The fan blade assembly is pivoted to the housing through the fan hub and adapted to rotate along a rotation direction. The wind guiding structures are arranged along a circumferential direction of the fan hub to guide a wind flow into the housing while the fan blade assembly is being rotated.

Abstract: The disclosure proposes a method of handling communication operation in communication system and related apparatus. According to one of the exemplary embodiments, the disclosure proposes a method of handling a communication operation of a mobile device in a wireless communication system, applicable to the mobile device which is configured with a plurality of serving cells comprising a first serving cell and a second serving cell by a network of the wireless communication system. The method would include receiving a first transmission in a first subframe via the first serving cell and decoding the first transmission; generating a decoding result in response to decoding the first transmission; transmitting an acknowledgement (ACK) or negative-acknowledgement (NACK) in a second subframe, wherein the ACK or NACK corresponds to the decoding result; and receiving a second transmission in a third subframe via the second serving cell wherein the second transmission is a retransmission of the first transmission.

Abstract: A heat dissipation apparatus suited for dissipating heat of a heat source. The heat dissipation apparatus includes a tank, a heat-insulation unit and a pipe. The tank has an outlet end, an inlet end and an accommodating space, wherein the tank receives heat of the heat source from above. The heat-insulation unit is disposed in the accommodating space of the tank, and the heat-insulation unit includes a heat-insulation nozzle. The heat-insulation nozzle has a first opening, a second opening and a neck portion, wherein the first opening communicates with the inlet end, the second opening communicates with the accommodating space and the neck portion is near the second opening. The pipe communicates the outlet end and the inlet end and forms a closed circulating loop with the tank.

Abstract: The invention relates to a use of an aurantiamide dipepetide derivative in the treatment or prevention of angiogenesis-related diseases. Accordingly, aurantiamide dipeptide derivatives can be used as angiogenesis inhibitor, whereby preventing or treating invasive and metastatic cancer and ocular neovascularization (particularly macular degeneration such as pathological neovascularization of age-related macular degeneration (AMD)).

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.