Patents by Inventor Wen Hsieh

Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10477482
    Abstract: A method of handling an on-off state of a cell for a communication device comprises receiving a first downlink (DL) control information (DCI) in a first subframe from a network, wherein the first DCI indicates at least one first on-off state of at least one first subframe of a first cell of the network; and determining an on-off state of a second subframe of the first cell according to the first DCI, wherein the at least one first subframe comprises the second subframe.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: November 12, 2019
    Assignee: ACER INCORPORATED
    Inventor: Chia-Wen Hsieh
  • Publication number: 20190331135
    Abstract: A fan and a balance ring for the fan are provided. The fan includes a housing, a hub disposed in the housing, blades connected to the side surface of the hub, and a balance ring connected to the hub. The balance ring includes a ring chamber and a balance liquid filled in the ring chamber. The volume of the balance liquid is less than the volume of the ring chamber.
    Type: Application
    Filed: April 24, 2019
    Publication date: October 31, 2019
    Inventors: Cheng-Wen HSIEH, Wen-Neng LIAO, Chun-Chieh WANG, Yu-Ming LIN
  • Publication number: 20190317562
    Abstract: A laptop computer includes a host, a hinge mechanism, and a display. The host includes a housing and a base disposed in the housing and having a curved groove. The hinge mechanism is connected to the host and includes a rotation element. The rotation element includes a curved portion located in the curved groove. The display is affixed to the rotation element.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 17, 2019
    Inventors: Yan-Fong CHENG, Cheng-Nan LING, Kai-Teng CHENG, Cheng-Wen HSIEH, Fang-Ying HUANG, Szu-Wei YANG, Yi-Ta HUANG, Pao-Min HUANG, Hsueh-Chih PENG
  • Publication number: 20190312963
    Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.
    Type: Application
    Filed: June 24, 2019
    Publication date: October 10, 2019
    Inventors: Yu-Ti KUO, Wen-Hsieh HSIEH, Chao-Tang CHIU, Chien-Yi LEE, Hsiao-Wen LEE, Ching-Jen WANG
  • Publication number: 20190302860
    Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.
    Type: Application
    Filed: March 4, 2019
    Publication date: October 3, 2019
    Inventors: Sheng-Yan Chen, Hsueh-Chih Peng, Wen-Neng Liao, Cheng-Wen Hsieh
  • Publication number: 20190288085
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Inventors: Bo-Wen HSIEH, Yi-Chun LO, Wen-Jia HSIEH
  • Publication number: 20190277306
    Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.
    Type: Application
    Filed: March 5, 2019
    Publication date: September 12, 2019
    Applicant: Acer Incorporated
    Inventors: Jau-Han Ke, Shun-Ta Yu, Cheng-Yu Cheng, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20190277584
    Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
    Type: Application
    Filed: March 6, 2019
    Publication date: September 12, 2019
    Applicant: Acer Incorporated
    Inventors: Cheng-Yu Cheng, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10397385
    Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: August 27, 2019
    Assignee: PEGATRON CORPORATION
    Inventors: Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Hsiao-Wen Lee, Ching-Jen Wang
  • Patent number: 10397942
    Abstract: A method of handling a communication operation for a network of a wireless communication system comprises determining a reconfiguration set comprising at least one UL/DL configuration; scheduling a UL/DL configuration in the reconfiguration set for a frame; determining a reference UL/DL configuration according to the reconfiguration set; transmitting information related to the reconfiguration set to a communication device of the wireless communication system; and performing a communication operation in the frame with the communication device according to the reference UL/DL configuration, irrespective of the UL/DL configuration scheduled for the frame, wherein the communication operation is a transmission, or the communication operation is a reception.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: August 27, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Wen Hsieh, Chien-Min Lee
  • Publication number: 20190248070
    Abstract: A three-dimensional printing nozzle, a three-dimensional printing nozzle assembly, and a three-dimensional printing apparatus are provided. The three-dimensional printing nozzle includes a nozzle body having an inlet and an outlet, a driving unit disposed in the nozzle body, a first heating unit, and a first heat dissipation unit. A particle forming material is adapted to enter the nozzle body from the inlet. The driving unit is configured for pushing the particle forming material to move from the inlet to the outlet. The first heating unit is disposed in the nozzle body for heating and melting the particle forming material and extrudes a melted forming material out of the nozzle body from the outlet through the driving unit. The first heat dissipation unit is disposed in the nozzle body and located between the first heating unit and the inlet to reduce heat transmitted from the first heating unit to the inlet.
    Type: Application
    Filed: May 2, 2018
    Publication date: August 15, 2019
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Publication number: 20190248071
    Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.
    Type: Application
    Filed: May 25, 2018
    Publication date: August 15, 2019
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Patent number: 10382184
    Abstract: A method of handling a communication operation for a communication device comprising performing a reception in a first subframe of a time-division duplexing (TDD) carrier from a network; and performing a transmission for responding the reception via a second subframe of a uplink (UL) carrier to the network; wherein the UL carrier is a frequency-division duplexing (FDD) UL carrier, or is another TDD carrier with an UL/downlink (DL) configuration where all subframes are UL subframes.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: August 13, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Wen Hsieh, Chien-Min Lee
  • Publication number: 20190183960
    Abstract: The present invention provides a method to treat asthma and airway allergy by administering the dipeptide cyclo tyrosine-valine or a related cyclodipeptide compound to a subject in need thereof. Cyclo tyrosine-valine or the related cyclodipeptide compound reduces Th2 cell activation, airway hyperresponsiveness, accumulation of immune cells in bronchoalveolar fluid, and allergen-specific antibody production in an animal or human subject. The compound can therefore be used to treat asthma and airway allergy.
    Type: Application
    Filed: February 27, 2018
    Publication date: June 20, 2019
    Inventors: Yun-Fei Ko, Jan Martel, Jian-Ching Liau, Chen-Yaw Chiu, Chuan-Sheng Lin, Luis Dominick B. Antig, Pei-Wen Hsieh, Yu-Li Chen, Chih-Jung Chang, Tsung-Ru Wu, David Marcelo Ojcius, Chia-Chen Lu, Hsin-Chih Lai, John D. Young
  • Patent number: 10312338
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: June 4, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Bo-Wen Hsieh, Yi-Chun Lo, Wen-Jia Hsieh
  • Publication number: 20190163246
    Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Cheng-Yu Cheng, Shun-Ta Yu
  • Patent number: 10286645
    Abstract: A three-dimensional printing apparatus and a method of compensating a coordinate offset of a nozzle are provided. The method includes the following. A first nozzle and a second nozzle are controlled to print a testing three-dimensional object on a platform according to a calibration model. The testing three-dimensional object includes a plurality of correlation structures respectively corresponding to a plurality of compensation parameters, and each correlation structure includes a first sub-structure and a second sub-structure. The first sub-structure is formed of a first forming material, and the second sub-structure is formed of a second forming material. Through observing a joint level between the first sub-structure and the second sub-structure of each correlation structure, a best correlation structure, which is used for performing compensation on a printing coordinate of the first nozzle or the second nozzle, is selected from the correlation structures.
    Type: Grant
    Filed: November 16, 2014
    Date of Patent: May 14, 2019
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Yang-Teh Lee, Kwan Ho, Chi-Wen Hsieh, Yu-Chuan Chang, Chi-Chieh Wu
  • Publication number: 20190128279
    Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 2, 2019
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Yu-Ming Lin, Cheng-Yu Cheng, Cheng-Wen Hsieh
  • Publication number: 20190109198
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.
    Type: Application
    Filed: November 20, 2018
    Publication date: April 11, 2019
    Inventors: Bo-Wen HSIEH, Wen-Jia HSIEH, Yi-Chun LO, Mi-Hua LIN
  • Patent number: 10247196
    Abstract: A blade module and a fan using the same are provided. The blade module includes a rotating shaft and a plurality of blades. Each blade is connected to the rotating shaft and includes a blade body and an airflow guiding portion. The airflow guiding portion is connected to the blade body and has an opening.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 2, 2019
    Assignee: ACER INCORPORATED
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao