Patents by Inventor Wen Hsieh
Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10642322Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.Type: GrantFiled: July 11, 2016Date of Patent: May 5, 2020Assignee: Acer IncorporatedInventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 10635142Abstract: A laptop computer includes a host, a hinge mechanism, and a display. The host includes a housing and a base disposed in the housing and having a curved groove. The hinge mechanism is connected to the host and includes a rotation element. The rotation element includes a curved portion located in the curved groove. The display is affixed to the rotation element.Type: GrantFiled: April 16, 2019Date of Patent: April 28, 2020Assignee: ACER INCORPORATEDInventors: Yan-Fong Cheng, Cheng-Nan Ling, Kai-Teng Cheng, Cheng-Wen Hsieh, Fang-Ying Huang, Szu-Wei Yang, Yi-Ta Huang, Pao-Min Huang, Hsueh-Chih Peng
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Patent number: 10634435Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.Type: GrantFiled: October 30, 2017Date of Patent: April 28, 2020Assignee: Acer IncorporatedInventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
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Publication number: 20200124351Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.Type: ApplicationFiled: December 20, 2019Publication date: April 23, 2020Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
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Publication number: 20200110450Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.Type: ApplicationFiled: December 9, 2019Publication date: April 9, 2020Applicant: Acer IncorporatedInventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 10606328Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.Type: GrantFiled: March 4, 2019Date of Patent: March 31, 2020Assignee: Acer IncorporatedInventors: Sheng-Yan Chen, Hsueh-Chih Peng, Wen-Neng Liao, Cheng-Wen Hsieh
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Publication number: 20200091038Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.Type: ApplicationFiled: November 21, 2019Publication date: March 19, 2020Applicant: Acer IncorporatedInventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
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Patent number: 10578655Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.Type: GrantFiled: February 14, 2017Date of Patent: March 3, 2020Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH ATOMIC ENERGY COUNCIL, EXECUTIVE YUANInventors: Chi-Wen Hsieh, Yi-Chun Lin, Tseng-Te Huang, Ming-Chen Yuan, Chien-Hau Chu, Yu-Chin Chi
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Publication number: 20200058762Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.Type: ApplicationFiled: July 10, 2019Publication date: February 20, 2020Inventors: Chi-Wen HSIEH, Chien-Ping HUNG, Chi-Kang CHANG, Shih-Chi FU, Kuei-Shun CHEN
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Patent number: 10563926Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.Type: GrantFiled: March 7, 2017Date of Patent: February 18, 2020Assignee: ACER INCORPORATEDInventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
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Publication number: 20200049159Abstract: An axial flow fan includes a hub and a plurality of fan blade sets. The hub is configured to rotate around an axis. The fan blade sets are disposed at the peripheral of the hub, wherein each of the fan blade sets includes a first fan blade and a second fan blade arranged side by side along the axis and a flow channel is defined by each of the first fan blades and the corresponding second fan blade. Each of the flow channels has an inlet and an outlet opposite to each other, wherein at least one of each of the first fan blades and the corresponding second fan blade has a flow guiding hole and each of the flow guiding holes is located between the inlet and the outlet. Each of the flow guiding holes is communicated with the flow channel.Type: ApplicationFiled: November 26, 2018Publication date: February 13, 2020Applicant: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20200040738Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.Type: ApplicationFiled: August 1, 2019Publication date: February 6, 2020Applicant: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20200035799Abstract: A semiconductor device includes a semiconductor substrate and a gate structure. The semiconductor substrate includes a first semiconductor fin and a second semiconductor fin. The gate structure includes a work function metal structure crossing over the first semiconductor fin and the second semiconductor fin. The work function metal structure comprises a first portion over a portion of the first semiconductor fin, a second portion over a portion of the second semiconductor fin, and a third portion connecting the first portion to the second portion, wherein a thickness of the third portion is smaller than a thickness of the second portion and greater than a thickness of the first portion along an extension direction of the second semiconductor fin.Type: ApplicationFiled: July 26, 2018Publication date: January 30, 2020Inventors: Bo-Wen HSIEH, Wen-Hsin CHAN
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Patent number: 10548089Abstract: A method of performing a communication operation via a cell for a communication device comprises receiving information of a number of available DCIs for a first period from a network; receiving a first DCI in a first subframe in a first period from the network and determining that the first subframe of a cell is in an on state; receiving a second DCI in a second subframe in the first period after the first subframe from the network and determining that the second subframe of the cell is in the on state, if the number of available DCIs is not achieved; and stopping receiving any DCI in the first period and determining that at least one first subframe of the cell in a rest of the first period is in an off state, if the number of available DCIs is achieved.Type: GrantFiled: May 1, 2018Date of Patent: January 28, 2020Assignee: ACER INCORPORATEDInventor: Chia-Wen Hsieh
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Patent number: 10534839Abstract: A method for matrix by vector multiplication, applied in an artificial neural network system, is disclosed. The method comprises: compressing a plurality of weight values in a weight matrix and indices of an input vector into a compressed main stream; storing M sets of synapse values in M memory devices; and, performing reading and MAC operations according to the M sets of synapse values and the compressed main stream to obtain a number M of output vectors. The step of compressing comprises: dividing the weight matrix into a plurality of N×L blocks; converting entries of a target block and corresponding indices of the input vector into a working block and an index matrix; removing zero entries in the working block; shifting non-zero entries row-by-row to one of their left and right sides in the working block; and, respectively shifting corresponding entries in the index matrix.Type: GrantFiled: June 25, 2018Date of Patent: January 14, 2020Assignee: BRITISH CAYMAN ISLANDS INTELLIGO TECHNOLOGY INC.Inventors: Pei-Wen Hsieh, Chen-Chu Hsu, Tsung-Liang Chen
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Publication number: 20200011610Abstract: A portable electronic device having a heat source is provided with a suitable heat dissipation module. The heat dissipation module includes an evaporator, at least one pipe, a working fluid, and at least one check valve. The evaporator thermally contacts the heat source to transmit the heat generated by the heat source to the evaporator. The pipe is connected to the evaporator to form at least one loop, and the working fluid is filled in the loop. The working fluid absorbs and dissipates the heat in the loop to generate a phase change. The check valve is disposed at the loop and provides at least one recirculation channel in the same direction as the first direction and opposite to a second direction to block the working fluid from flowing in the second direction. The first and the second directions are opposite to each other.Type: ApplicationFiled: July 4, 2019Publication date: January 9, 2020Applicant: Acer IncorporatedInventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Ming-Fei Tsai
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Publication number: 20200012323Abstract: A hinge mechanism is provided, including a fixed member, a rotary member pivotally connected to the fixed member, a pin, a first gear set, and a second gear set. The first and second gear sets are connected to the fixed member and the rod and respectively have a teeth-uncompleted gear. When the rotary member rotates relative to the fixed member from an initial angle to a first angle, the first gear set drives the pin to rotate in a first direction. When the rotary member further rotates relative to the fixed member from the first angle to a second angle, the second gear set drives the ping to rotate in a second direction, which is the opposite of the first direction.Type: ApplicationFiled: July 2, 2019Publication date: January 9, 2020Inventors: Yu-Chin HUANG, Wen-Neng LIAO, Cheng-Wen HSIEH, Yu-Ming LIN
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Patent number: 10529649Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.Type: GrantFiled: December 1, 2017Date of Patent: January 7, 2020Assignee: Acer IncorporatedInventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
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Publication number: 20200004303Abstract: A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.Type: ApplicationFiled: June 29, 2019Publication date: January 2, 2020Applicant: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20190369797Abstract: An electronic device including a touch input unit, a display unit, and a control unit is provided. The touch input unit includes a first default input function. The display unit is configured to display a default interface or a first interface. The first interface is corresponding to the first default input function. The control unit is electrically connected to the touch input unit and the display unit for controlling the display unit to be switched from the default interface to the first interface.Type: ApplicationFiled: May 29, 2019Publication date: December 5, 2019Inventors: Sheng-Ta LIN, Chih-Wen HSIEH
