Patents by Inventor Wen Hsieh

Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10247196
    Abstract: A blade module and a fan using the same are provided. The blade module includes a rotating shaft and a plurality of blades. Each blade is connected to the rotating shaft and includes a blade body and an airflow guiding portion. The airflow guiding portion is connected to the blade body and has an opening.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 2, 2019
    Assignee: ACER INCORPORATED
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20190077078
    Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).
    Type: Application
    Filed: November 1, 2017
    Publication date: March 14, 2019
    Inventors: Chi-Wen HSIEH, Chi-Chieh WU
  • Publication number: 20190063451
    Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 28, 2019
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10208767
    Abstract: A fan module and an electronic device are provided. The fan module includes a fan housing, a fan and a heat dissipating member. The fan housing has an open side and an enclosing side which surrounds the open side, wherein the open side is provided with a first airflow guiding channel. The fan is disposed within the fan housing, the heat dissipating member is disposed at the open side, the heat dissipating member has a second airflow guiding channel which is communicated with the first airflow guiding channel, and the air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting. The electronic device includes a chassis and the fan module, and the fan module is mounted in the chassis.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 19, 2019
    Assignee: Acer Incorporated
    Inventors: Kuang-Hua Lin, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10209744
    Abstract: A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: February 19, 2019
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Publication number: 20190053085
    Abstract: A first base station (BS) for handling a flexible duplexing comprises at least one storage device and at least one processing circuit coupled to the at least one storage device. The at least one storage device stores, and the at least one processing circuit is configured to execute instructions of: scheduling a first cell of the first BS according to a first uplink/downlink (UL/DL) configuration, wherein the first UL/DL configuration comprises at least one flexible slot; and transmitting assistance information of the at least one flexible slot of the first cell from the first cell to a second cell.
    Type: Application
    Filed: August 8, 2018
    Publication date: February 14, 2019
    Inventors: Wei-Chen Pao, Chien-Min Lee, Chia-Wen Hsieh
  • Publication number: 20190022933
    Abstract: An intermittent excitation apparatus of a 3D printer includes at least one guide, a drive rod, a movable seat, and a microcontroller. When the microcontroller controls a first motor in a non-excitation and non-rotation condition, the movable seat is fixed on the drive rod and the 3D printer performs a plane printing operation. When the microcontroller controls the first motor in an excitation and rotation condition, the movable seat moves along the drive rod. Therefore, it is to significantly reduce heat generated inside the first motor, decrease costs, and reduce the size of the 3D printer.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 24, 2019
    Inventors: Kwan HO, Chien-Ying HUANG, Chih-Ming CHANG, Chih-Hao LEE, Hung-Tang TENG, Chung-Chih YANG, Chi-Wen HSIEH
  • Patent number: 10182283
    Abstract: A noise cancellation device includes an anti-noise filter circuit, an output circuit, and a detection circuit. The anti-noise filter circuit provides a corresponding one of transfer functions to process a digital signal, in order to generate a noise cancellation signal, in which the transfer functions are different from each other. The output circuit mixes the noise cancellation signal, a reference signal, and an input signal to generate a mixed signal, and generates a sound output signal based on the mixed signal, in which the digital signal is associated with the sound output signal. The detection circuit controls the anti-noise filter circuit to provide the corresponding one of the transfer functions according to a comparison result of a first ratio and a first threshold value, in which the first ratio is a ratio of a first power of the mixed signal to a second power of the digital signal.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: January 15, 2019
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Pei-Wen Hsieh
  • Publication number: 20190012296
    Abstract: A method for matrix by vector multiplication, applied in an artificial neural network system, is disclosed. The method comprises: compressing a plurality of weight values in a weight matrix and indices of an input vector into a compressed main stream; storing M sets of synapse values in M memory devices; and, performing reading and MAC operations according to the M sets of synapse values and the compressed main stream to obtain a number M of output vectors. The step of compressing comprises: dividing the weight matrix into a plurality of N×L blocks; converting entries of a target block and corresponding indices of the input vector into a working block and an index matrix; removing zero entries in the working block; shifting non-zero entries row-by-row to one of their left and right sides in the working block; and, respectively shifting corresponding entries in the index matrix.
    Type: Application
    Filed: June 25, 2018
    Publication date: January 10, 2019
    Inventors: Pei-Wen HSIEH, Chen-Chu HSU, Tsung-Liang CHEN
  • Publication number: 20180374777
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
    Type: Application
    Filed: December 1, 2017
    Publication date: December 27, 2018
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10162435
    Abstract: An input device and an input method using the same are provided. The input device is adapted to a computing device and includes a stylus body, a tip sensing module, a gesture sensing module, a processor and a wireless module. The tip sensing module is configured to detect a touch event on a touch screen of the computing device. The gesture sensing module is configured to detect an orientation of the stylus body. The processor is coupled to the tip sensing module and the gesture sensing module, and is configured to generate a command when the touch event on the touch screen and the orientation are detected. The wireless module is coupled to the processor and is configured to transmit the command to the computing device to trigger a function on the computing device.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: December 25, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Peter Timothy Clark, Chih-Wen Hsieh, Yi-Ou Wang
  • Publication number: 20180367259
    Abstract: A communication device for handling a code block group (CBG)-based communication operation comprises at least one storage device; and at least one processing circuit, coupled to the at least one storage device. The at least one storage device stores, and the at least one processing circuit is configured to execute instructions of receiving an indication configuring at least one CBG-based communication operation to the communication device from a network; receiving a maximum number of CBGs in a transport block (TB) for the at least one CBG-based communication operation from the network; and performing the at least one CBG-based communication operation with the network according to the maximum number of CBGs.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 20, 2018
    Inventors: Chia-Wen Hsieh, Chien-Min Lee
  • Patent number: 10141416
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: November 27, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Wen Hsieh, Wen-Jia Hsieh, Yi-Chun Lo, Mi-Hua Lin
  • Publication number: 20180323270
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Application
    Filed: June 22, 2018
    Publication date: November 8, 2018
    Inventors: Bo-Wen HSIEH, Yi-Chun LO, Wen-Jia HSEIH
  • Patent number: 10114434
    Abstract: A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: October 30, 2018
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10101783
    Abstract: A head mounted display includes a lens unit, at least one lens temperature sensor, an environment temperature sensor, an environment humidity sensor, a temperature controller, a housing, and a display unit. The lens unit includes a carrier having a touching surface and a back surface opposite to each other and two lenses disposed on the carrier. An enclosed space is formed between a user and the touching surface. The at least one lens temperature sensor is adjacent to the lenses, and the sensors are all disposed on the touching surface. The temperature controller is disposed on the back surface and increases or decreases a temperature of the enclosed space and lens temperatures of the lenses according to sensing actions of the at least one lens temperature sensor, the environment temperature sensor, and the environment humidity sensor, so as to adjust the environment temperature and humidity of the enclosed space.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: October 16, 2018
    Assignee: Acer Incorporated
    Inventors: Cheng-Yu Cheng, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
  • Publication number: 20180284968
    Abstract: The disclosure discloses a control method. The control method comprises: determining that a practical operation event is triggered; determining that whether the practical operation event conforms to one of predetermined operation events to generate a determining result; defining predetermined operation event corresponding to the practical operation event as an instant operation interface, and defining an operation interface corresponding to the predetermined operation event as an instant operation interface when the determining result is yes; and displaying the instant operation interface on a touch operation display.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 4, 2018
    Inventors: Chih-Wen HSIEH, Hung-Yi LIN, Chin-Wen LIN, Hao-Ping LIN, Meng-Ju LU
  • Publication number: 20180249418
    Abstract: A method of performing a communication operation via a cell for a communication device comprises receiving information of a number of available DCIs for a first period from a network; receiving a first DCI in a first subframe in a first period from the network and determining that the first subframe of a cell is in an on state; receiving a second DCI in a second subframe in the first period after the first subframe from the network and determining that the second subframe of the cell is in the on state, if the number of available DCIs is not achieved; and stopping receiving any DCI in the first period and determining that at least one first subframe of the cell in a rest of the first period is in an off state, if the number of available DCIs is achieved.
    Type: Application
    Filed: May 1, 2018
    Publication date: August 30, 2018
    Inventor: Chia-Wen Hsieh
  • Patent number: 10056067
    Abstract: An audio processing device includes a first anti-noise filter, an output circuit, and an equalizer circuit. The first anti-noise filter is configured to process a digital signal, in order to generate a noise cancellation signal. The output circuit is configured to mix the noise cancellation signal with an equalized signal to generate a mixed signal, and to generate a sound output signal based on the mixed signal, in which the digital signal is associated with the sound output signal. The equalizer circuit is configured to receive an input signal, and to adjust at least one parameter of the equalizer circuit according to the equalized signal and the digital signal, in order to process the input signal to generate the equalized signal.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: August 21, 2018
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Pei-Wen Hsieh
  • Publication number: 20180232022
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Application
    Filed: April 18, 2018
    Publication date: August 16, 2018
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao