Patents by Inventor Wen Hsieh

Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INDOOR AIR POLLUTION PREVENTION SYSTEM
    Publication number: 20220349593
    Abstract: An indoor pollution prevention system includes a plurality of gas detection modules, one or more intelligent control-driving processing devices, one or more gas-exchange processing devices, and one or more indoor cleaning and filtration devices. The gas-exchange processing device includes one or more flow-guiding component and a cleaning and filtration assembly. The intelligent control-driving processing device controls the operation of the indoor cleaning and filtration device in real-time under a surveillance condition, therefore the air pollution source in the indoor space passes through the indoor cleaning and filtration device, allowing the air pollution source in the indoor space to be filtered and exchanged to become a clean air.
    Type: Application
    Filed: January 28, 2022
    Publication date: November 3, 2022
    Inventors: Hao-Jan Mou, Chin-Chuan Wu, Ching-Sung Lin, Yung-Lung Han, Chi-Feng Huang, Tsung-I Lin, Chin-Wen Hsieh
  • PORTABLE ELECTRONIC DEIVCE
    Publication number: 20220342455
    Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 27, 2022
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Chuan-Hua Wang, Yi-Ta Huang
  • ADAPTIVE THERMAL CEILING CONTROL SYSTEM
    Publication number: 20220334558
    Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.
    Type: Application
    Filed: September 30, 2021
    Publication date: October 20, 2022
    Inventors: Bo-Jr Huang, Jia-Wei Fang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu, Yi-Pin Lin, Wen-Wen Hsieh, Min-Shu Wang
  • MULTI-LOOP CYCLING HEAT DISSIPATION MODULE
    Publication number: 20220325962
    Abstract: A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 13, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Tsung-Ting Chen, Chi-Tai Ho, Kuan-Lin Chen, Jau-Han Ke
  • COOLING FAN
    Publication number: 20220316493
    Abstract: A cooling fan includes a hub, a plurality of blades, and a plurality of flow disturbing elements. The blades are arranged on a peripheral surface of the hub; each of the blades has a leading edge and a trailing edge opposite to the leading edge, and each of the blades has at least one flow disturbing element arranged at the trailing edge. Each of the flow disturbing elements includes an engaging part and an extending part opposite to the engaging part; the engaging part of each of the flow disturbing elements is connected to the trailing edge of the corresponding blade, and the extending part of each of the flow disturbing elements extends outwardly toward a direction away from the trailing edge of the corresponding blade.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 6, 2022
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen
  • Gas detecting module
    Patent number: 11463021
    Abstract: A gas detecting module is provided. The gas detecting module includes a base, a piezoelectric actuator, a driving circuit board, a laser component, a particulate sensor and an outer cover. A gas-guiding-component loading regain and a laser loading region are separated by the base. By the design of the gas flowing path, the driving circuit board covering the bottom surface of the base, and the outer cover covering the surfaces of the base, an inlet path is collaboratively defined by the gas inlet groove of the base and the driving circuit board, and an outlet path is collaboratively defined by a gas outlet groove of the base, the outer cover and the driving circuit board. Consequently, the thickness of the gas detecting module is drastically reduced.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: October 4, 2022
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Wei-Ming Lee, Chun-Yi Kuo, Chin-Wen Hsieh, Chang-Yen Tsai
  • Heat dissipation fan
    Patent number: 11454249
    Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: September 27, 2022
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wei-Chin Chen, Cheng-Wen Hsieh, Wen-Neng Liao
  • FAN
    Publication number: 20220290684
    Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Han-Liang Huang, Sheng-Yan Chen, Tsung-Ting Chen
  • BLOOD PICKER
    Publication number: 20220287605
    Abstract: A blood picker including one or more needles, a storage device, and a fluid transmission control system is provided. The needle is adapted to be inserted into a blood vessel of a human for blood detection. The storage device is in communication with the needle and provided with a drawing tube in communication with an inner space of the storage device. The fluid transmission control system includes a fluid transmission device, a driving controller, and a power supply. The fluid transmission device is in communication with one end of the drawing tube. The power supply provides a power source for the driving controller to enable the fluid transmission device, so that after the fluid transmission device is enabled, the inner space of the storage device is controlled by the fluid transmission device to generate a pressure difference, thereby allowing the blood to be drawn and stored in the storage device.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 15, 2022
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin, Yang Ku
  • Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same
    Patent number: 11430692
    Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: August 30, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su
  • KEY STRUCTURE
    Publication number: 20220270832
    Abstract: A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.
    Type: Application
    Filed: September 17, 2021
    Publication date: August 25, 2022
    Applicant: Acer Incorporated
    Inventors: Hung-Chi Chen, Cheng-Wen Hsieh
  • Lattice boiler evaporator
    Patent number: 11402157
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: August 2, 2022
    Assignee: ACER INCORPORATED
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • HEAT DISSIPATION SYSTEM OF PORTABLE ELECTRONIC DEVICE
    Publication number: 20220229477
    Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
    Publication number: 20220231143
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventors: Bo-Wen HSIEH, Yi-Chun LO, Wen-Jia HSIEH
  • Hybrid automatic repeat request (HARQ) enhancements
    Patent number: 11394497
    Abstract: A user equipment (UE) receives physical downlink shared channel (PDSCH) in a downlink slot as scheduled using a downlink control indicator (DCI). The UE identifies that the downlink slot is part of a group of downlink slots based on the DCI and/or another DCI corresponding to the group. The UE identifies one or more uplink slots at which to transmit hybrid automatic repeat request (HARQ) feedback corresponding to the slots in the group, and transmits the HARQ feedback at one of these uplink slots. If HARQ feedback is not received, a semi-static codebook may prevent HARQ payload size misalignment.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: July 19, 2022
    Assignee: ACER INCORPORATED
    Inventors: Chia-Wen Hsieh, Chien-Min Lee
  • WAFER STRUCTURE
    Publication number: 20220219456
    Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.
    Type: Application
    Filed: November 18, 2021
    Publication date: July 14, 2022
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Hsien-Chung Tai, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh
  • GAS EXCHANGE DEVICE
    Publication number: 20220221172
    Abstract: A gas exchange device for filtering a gas is provided. The gas exchange device includes a gas-intake channel having a gas-intake-channel inlet and a gas-intake-channel outlet, a gas-exhaust channel disposed aside the gas-intake channel and including a gas-exhaust-channel inlet and a gas-exhaust-channel outlet, a purification unit disposed in the gas-intake channel for filtering the gas passing through the gas-intake channel, a gas-intake guider and a gas-exhaust guider for guiding the gas, a driving controller disposed in the gas-intake channel near the gas-intake guider for controlling enablement and disablement of the purification unit, the gas-intake guider and the gas-exhaust guider, and a gas detection main body for detecting the gas and generating detection data.
    Type: Application
    Filed: December 22, 2021
    Publication date: July 14, 2022
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan MOU, Yung-Lung HAN, Chi-Feng HUANG, Chang-Yen TSAI, Wei-Ming LEE, Chin-Wen HSIEH
  • SYSTEM-IN-PACKAGE CHIP OF PRINTER DRIVER SYSTEM
    Publication number: 20220216181
    Abstract: A system-in-package chip of printer driver system applicable in a printer includes a first chip, a second chip, and a third chip. The first chip, the second chip, and the third chip are arranged in a common package. The first chip and the second chip are arranged side-by-side on a carrier in the common package. The third chip is arranged on a top portion of the first chip in the common package. A wire carrier structure is formed on the top portion of the first chip before the third chip is disposed on the first chip.
    Type: Application
    Filed: December 22, 2021
    Publication date: July 7, 2022
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin
  • Heat dissipation module
    Patent number: 11379021
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 5, 2022
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Heat-dissipation unit
    Patent number: D962879
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 6, 2022
    Assignee: Acer Incorporated
    Inventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh