Abstract: A user equipment (UE) receives physical downlink shared channel (PDSCH) in a downlink slot as scheduled using a downlink control indicator (DCI). The UE identifies that the downlink slot is part of a group of downlink slots based on the DCI and/or another DCI corresponding to the group. The UE identifies one or more uplink slots at which to transmit hybrid automatic repeat request (HARQ) feedback corresponding to the slots in the group, and transmits the HARQ feedback at one of these uplink slots. If HARQ feedback is not received, a semi-static codebook may prevent HARQ payload size misalignment.

Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.

Abstract: A multiplexing method of uplink control information (UCI) for ultra-reliable and low latency communications (URLLC) includes acquiring a physical downlink shared channel (PDSCH) resource, processing the PDSCH resource to generate a physical uplink control channel (PUCCH) resource carrying the UCI, selecting an uplink resource from a physical uplink shared channel (PUSCH) resource, and multiplexing the PUCCH resource with the uplink resource selected from the PUSCH resource for transmitting the UCI of the PUCCH resource on the PUSCH resource. The PUCCH resource and the PUSCH resource are scheduled to be transmitted for providing at least two service types within a time period.

Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).

Abstract: A programmable testing apparatus imposes power interruptions on a storage device at any given point of time under at least one workload according to at least one protocol for tests. The programmable testing apparatus includes a controller unit connected to a workload unit, a power control unit, a protocol control unit and a data buffer unit. The controller unit calculates and receives and replies commands in the tests. The workload unit imposes various workloads on the storage device. The power control unit imposes power interruptions on the storage device under control of the controller unit. The protocol control unit provides commands according to the protocol for tests. The data buffer unit stores critical data and information to check whether data stored in the storage device are correct.

Abstract: An apparatus for measuring power of a PCIe device in various modes under the control of a testing host includes two PCIe bus ports, a microcontroller unit, a current-measuring unit and a switch unit. In operation, the first PCIe bus port is electrically connected to the testing host, and the second PCIe bus port is electrically connected to the PCIe device. The microcontroller unit receives commands from and sends signals to the testing host via the first PCIe bus port. The current-measuring unit is in communication of electricity and signals with the second PCIe bus port and electrically connected to the microcontroller unit. The current-measuring unit includes large and small current-measuring paths. The switch unit includes two switches. Under the control of the microcontroller unit, the current-measuring unit is electrically connected to the first PCIe bus port via the large or small current-measuring path and the first or second switch.

Abstract: The invention provides a noise filtering method for a motor. The motor rotates according to an operating voltage. The noise filtering method includes: setting an inspection period and a minimum threshold. The noise filtering method further includes: generating a pulse signal according to the operating voltage, determining whether a time corresponding to each sub-pulse signal in the pulse signal meets the inspection period, and determining whether a pulse width corresponding to each sub-pulse signal is equal to or greater than the minimum threshold. A recording medium storing a program code corresponding to the method, and a motor control circuit for executing the program code are also provided.

Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.

Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.

Abstract: A heat dissipation module including a chamber, a first cooling fin, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling fin is disposed in the accommodating space. The first cooling fin has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling fin and has at least one through hole.

Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped main body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.

Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A laptop computer includes a host, a hinge mechanism, and a display. The host includes a housing and a base disposed in the housing and having a curved groove. The hinge mechanism is connected to the host and includes a rotation element. The rotation element includes a curved portion located in the curved groove. The display is affixed to the rotation element.

Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.

Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.

Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.