Abstract: A dip coating apparatus includes a liquid tank containing paint and a hanging tool for dipping into or removal from the liquid tank. The hanging tool includes a hollow frame, a first and second rack, and two first hanging frames. The hollow frame has a first and second strip. The first and the second racks are disposed in the hollow frame and connected to the first and the second strips. Each of the first hanging frames includes a first top strip connected to the first rack, a first bottom strip connected to the second rack, and a first lateral strip connected to the first top strip and the first bottom strip. Each first lateral strip forms an obtuse angle with the corresponding first top strip and an acute angle with the corresponding first bottom strip. Each first lateral strip includes a first top hook and a first bottom hook.

Abstract: A manufacturing method of a casing including the following steps is provided. A magnesium alloy substrate is provided first. Next, a protective film is formed on the magnesium alloy substrate. A grinding treatment, a cutting treatment, or an engraving treatment is then performed to remove portions of the protective film and portions of the magnesium alloy substrate. An electrophoretic coating treatment is performed afterwards to form a light-transmissive coating layer covering the protective film and the magnesium alloy substrate. A casing is also provided.

Abstract: A control circuit applied in a specific element and including a first transistor and an electrostatic discharge (ESD) protection circuit is provided. The specific element has a III-V semiconductor material and includes a control electrode, a first electrode and a second electrode. The first transistor is coupled between the first electrode and the second electrode and has the III-V semiconductor material. The ESD protection circuit is coupled to the control electrode, the first transistor and the second electrode. In response to an ESD event, the ESD protection circuit provides a discharge path to release the ESD current from the control electrode to the second electrode.

Abstract: Provided is an ethylene-vinyl alcohol copolymer composition having improved oxygen barrier properties, wherein the ethylene-vinyl alcohol copolymer composition comprises an ethylene-vinyl alcohol copolymer; and a manganese content of about 0.01 ppm to 0.49 ppm.

Abstract: The instant disclosure relates to a fluorine-containing ethylene-vinyl alcohol copolymer (EVOH) resin composition as well as mixture and blend thereof. The fluorine-containing EVOH resin composition comprises EVOH and fluorine-containing particles, wherein the fluorine-containing EVOH resin composition has a total fluoride ion content ranging from 45 to 41000 ppm. The invention can reduce the adhesion of EVOH to the inside of the extruder, and effectively reduce the appearance of gel or gelled substance in subsequent finished products.

Abstract: Ethylene-vinyl alcohol copolymer resin composition pellet(s), films, and multi-layer structure formed therefrom, as well as methods for preparing such ethylene-vinyl alcohol copolymer resin composition pellets are provided herein. The ethylene-vinyl alcohol copolymer resin composition typically comprises at least two melting point temperatures, and a boron compound, wherein the ethylene-vinyl alcohol copolymer resin composition has a boron content of about 25 to about 300 ppm and has an iodine dyed region of about 0.1 mm2 or less after dripping 0.01 mL of iodine solution on the surface of the ethylene-vinyl alcohol copolymer resin composition, dipping the ethylene-vinyl alcohol copolymer resin composition into water for 5 seconds, and drying at a temperature of 120° C. for 2 hours.

Abstract: Ethylene-vinyl alcohol copolymer resin composition pellet(s), films, and multi-layer structure formed therefrom, as well as methods for preparing such ethylene-vinyl alcohol copolymer resin composition pellets are provided herein. The ethylene-vinyl alcohol copolymer resin composition typically comprises at least two melting point temperatures, and a boron compound, wherein the ethylene-vinyl alcohol copolymer resin composition has a boron content of about 25 to about 300 ppm and has an iodine dyed region of about 0.1 mm2 or less after dripping 0.01 mL of iodine solution on the surface of the ethylene-vinyl alcohol copolymer resin composition, dipping the ethylene-vinyl alcohol copolymer resin composition into water for 5 seconds, and drying at a temperature of 120° C. for 2 hours.

Abstract: A casing includes a substrate, a protection layer, a bottom coating layer, a coating film layer, and a surface coating layer. The protection layer is formed on the substrate. The bottom coating layer is formed on the protection layer. The coating film layer is formed on the bottom coating layer. The surface coating layer is formed on the coating film layer. One of a surface of the substrate where the protection layer is formed on, a surface of the protection layer where the bottom coating layer is formed on, and a surface of the bottom coating layer where the coating film layer is formed on has a concave-convex pattern.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first well region that has first conductive type therein. The semiconductor device structure also includes a first doped region embedded in the first well region, and having a second conductive type that is different from the first conductive type. The semiconductor device structure further includes a second well region that has the second conductive type. In addition, the semiconductor device structure includes a first metal electrode disposed on the first doped region of the semiconductor substrate and a second metal electrode disposed on the second well region of the semiconductor substrate.

Abstract: A polyurethane prepolymer composition is provided. The polyurethane prepolymer composition includes a first prepolymer, a second prepolymer and a third prepolymer. The first prepolymer includes a polyol and diisocyanates. The two ends of the polyol are connected with the diisocyanates. The second prepolymer includes a diisocyanate monomer. The third prepolymer includes a first diisocyanate, polyols and second diisocyanates. The two ends of the first diisocyanate are connected with the polyols. The other ends of the polyols are connected with the second diisocyanates. A polyurethane elastomer and a preparation method thereof are also provided.

Abstract: Pellets of ethylene-vinyl alcohol copolymer having lamellar stacks of ethylene-vinyl alcohol copolymer with a long period determined by small-angle X-ray scattering of at least 8.35 nm. The lamellar stacks of ethylene-vinyl alcohol copolymer may have an average crystalline lamellar thickness of at least 6 nm. Additionally or alternatively, the lamellar stacks of ethylene-vinyl alcohol copolymer may have an average amorphous lamellar thickness of at least 2.35 nm. Methods are also provided for producing pellets of ethylene-vinyl alcohol copolymer, such as those having preferable lamellar stack properties, as described above.

Abstract: A casing includes a substrate, a protection layer, a bottom coating layer, a coating film layer, and a surface coating layer. The substrate has a first surface. The protection layer covers the first surface and has a second surface opposite to the first surface. The bottom coating layer covers the second surface and has a third surface opposite to the second surface. The coating film layer covers the third surface and has a fourth surface opposite to the third surface. The surface coating layer covers the fourth surface. One of the first surface, the second surface, and the third surface has a concave-convex pattern.

Abstract: Ethylene-vinyl alcohol pellet(s), films, and multi-layer structure formed therefrom, as well as methods for preparing such ethylene-vinyl alcohol pellets are provided herein. The ethylene-vinyl alcohol pellets have at least two melting point temperatures and a light transmittance of greater than 8% for visible light wavelengths. The ethylene-vinyl alcohol pellet may have a haze value of less than 99.8%. One method for producing the EVOH pellet includes: obtaining a first solution comprising a first ethylene-vinyl acetate having a first ethylene content; obtaining a second solution comprising a second ethylene-vinyl acetate having a second ethylene content that is different from the first ethylene content; solution mixing; saponification; pelletizing the mixed solution to form a pellet; contacting the pellet to a boron solution; and drying the pellet.

Abstract: A picking rack is provided, including a frame having at least one inclined pallet. The inclined pallet includes a pair of fork plates for picking up goods and a blocking mechanism for fixing loaded goods to the inclined pallet. Therefore, the labor cost of picking up goods is reduced, and the goods picking up efficiency is increased.

Abstract: A semiconductor structure includes a substrate having an active region and an isolation region, an insulating layer disposed on the substrate, a seed layer disposed on the insulating layer, a compound semiconductor layer disposed on the seed layer, a gate structure in the active region disposed on the compound semiconductor layer, an isolation structure in the isolation region disposed on the substrate, a pair of through-substrate vias in the isolation region disposed on the opposite sides of the gate structure, and a source structure and a drain structure disposed on the substrate and on the opposite sides of the gate structure. The pair of through-substrate vias pass through the isolation structure and contact the seed layer. The source structure and the drain structure electrically connect the seed layer by the pair of through-substrate vias.

Abstract: A casing includes a substrate, a protection layer, a bottom coating layer, a coating film layer, and a surface coating layer. The substrate has a first surface. The protection layer covers the first surface and has a second surface opposite to the first surface. The bottom coating layer covers the second surface and has a third surface opposite to the second surface. The coating film layer covers the third surface and has a fourth surface opposite to the third surface. The surface coating layer covers the fourth surface. One of the first surface, the second surface, and the third surface has a concave-convex pattern.

Abstract: A semiconductor structure includes a substrate having an active region and an isolation region, an insulating layer disposed on the substrate, a seed layer disposed on the insulating layer, a compound semiconductor layer disposed on the seed layer, a gate structure in the active region disposed on the compound semiconductor layer, an isolation structure in the isolation region disposed on the substrate, a pair of through-substrate vias in the isolation region disposed on the opposite sides of the gate structure, and a source structure and a drain structure disposed on the substrate and on the opposite sides of the gate structure. The pair of through-substrate vias pass through the isolation structure and contact the seed layer. The source structure and the drain structure electrically connect the seed layer by the pair of through-substrate vias.

Abstract: A picking rack is provided, including a frame having at least one inclined pallet. The inclined pallet includes a pair of fork plates for picking up goods and a blocking mechanism for fixing loaded goods to the inclined pallet. Therefore, the labor cost of picking up goods is reduced, and the goods picking up efficiency is increased.

Abstract: An LDMOS includes a body region disposed in the substrate and having a first conductivity type; a drift region disposed in the substrate and having a second conductivity type; a source region disposed in the body region and having the second conductivity type; a drain region disposed in the drift region and having the second conductivity type; an isolation region disposed in the drift region between the source region and the drain region; a gate disposed on the body region and the drift region; a source field plate electrically connected to the source region; a drain field plate electrically connected to the drain region; and a first gate plate electrically connected to the gate. The first gate plate is correspondingly disposed above the gate. The shapes of the first gate plate and the gate are substantially the same when viewed from a top view.

Abstract: A casing includes a substrate, a protective layer, a plurality of conductive shielding components and a plurality of waterproof layers. The substrate has a first surface and a second surface. The protective layer encapsulates the first surface and the second surface, wherein the protective layer has a plurality of openings and a part of the first surface is exposed from the openings. The conductive shielding components contact the protective layer encapsulating the first surface, and the conductive shielding components respectively cover the openings. The waterproof layers respectively cover edges of the conductive shielding components and contact the protective layer. A manufacturing method of casing is also provided.