Patents by Inventor Wen Hu
Wen Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20140252550Abstract: The present invention provides a stack capacitor structure and a manufacturing method thereof, adapted for a random access memory. The stack capacitor structure is formed on a semiconductor substrate. The stack capacitor structure includes an oxide layer and a circular-shaped stopping layer. The oxide layer is disposed on the semiconductor substrate. The oxide layer has a capacitor trench therein. The circular-shaped stopping layer surrounds an edge of an opening of the capacitor trench. The disclosed stack capacitor structure and the manufacturing method thereof may thereby prevent the occurrence of the stack capacitor structure from having CD variation and belly region causing cell to cell leakage as result of manufacturing process limitation.Type: ApplicationFiled: September 13, 2013Publication date: September 11, 2014Applicant: INOTERA MEMORIES, INC.Inventors: HSU CHIANG, YAW-WEN HU, TZUNG-HAN LEE, CHUNG-YUAN LEE, SHENG-HSIUNG WU
-
Patent number: 8828843Abstract: A method of manufacturing an isolation structure includes forming a laminate structure on a substrate. A plurality trenches is formed in the laminate structure. Subsequently a pre-processing is effected to form a hydrophilic thin film having oxygen ions on the inner wall of the trenches. Spin-on-dielectric (SOD) materials are filled into the trenches. The hydrophilic think film having oxygen ions changes the surface tension of the inner wall of the trenches and increases SOD material fluidity.Type: GrantFiled: May 2, 2013Date of Patent: September 9, 2014Assignee: Inotera Memories, Inc.Inventors: Yaw-Wen Hu, Jung-Chang Hsieh, Kuen-Shin Huang, Jian-Wei Chen, Ming-Tai Chien
-
Patent number: 8802992Abstract: A circuit board mounting apparatus comprises a chassis and a securing structure. The chassis comprises a bottom board and two sidewalls located on two opposite sides of the board. The securing structure comprises a reinforcing member and a securing member secured to the reinforcing member. The reinforcing member is secured to the bottom board. The securing member defines a securing hole. A fixing member extends through a through hole defined in the circuit board to engage in the securing hole, for preventing the circuit board from moving laterally.Type: GrantFiled: April 13, 2012Date of Patent: August 12, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Po-Wen Chiu, Wen-Hu Lu, Zhan-Yang Li
-
Publication number: 20140220762Abstract: A method of manufacturing an isolation structure includes forming a laminate structure on a substrate. A plurality trenches is formed in the laminate structure. Subsequently a pre-processing is effected to form a hydrophilic thin film having oxygen ions on the inner wall of the trenches. Spin-on-dielectric (SOD) materials are filled into the trenches. The hydrophilic think film having oxygen ions changes the surface tension of the inner wall of the trenches and increases SOD material fluidity.Type: ApplicationFiled: May 2, 2013Publication date: August 7, 2014Applicant: INOTERA MEMORIES, INC.Inventors: YAW-WEN HU, JUNG-CHANG HSIEH, KUEN-SHIN HUANG, JIAN-WEI CHEN, MING-TAI CHIEN
-
Patent number: 8791551Abstract: A well-through type diode element/component manufacturing method which has a pair (pairs) of first and said second electrodes of a diode element/component built on same plane by a process of metallization after a mode of well-through type to penetrate a PN junction depletion region/barrier region, and leads electrons of one of the electrodes to flow through the Depletion/Barrier region without hindrance; the present invention directly conduct the operations of insulation protecting, metallization and the process of elongate welding ball etc., it can independently complete a novel technique of Chip-Scale Package (CSP); it has the features of: grains being exactly the article produced, no need of connecting lines, low energy consumption, low cost and light, thin and small etc.Type: GrantFiled: March 13, 2012Date of Patent: July 29, 2014Assignee: Formosa Microsemi Co., Ltd.Inventors: Wen-Ping Huang, Wen-Hu Wu, His-Piao Lai, Chien-Wu Chen
-
Patent number: 8787027Abstract: A mounting apparatus for fixing a circuit board having a position block comprises an enclosure having a bottom plate; a first mounting member having a first securing portion, and a second mounting member having a first position portion and a first mounting portion. A first through hole is defined on the bottom plate. A first depressed portion is defined around the first through hole on the bottom plate. A first fixing hole is defined on the first securing portion. The first position portion is received in the first depressed portion to prevent the first position portion rotating relative to the bottom plate. The first mounting portion passes through the first through hole to be fixed in the first fixing hole. The bottom plate is fixed between the first securing portion and the first position portion. The position block engages the position slot to fix the circuit board on the enclosure.Type: GrantFiled: February 28, 2012Date of Patent: July 22, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Wen-Hu Lu, Zhan-Yang Li, Po-Wen Chiu
-
Publication number: 20140196514Abstract: A hydroforming method for metal is capable of producing hardware having a throat in only one side and having approximately right-angled corners without causing thinning and breakage. The method includes using a working fluid to exert a liquid pressure on a metal embryo and cooperating with a push rod of a hydroforming mold to supply material from the lower edge, forcing the side sheet metals to bulge. Furthermore, by using the hydroforming mold to provide a downwardly pressing active force on the metal embryo, under feeding of the downwardly pressing active force cooperating with continuous liquid pressure, the metal embryo deforms and bulges such that each corner of the metal embryo and the wall corners of the die cavity of the hydroforming mold have approximately the same angles. Hardware, every angle of which approximates a right angle, can be obtained after removing the hydroforming mold. This method can also be used to obtain a metal box.Type: ApplicationFiled: January 3, 2014Publication date: July 17, 2014Applicant: TECHNOLOGY ON PROTOTYPING ULTIMATE (TOPU)Inventor: Hui-Wen Hu
-
Publication number: 20140187995Abstract: An electrode patch module, a chronic pain detection method and an apparatus thereof are provided. The electrode patch module affixed at a zone to be tested contains at least three electrode pads. The chronic pain detection apparatus selects multiple electrode pairs from the electrode pads and uses the electrode pairs to measure the zone to be tested so as to obtain multiple characteristic values of different muscle areas. The chronic pain detection apparatus receives the characteristic values for performing comparison operations to produce a result for assistant judging where the chronic pain may have in the zone to be tested.Type: ApplicationFiled: February 25, 2013Publication date: July 3, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wei-Wen Hu, Yung-Ching Huang, Yu-Wei Hung
-
Patent number: 8749985Abstract: A mounting apparatus for mounting a circuit board to a bottom plate includes a positioning member, a mounting member and a maintaining member; the mounting member is mounted to the positioning member and adapted to removably mount the positioning member to the bottom plate; the maintaining member defines a top surface and a bottom surface, and a maintaining piece extends from the bottom plane; the positioning member defines a first maintaining plane and a second maintaining plane, and a distance between the first maintaining plane and the bottom plate is larger than that between the second maintaining plane and the bottom plate; the maintaining member is mounted to the positioning member in a first position, where the maintaining piece abuts the second maintaining plane, or a second position, where the maintaining piece abuts the first maintaining plane; the circuit board abuts the top surface of the maintaining member.Type: GrantFiled: July 21, 2011Date of Patent: June 10, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Po-Wen Chiu, Wen-Hu Lu, Zhan-Yang Li
-
Publication number: 20140154900Abstract: A circuit board assembly comprises a first circuit board and a second circuit board. A connector socket is mounted on the first circuit board, and a connector plug is mounted on the second circuit board. A handle assembly is attached to either the first circuit board or the second circuit board. The handle assembly comprises a base member attached to either the first circuit board or the second circuit board and first and second rotating members pivotably attached to opposite ends of the base member. When the first rotating member and the second rotating member are rotated away from the base member, the connector plug is disengaged from the connector socket. When the first rotating member and the second rotating member are rotated towards the base member, the connector plug is inserted into the connector socket.Type: ApplicationFiled: June 28, 2013Publication date: June 5, 2014Inventor: WEN-HU LU
-
Publication number: 20140147312Abstract: A fan assembly includes a chassis, a fan module located in the chassis, a first gasket, a second gasket, a fastener, and a bracket. The fan module includes a front panel and a rear panel. A first gasket extends through the front panel. The second gasket extends through the rear panel. The fastener is pivotable about the first gasket and the second gasket.Type: ApplicationFiled: July 29, 2013Publication date: May 29, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (Shenzhen) CO., LTD.Inventor: WEN-HU LU
-
Patent number: 8730659Abstract: A mounting apparatus for expansion card comprising a chassis, a mounting frame secured to the chassis and located in a first portion of the chassis, a hull secured to the chassis and located in a second portion of the chassis opposite to the first portion, and a mounting member. The mounting member comprises an elastically deformable latching portion. The hull comprises two limiting portions and defines a positioning opening, and the mounting member is engaged in the two limiting portions and is slidable relative to the hull. The mounting member is slid to a side edge of the hull towards to the mounting frame when the elastically deformable latching portion is engaged in the positioning opening.Type: GrantFiled: September 7, 2011Date of Patent: May 20, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Po-Wen Chiu, Wen-Hu Lu, Zhan-Yang Li
-
Publication number: 20140117442Abstract: A semiconductor structure includes multiple buried gates which are disposed in a substrate and have a first source and a second source, an interlayer dielectric layer covering the multiple buried gates and the substrate as well as a core dual damascene plug including a first plug, a second plug and an insulating slot. The insulating slot is disposed between the first plug and the second plug so that the first plug and the second plug are mutually electrically insulated. The first plug and the second plug respectively penetrate the interlayer dielectric layer and are respectively electrically connected to the first source and the second source.Type: ApplicationFiled: March 15, 2013Publication date: May 1, 2014Applicant: INOTERA MEMORIES, INC.Inventors: Tzung-Han Lee, Yaw-Wen Hu, Hung-Chang Liao, Chung-Yuan Lee, Hsu Chiang, Sheng-Hsiung Wu
-
Patent number: 8701927Abstract: A superhydrophilic thin film is formed on a metal surface of a boiler vessel to alter the wettability and roughness of the surface, which, in turn, changes the boiling behavior at the surface. The superhydrophilic film is formed by depositing a layer of a first ionic species on the surface from a solution. A second ionic species having a charge opposite to the that of the first ionic species is then deposited from solution onto the surface to produce a bilayer of the first ionic species and the oppositely charged second ionic species. The depositions are then repeated to form a plurality of bilayers, on top of the preceding bilayer. The bilayers are then heated, leaving the second ionic species on the metal surface to form a superhydrophilic film.Type: GrantFiled: February 10, 2010Date of Patent: April 22, 2014Assignee: Massachusetts Institute of TechnologyInventors: Michael F. Rubner, Jacopo Buongiorno, Lin-wen Hu, Eric Christopher Forrest, Erik Howard Williamson, Robert E. Cohen
-
Patent number: 8659907Abstract: A mounting apparatus includes a chassis, a mounting member, a mounting tray and a securing member. The mounting member secures an expansion card and includes a flange. The mounting tray is received in the chassis and includes a top panel, a front panel and a retaining panel connected to the front panel. The securing tab extends from the top panel. The securing member includes a base engaged with the front panel and a securing plate substantially perpendicular to the base. The resilient arm extends from the securing plate along a direction substantially parallel to a surface of the base. A clasping portion is located on the resilient arm. The flange is located between the retaining panel and the securing member, the clasping portion is engaged with the securing tab, and the resilient arm is deformable in the direction to disengage the clasping portion from the securing tab.Type: GrantFiled: July 13, 2011Date of Patent: February 25, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd, Hon Hai Precision Industry Co., Ltd.Inventors: Po-Wen Chiu, Wen-Hu Lu, Zhan-Yang Li
-
Patent number: 8658912Abstract: A cable management apparatus includes a securing board and a cable management tray. The securing board has a securing arm extending upward from the securing board. The cable management tray is hung on the securing arm and includes a base and a door rotatably secured to the base. A hook is substantially perpendicular to the base, and a clasping hole is defined in the door. The door is rotatable relative to the base between a first position and a second position. In the first position, the hook is engaged in the clasping hole, the base and the door together define a space, and a cable is received in the space in a direction substantially parallel to the base. In the second position, the hook is removed from the clasping hole, to disengage the cable from the space.Type: GrantFiled: July 12, 2011Date of Patent: February 25, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd, Hon Hai Precision Industry Co., Ltd.Inventors: Po-Wen Chiu, Wen-Hu Lu, Zhan-Yang Li
-
Publication number: 20140029214Abstract: A blocking mechanism includes a chassis, a blocking member, and a resilient member. The chassis is configured to secure a circuit board, the chassis comprising a locking structure. The blocking member is configured to abut the circuit board, for preventing the circuit board from sliding towards the blocking member. The blocking member includes a positioning structure slidably engaged with the locking structure. The resilient member is secured to the blocking member and engaged with the locking structure for preventing the blocking member from sliding relative to the locking structure. The resilient member is resiliently deformable. When the resilient member is disengaged from the locking structure, the blocking member is slidable relative to the chassis to disengage the locking structure from the positioning structure.Type: ApplicationFiled: September 7, 2012Publication date: January 30, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventor: WEN-HU LU
-
Publication number: 20140020243Abstract: A handing apparatus includes a handle, a tray configured to be secured to a motherboard, and a connecting rod. The connecting rod includes a clamping portion engaged with the tray. A first end of the connecting rod is rotatably secured to the handle by a first shaft, and a second end of the connecting rod is rotatably secured to the tray by a second shaft. The handle is rotatable about the first shaft relative to the connecting rod to disengage the clamping portion from the tray, so that the connecting rod is rotatable about the second shaft relative to the tray.Type: ApplicationFiled: August 30, 2013Publication date: January 23, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.Inventor: WEN-HU LU
-
Patent number: 8634187Abstract: A mounting apparatus for a PCI card includes an enclosure, a mounting bracket, a securing bracket, and a securing member and a resilient member. The mounting bracket is configured to secure a first end of the PCI card. The securing bracket includes a bracket body and a securing plate. The securing member includes a main body and a securing portion. The main body defines a mounting slot. The securing member is configured to rotate to enable the securing portion to engage the securing plate, and to enable the mounting slot to receive a second end of the PCI card. The resilient member is mounted to the securing bracket and deformed to resist the securing member. The resilient member releases to drive the securing member to move away from the PCI card when the securing portion disengages from the securing plate.Type: GrantFiled: March 20, 2012Date of Patent: January 21, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Wen-Hu Lu, Zhan-Yang Li, Po-Wen Chiu
-
Publication number: 20140008513Abstract: A mounting apparatus includes a cage, a cover, a mounting member, an operation member, and a resilient member. The cage is adapted to mount the fan module and defines a cutout. The cover is secured to the cage. The mounting member is secured between the cage and the cover. The operation member is slidably mounted to the mounting member and received in the cutout. The resilient member is secured between the operation member and the mounting member. The operation member is slidable between a locked and an unlocked position relative to the cage. When the operation member is in the locked position, the hook extends out of the cutout and is adapted to engage in a latching slot of a chassis. When the operation member is in the unlocked position, the hook is slid back and received in the cutout and is disengaged from the latching slot.Type: ApplicationFiled: August 6, 2012Publication date: January 9, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: ZHAN-YANG LI, WEN-HU LU