Abstract: A device for eliminating optical noise receives an optical signal, and includes a first filter which transmits light falling within a same wavelength range as the optical signal, so as to output a filtered signal including the optical signal and first background noise, a second filter which transmits light having a wavelength falling outside the wavelength range of the optical signal, so as to output second background noise, a converter which converts the filtered signal into a first electrical signal and converts the second background noise into a second electrical signal, and an operational unit which performs a mathematical operation on products respectively of the first and second electrical signals and first and second parameters, to result in an output signal.

Abstract: A mounting apparatus for mounting a hard disk drive which does not require screws or tools includes bracket and latching unit. The bracket includes a bottom plate and parallel side plates. The several latching units are rotatably connected to a lower side of the side plate, a free end of the latching unit defines a latching portion. The side plate defines a latching slot corresponding to the latching portion, and when the latching unit is rotated to abut the side plate, the latching portion is latched in the latching slot and holds a hard disk drive strongly and stably in an receiving space defined by the bottom plate and the side plates. The electronic device is further disclosed.

Abstract: A mounting apparatus for mounting a hard disk drive which does not require screws or tools includes bracket and latching unit. The bracket includes a bottom plate and parallel side plates. The several latching units are rotatably connected to a lower side of the side plate, a free end of the latching unit defines a latching portion. The side plate defines a latching slot corresponding to the latching portion, and when the latching unit is rotated to abut the side plate, the latching portion is latched in the latching slot and holds a hard disk drive strongly and stably in an receiving space defined by the bottom plate and the side plates. The electronic device is further disclosed.

Abstract: The present invention discloses a method, including: when user equipment camps on a first network, sending, by the UE to a network device, a single-domain registration request needed when the network device performs mobility management on the UE. The single-domain registration request carries a first IE, and the first IE identifies that the UE has a CS domain voice capability. The UE is a single card dual standby terminal, the UE is currently in a standby state in both the first network and a second network, the first network supports a PS domain service, and the second network supports a CS domain service. If the UE receives a second IE fed back according to the single-domain registration request by the network device, exiting, by the UE, the standby state in the second network, where the second IE identifies that the first network supports CSFB.

Abstract: A flip-chip packaging diode with a multichip structure includes at least two flip-chips arranged with an interval apart from each other and horizontally disposed on the top of a lower guide plate, and each flip-chip has a bottom electrically connected to the lower guide plate and a top having a conductive layer. An insulating material is filled between the two flip-chips and at the outer periphery of the two flip-chips, so that the conductive layers at the tops of the two flip-chips are isolated to form a first electrode and a second electrode for electrically connecting an external circuit. With this structure, a series circuit is formed between the two flip-chips.

Abstract: A method of demodulating a signal packet includes steps of: determining whether a pulse width of each of pulses of one of bits of the signal packet is associated with bit 0 or bit 1; updating first counting data associated with a number of the pulses that define bit 0, and determining whether the first counting data is greater than a first threshold value; deciding that said one of the bits of the signal packet is a bit 0; updating second counting data associated with a number of the pulses that define bit 1, and determining whether the second counting data is greater than the second threshold value; deciding that said one of the bits of the signal packet is a bit 1.

Abstract: A lamp control system includes at least one first lamp network, at least one second lamp network and a lamp control gateway. The first lamp network is configured to emit light and to transmit a first message, and includes a first physical layer. The second lamp network is configured to emit light and to transmit a first message, and includes a second physical layer different from the first physical layer. The lamp control gateway includes a processing module that is configured to receive the first message and the second message and to convert the first message and the second message in such a way that a first converted message and a second converted message comply with a predefined protocol.

Abstract: A physiological detection device includes a main body, a sensor pair, a signal processor, and a calculation module. The sensor pair is disposed in the main body and adapted to detect a detected portion of a human body, so as to obtain a sensing signal. The signal processor is disposed in the main body and receives and processes the sensing signal, so as to output a digital physiological signal. The calculation module receives the digital physiological signal and calculates to obtain first information and second information of a plurality of feature points of the digital physiological signal. The calculation module calculates a ratio of the second information to the first information, so as to obtain a physiological state index. The digital physiological signal includes a plurality of pulse waves generated according to a time sequence.

Abstract: Apparatus for hyperspectral imaging, the apparatus including input optics that receive radiation reflected or radiated from a scene, a spatial modulator that spatially samples radiation received from the input optics to generate spatially sampled radiation, a spectral modulator that spectrally samples the spatially sampled radiation received from the spatial modulator to generate spectrally sampled radiation, a sensor that senses spectrally sampled radiation received from the spectral modulator and generates a corresponding output signal and at least one electronic processing device that controls the spatial and spectral modulators to cause spatial and spectral sampling to be performed, receives output signals and processes the output signals in accordance with performed spatial and spectral sampling to generate a hyperspectral image.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: A manufacturing method of a passive component structure includes the following steps. A protection layer is formed on a substrate, and bond pads of the substrate are respectively exposed through protection layer openings. A conductive layer is formed on the bond pads and the protection layer. A patterned photoresist layer is formed on the conductive layer, and the conductive layer adjacent to the protection layer openings is exposed through photoresist layer openings. Copper bumps are respectively electroplated on the conductive layer. The photoresist layer and the conductive layer not covered by the copper bumps are removed. A passivation layer is formed on the copper bumps and the protection layer, and at least one of the copper bumps is exposed through a passivation layer opening. A diffusion barrier layer and an oxidation barrier layer are chemically plated in sequence on the copper bump.

Abstract: A semiconductor device includes a substrate, and interposer layers. The substrate has a first region, and a second region adjacent the first region. The interposer layers are sequentially stacked on the substrate. Each of the interposer layers has an active region and an open region, which are respectively corresponded to the first region and the second region of the substrate. Each of the interposer layers includes a device layout pattern, and a stress release structure. The device layout pattern is formed within the active region. The stress release structure is formed within the open region, and includes openings.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: A connector structure (100) for a flexible light strip (10) includes a cable joint (110) and an insulation body (200). The cable joint (110) includes a housing (120) and a plurality of conductive terminals (130) assembled in the housing (120). Each of the conductive terminals (130) includes a piercing portion (150). The insulation body (200) has a first end (210) and a second end (220) communicating with the first end (210). The flexible light strip (10) is inserted into the first end (210), and the housing (120) is inserted into the second end (220). The piercing portion (150) is parallel to the flexible light strip (10) and correspondingly pierces the flexible light trip (10) to be electrically coupled to the same. Therefore, the connector structure (100) achieves fast assembly and improves efficiency and reliability for connection.

Abstract: A mounting device for a display module includes a positioning member and an installation member. The positioning member includes a limiting portion and a positioning piece. The limiting portion defines a first receiving slot. The positioning piece defines a cutout. The installation member is secured to the positioning member and includes an elastically deformable limiting block. The installation member defines a second receiving slot and a limiting slot. A limiting rib is located on the limiting block and in the limiting slot. The first receiving slot and the second receiving slot rotatably receive a rotating shaft of the display module therebetween. The limiting block abuts a connecting shaft connected to the rotating shaft and blocks the connecting shaft in the limiting slot. The cutout is adapted to receive the connecting shaft when the rotating shaft is rotated to rotate the connecting shaft out of the limiting slot.

Abstract: A method of demodulating a signal packet includes steps of: determining whether a pulse width of each of pulses of one of bits of the signal packet is associated with bit 0 or bit 1; updating first counting data associated with a number of the pulses that define bit 0, and determining whether the first counting data is greater than a first threshold value; deciding that said one of the bits of the signal packet is a bit 0; updating second counting data associated with a number of the pulses that define bit 1, and determining whether the second counting data is greater than the second threshold value; deciding that said one of the bits of the signal packet is a bit 1.

Abstract: A recoverable device for memory product includes a substrate, a plurality of device dies and at least one local interconnect layer. The device dies are embedded inside the substrate. The at least one local interconnect layer is disposed on an upper surface of the substrate, and configured to route the device dies to a plurality of electrical terminals on an uppermost surface of the local interconnect layer relative to the substrate.

Abstract: A connector assembly (100) with a bidirectional clamping structure is used for assembling a light emitting component (10). The connector assembly (100) includes a first pivot member (110) and a second pivot member (200). The first pivot member (110) includes a body (120), a cover (150), a first pivot portion (170) connected to one side of the body (120) and the cover (150), and a wire groove (180) at the other side. The second pivot member (200) is detachably pivotally connected to the first pivot member (110). The second pivot member (200) includes a base (210). The base (210) includes a second pivot portion (220) asymmetrically disposed with respect to the first pivot portion (170) and an insertion slot (260). The insertion slot (260) is provided for insertion of the light emitting component (10) and is disposed corresponding to the other side of the second pivot portion (220).

Abstract: An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.

Abstract: A semiconductor electronic device structure includes a substrate having a trench disposed therein, a gate electrode disposed in the trench, and a gate dielectric layer disposed on the surface in the trench. The substrate and the gate electrode are electrically insulated from each other by the gate dielectric layer. The substrate further has a pair of doped areas. The doped areas each are vertically disposed along the two respective lateral sides of the trench. The doped areas each have a first portion and a second portion arranged atop the first portion. The first portion extends vertically to the portion of the substrate that is aligned to the gate electrode. The lateral dimension of the first portion is smaller than the lateral dimension of the second portion, and the doping concentration of the first portion is lighter than the doping concentration of the second portion.