Patents by Inventor Wen Huang

Wen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANALYSIS OF NODES IN CELLULAR PATHWAYS
    Publication number: 20140057865
    Abstract: An embodiment of the present invention is a method for measuring activity of cell pathways, such as the cell cycle pathway and correlating the resulting profile to phenotypes. The resulting correlations are useful in diagnosis, prognosis, selection and development of drug treatment regimens, and drug screening applications.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 27, 2014
    Applicant: Nodality, Inc.
    Inventors: Wendy J. Fantl, Ying-Wen Huang
  • Apparatus and method of adaptive offset for video coding
    Patent number: 8660174
    Abstract: The method selects a region for processed video data and determines a class for each pixel in the region of the processed video data based on characteristic measurement of said each pixel. The processed video data corresponds to the reconstructed, deblocked reconstructed or deblocked-and-loop-filtered reconstructed video data. An intensity offset is then determined for the class according to the pixels in the region of the processed video data and respective pixels in a respective region of associated original video data. The intensive offset determined is applied to the processed video data to compensate the intensity offset. The region is smaller than a picture so that adaptive offset can adapt to dynamic characteristics of a picture. In one embodiment, the characteristic measurement is based on pixel patterns consisting pixels around an underlying pixel.
    Type: Grant
    Filed: January 9, 2011
    Date of Patent: February 25, 2014
    Assignee: MediaTek Inc.
    Inventors: Chih-Ming Fu, Ching-Yeh Chen, Yu-Wen Huang
  • METHOD FOR FABRICATING A VERTICAL LIGHT EMITTING DIODE (VLED) DIE HAVING EPITAXIAL STRUCTURE WITH PROTECTIVE LAYER
    Publication number: 20140051197
    Abstract: A method for fabricating a vertical light emitting diode (VLED) die includes the steps of: providing a substrate; forming an epitaxial structure on the substrate; forming an electrically insulative insulation layer covering the lateral surfaces of the epitaxial structure; forming an electrically non-conductive material on the electrically insulative insulation layer; and forming a mirror on the p-doped layer, with the electrically insulative insulation layer configured to protect the epitaxial structure during formation of the mirror.
    Type: Application
    Filed: October 28, 2013
    Publication date: February 20, 2014
    Applicant: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: FENG-HSU FAN, Trung Tri Doan, Chuong Anh Tran, Chen-Fu Chu, Chao-Chen Cheng, Jiunn-Yi Chu, Wen-Huang Liu, Hao-Chun Cheng, Jui-Kang Yen
  • Apparatus and method for high efficiency video coding using flexible slice structure
    Patent number: 8654860
    Abstract: An apparatus and method for video coding based on flexible slice structure are disclosed. In the recent high efficiency video coding (HEVC) development, the slice may contain multiple LCUs instead of macroblocks. The LCU size being considered is 64×64 pixels which is much larger than the macroblock size of 16×16 pixels. Compared with the macroblock aligned slice for H.264, the LCU-aligned slice for HEVC does not provide enough granularities for dividing video frames. Consequently, a flexible slice structure is developed where slice partition is based on smaller coding units. In the flexible slice structure, the first LCU and the last LCU of the slice are allowed to be a fractional LCU, which is derived from a whole LCU using quadtree partition. Syntax elements are also developed to enable conveyance of flexible slice structure between an encoder and a decoder efficiently.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: February 18, 2014
    Assignee: MediaTek Inc.
    Inventors: Yu-Wen Huang, Ching-Yeh Chen, Chih-Ming Fu, Chih-Wei Hsu, Shaw-Min Lei
  • CONTROL METHOD AND VIDEO-AUDIO PLAYING SYSTEM
    Publication number: 20140046668
    Abstract: A control method for a video-audio playing system receiving a video-audio streaming signal is provided. The video-audio streaming signal includes at least a channel-program information. The control method comprises receiving a speech signal and analyzing the speech signal to obtain an acoustic feature of the speech signal. According to the acoustic feature, a speech recognition is performed to determine one of the channel-program information corresponds to the acoustic feature. According to the determined channel-program information, the video-audio playing system executes an operation corresponding to the channel-program information.
    Type: Application
    Filed: September 10, 2012
    Publication date: February 13, 2014
    Applicant: WISTRON CORPORATION
    Inventor: Chih-Wen Huang
  • Wafer-type light emitting device having precisely coated wavelength-converting layer
    Patent number: 8648370
    Abstract: The invention relates to a wafer-type light emitting device having a substrate, one or more light emitting semiconductors formed on the substrate, one or more frames provided over the one or more light emitting semiconductors, and one or more wavelength-converting layers applied on the one or more light emitting semiconductors and confined by the one or more frames, wherein the wafer-type light emitting device is diced into a plurality of separate light emitting units.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: February 11, 2014
    Assignee: Semileds Optoelectronics Co., Ltd.
    Inventors: Wen-Huang Liu, Yuan-Hsiao Chang, Hung-Jen Kao, Chung-Che Dan, Feng-Hsu Fan, Chen-Fu Chu
  • Ball end hex wrench
    Patent number: 8640575
    Abstract: A ball end hex wrench includes a ball end including an engaging section, at least one first pattern, and at least one second pattern. The engaging section includes a plurality of peripheral surfaces disposed circumferentially. The at least one first pattern is defined on one of the plurality of peripheral surfaces. The at least one first pattern has a first longitudinal length and a first height. The at least one second pattern is defined on the one of the plurality of peripheral surfaces. The at least one second pattern has a second longitudinal length and a second height. The second height is different from the first height.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: February 4, 2014
    Assignee: New Way Tools Co., Ltd
    Inventor: Ping-Wen Huang
  • Return device for returning punch head of paper punch
    Publication number: 20140026729
    Abstract: A paper punch includes at least one punch head unit connected to a base and the at least one punch head unit has at least one punch head located therein. At least one resilient plate is cooperated with the at least one punch head. The first end of the at least one resilient plate is fixed to the at least one punch head unit and the second end of the at least one resilient plate is bent for form a connection end. An operation portion is connected between the first end and the second end of the at least one resilient plate. The connection end contacts a lower lateral side of a front pin extending transversely through the at least one punch head. The at least one resilient plate brings the at least one punch head upward after each punching action. The at least one resilient plate occupies less space and is easily installed. The paper punch is safe and easily assembled.
    Type: Application
    Filed: March 5, 2013
    Publication date: January 30, 2014
    Inventor: Tsung Wen HUANG
  • Forming Light-Emitting Diodes Using Seed Particles
    Publication number: 20140021483
    Abstract: A seed layer for growing a group 111-V semiconductor structure 1s embedded in a dielectric material on a carrier substrate. After the group 111-V semiconductor structure is grown, the dielectric material is removed by wet etch to detach the carrier substrate. The group 111-V semiconductor structure includes a thick gallium nitride layer of at least 100 microns or a light-emitting structure.
    Type: Application
    Filed: September 27, 2013
    Publication date: January 23, 2014
    Applicant: TSMC Solid State Lighting Ltd.
    Inventors: Jung-Tang Chu, Ching-Hua Chiu, Hung-Wen Huang, Yea-Chen Lee, Hsing-Kuo Hsia
  • TOUCH PANEL
    Publication number: 20140022469
    Abstract: A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 23, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chih-Chang Lai, Hsiao-Hui Liao, Yu-Hung Chang, Ping-Wen Huang, Ming-Kung Wu, Hsiao-Ping Li
  • Driving End of Tool
    Publication number: 20140020518
    Abstract: A driving end of a tool includes a body including a chamber. A first engaging member is rotatably disposed in the chamber and defines a first engaging section. A second engaging member is rotatably disposed in the chamber and defines first and second engaging ends. The first engaging section is engaged with the first engaging end. At least one pawl is slidably disposed in the chamber and defines a first engaging portion. The second engaging end is selectively engaged with the first engaging portion. A switch is pivotally engaged with the body and abutted against the at least one pawl.
    Type: Application
    Filed: October 1, 2013
    Publication date: January 23, 2014
    Applicant: New Way Tools Co., Ltd.
    Inventor: Ping-Wen Huang
  • TOUCH PANEL
    Publication number: 20140022468
    Abstract: A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 23, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chih-Chang Lai, Hsiao-Hui Liao, Yu-Hung Chang, Ping-Wen Huang, Ming-Kung Wu, Hsiao-Ping Li
  • Method and Apparatus of Scalable Video Coding
    Publication number: 20140003495
    Abstract: A method and apparatus for scalable video coding are disclosed, wherein the video data is configured into a Base Layer (BL) and an Enhancement Layer (EL) and wherein the EL has higher spatial resolution or better video quality than the BL. According to embodiments of the present invention, information from the base layer is exploited for coding the enhancement layer. The information coding for the enhancement layer includes CU structure, motion vector predictor (MVP) information, MVP/merge candidates, intra prediction mode, residual quadtree information, texture information, residual information, context adaptive entropy coding, Adaptive Lop Filter (ALF), Sample Adaptive Offset (SAO), and deblocking filter.
    Type: Application
    Filed: May 31, 2012
    Publication date: January 2, 2014
    Applicant: MEDIATEK INC.
    Inventors: Tzu-Der Chuang, Ching-Yeh Chen, Chih-Ming Fu, Yu-Wen Huang, Shaw-Min Lei
  • COMMON-CORE POWER FACTOR CORRECTION RESONANT CONVERTER
    Publication number: 20140002035
    Abstract: A common-core power factor correction resonant converter includes an energy-transforming circuit. The energy-transforming circuit receives an input line voltage and generates an output power. The energy-transforming circuit includes a coupling inductor and a charge-storage capacitor. The coupling inductor and the charge-storage capacitor are charged by the input line voltage in response to a control signal, so as to generate a charge-storage capacitor voltage. When the charge-storage capacitor voltage is charged to a preset voltage level, the coupling inductor and the charge-storage capacitor are discharged according to the control signal. Then, the energy in the coupling inductor and the charge-storage capacitor is transformed to the output load and provide the output voltage or current regulation.
    Type: Application
    Filed: December 14, 2012
    Publication date: January 2, 2014
    Applicant: MACROBLOCK, INC.
    Inventors: Lon-Kou Chang, Yi-Wen Huang, Han-Hsiang Huang
  • COPPER INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THEREOF
    Publication number: 20140001633
    Abstract: A method for fabricating a copper interconnect structure is disclosed. A substrate having a conductive region is provided. An insulating layer with a via opening is formed on the substrate. The via opening exposes the conductive region. A copper layer is formed on the first insulating layer and fills the via opening by sequentially performing deposition and reflowing processes. A masking layer is formed on the copper layer to cover the via opening. The copper layer uncovered by the masking layer is anisotropically oxidized. The masking layer and the oxidized copper layer are removed by a wet etching process, to form a copper plug in the via opening and a copper wire line on the copper plug. A copper interconnect structure is also disclosed.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 2, 2014
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventors: Chi-Wen Huang, Kuo-Hui Su
  • Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof
    Patent number: 8614453
    Abstract: The invention relates to a chip-type light emitting device including one or more light emitting semiconductors and one or more frames provided over a top of the one or more light emitting semiconductors.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: December 24, 2013
    Assignee: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: Wen-Huang Liu, Chung-Che Dan, Yuan-Hsiao Chang, Hung-Jen Kao
  • Protection for the epitaxial structure of metal devices
    Patent number: 8614449
    Abstract: Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: December 24, 2013
    Assignee: SemiLEDs Optoelectronics Co., Ltd.
    Inventors: Feng-Hsu Fan, Trung Tri Doan, Chuong Anh Tran, Chen-Fu Chu, Chao-Chen Cheng, Jiunn-Yi Chu, Wen-Huang Liu, Hao-Chun Cheng, Jui-Kang Yen
  • METHOD FOR FABRICATING SIDE BY SIDE LIGHT EMITTING DIODE (LED) HAVING SEPARATE ELECTRICAL AND HEAT TRANSFER PATHS
    Publication number: 20130337590
    Abstract: A method for fabricating a light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect.
    Type: Application
    Filed: August 22, 2013
    Publication date: December 19, 2013
    Applicant: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: TRUNG TRI DOAN, Chen-Fu Chu, Wen-Huang Liu, Feng-Hsu Fan, Hao-Chun Cheng, Fu-Hsien Wang
  • PLANAR DISPLAY DEVICE
    Publication number: 20130335670
    Abstract: A planar display device includes a transparent cover plate and a display unit. The transparent cover plate has an attaching surface. The display unit is fully attached to the attaching surface of the transparent cover plate.
    Type: Application
    Filed: June 14, 2013
    Publication date: December 19, 2013
    Inventors: Hieng-Hsiung Huang, Jin Ya Nie, Ming-Chuan Lin, Pao-Tien Lee, Yin-Wen Huang, Min-An Wu
  • Wrench
    Patent number: D698620
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 4, 2014
    Assignee: New Way Tools Co., Ltd
    Inventor: Ping-Wen Huang