Abstract: Methods for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current-guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a substrate) may be provided. For some embodiments, both a current-guiding structure and second current path may be provided.

Abstract: A touch panel including a substrate, a plurality of sensing units, a decoration layer, first signal lines, second signal lines, and a conductive component is provided. The substrate has an operation region and a periphery region surrounding the operation region. The sensing units are located within the operation region for sensing a coordinate of a touch point. The decoration layer is located within the periphery region. The first and second signal lines and the conductive component are located within the periphery region and disposed on the decoration layer. The conductive component has a widen portion located between the first and second signal lines, and the widen portion has a line width greater than those of the other portions of the conductive component.

Abstract: A method and apparatus of line buffer reduction for context adaptive entropy processing are disclosed. The context formation for context adaptive entropy processing depends on block information associated with one or more neighboring Determining context formation for processing a blocks. When the neighboring block is on a different current syntax element of a current block in a region, side of a region boundary from the current block, the wherein the context formation depends on block block information is replaced by replacement block information associated with a neighboring block information to reduce or remove line buffer requirement for storing the block information of neighboring blocks on the other side of the region boundaries from the current block. The context adaptive entropy Replacing the block information associated with a processing is CABAC encoding, CABAC decoding, neighboring block by replacement block information if CAVLC encoding, or CAVLC decoding.

Abstract: A through silicon via (TSV) structure including a semiconductor substrate; a first inter-metal dielectric (IMD) layer on the semiconductor substrate; a cap layer overlying the IMD layer; a conductive layer extending through the cap layer, the first IMD layer and into the semiconductor substrate; a tungsten film capping a top surface of the conductive layer; a second IMD layer overlying the cap layer and covering the tungsten film; and an interconnect feature in the second IMD layer.

Abstract: A method and apparatus for in-loop processing of reconstructed video are disclosed. The method and apparatus configure the in-loop processing so that the processing requires no pixel or reduced pixels from other side of a virtual boundary. When the in-loop processing of the to-be-processed pixel requires a pixel from the other side of the virtual boundary, the pixel from the other side of the virtual boundary is replaced by a replacement pixel. The in-loop processing can also be configured to skip the pixel when the processing requires a pixel from other side of the virtual boundary. The in-loop processing can also be configured to change ALF filter shape or filter size when the in-loop processing requires a pixel from other side of the virtual boundary. A filtered output can be combined linearly or nonlinearly with the to-be-processed pixel to generate a final filter output.

Abstract: A paper punch includes multiple punch units, a cover and a slide member. Each paper unit has a punch body and a blade, the punch body has a passage through which the blade is movable relative to the punch body by the spring. The blade has a passive tooth on the top thereof. The cover is mounted to outside of the punch unit and has a closed top in which a slide slot is defined. The slide member is slidable along the slide slot and has an active gear which is engaged with the passive tooth of the punch unit. When moving the slide member, the blade is lowered because the active gear drives the passive tooth. The cross section of the blade is changed to punch different shapes of holes through the paper sheets.

Abstract: A system and method for adjusting the position and orientation of a feed arm associated with a wafer handling robot. In one embodiment, the system includes a positioning plate detachably carried by the feed arm and insertable therewith into a wafer carrier. The positioning plate includes graphic alignment indicia. An alignment apparatus is provided configured for insertion into wafer-holding slots in the wafer carrier. The apparatus includes at least one digital image sensor. With the positioning plate and alignment apparatus located in the wafer carrier, an image of the alignment indicia is displayed on a video monitor by the image sensor for comparison to a reference mark superimposed on the monitor for determining the relative position and orientation of the feed arm with respect to the wafer carrier. Some embodiments of the apparatus further include a distance detection device to measure the distance to the plate.

Abstract: The present disclosure provides an audio signal amplifying circuit for an electronic device including a processing chip and a speaker. The audio signal amplifying circuit includes an amplifying circuit and an inverting circuit connected to the processing chip to get a first control signal and invert the first control signal to generate a second control signal. The first control signal and/or the second control signal are used to control the operation mode of the amplifying circuit to be in an amplifying mode or in a non-amplifying mode.

Abstract: The present disclosure relates to methods for fabricating LEDs by patterning and etching an n-doped epitaxial layer to form regions of roughened surface of the n-doped layer and mesa structures adjacent to the roughened surface regions before depositing an active layer and the rest of the epitaxial layers on the mesa structures. The method includes growing epitaxial layers of an LED including an un-doped layer and an n-doped layer on a wafer of growth substrate. The method also includes patterning the n-doped layer to form a first region of the n-doped layer and a mesa region of the n-doped layer adjacent to the first region. The method further includes etching the first region of the n-doped layer to create a roughened surface. The method further includes growing additional epitaxial layers of the LED including an active layer and a p-doped layer on the mesa region of the n-doped layer.

Abstract: A capacitive touch sensor includes multiple first-axis traces, multiple second-axis traces, an insulation layer and multiple metal traces. Each first-axis trace includes multiple first touch-sensing pads and first connecting lines connected therebetween. Each second-axis trace includes multiple second touch-sensing pads and second connecting lines connected therebetween. At least one of the first connecting line and the second connecting line is a metal printing line.

Abstract: A through silicon via (TSV) structure including a semiconductor substrate; a first inter-metal dielectric (IMD) layer on the semiconductor substrate; a cap layer overlying the IMD layer; a conductive layer extending through the cap layer, the first IMD layer and into the semiconductor substrate; a tungsten film capping a top surface of the conductive layer; a second IMD layer overlying the cap layer and covering the tungsten film; and an interconnect feature in the second IMD layer.

Abstract: A capacitive touch sensor includes multiple first-axis traces, multiple second-axis traces, an insulation layer and multiple metal traces. Each first-axis trace includes multiple first touch-sensing pads and first connecting lines connected therebetween. Each second-axis trace includes multiple second touch-sensing pads and second connecting lines connected therebetween. At least one of the first connecting line and the second connecting line is a metal printing line.

Abstract: A peripheral device includes a first memory, a second memory, a first access controller, a second access controller and a main controller. When accessing data, first data is written to the first memory from the main controller while second data is read from the second memory to the main controller. Then the first data is written from the first memory to the second memory after writing the first data to the first memory and reading the second data from the second memory are completed.

Abstract: The described embodiments comprise a system that adjusts pixel values to produce visual effects in a frame to be displayed. During operation, the system receives coordinates and pixel-adjustment values for one or more control points within the frame. Next, the system calculates pixel-adjustment values for pixels in the frame based on the coordinates and the pixel-adjustment values for the one or more control points. The system then applies the pixel-adjustment values to the pixels within the frame and displays the frame.

Abstract: A planar magnetic field probe is provided. The planar magnetic field probe increases the sensitivity of magnetic field intensity detection by using a left multi-sensor loop and a right multi-sensor loop formed by a first patterned metal layer and a second patterned metal layer, and decreases the electric field noise coupling by surrounding the left multi-sensor loop and the right multi-sensor loop with a symmetrical shielding metal structure formed by a first patterned shielding metal layer, a second patterned shielding metal layer and a plurality of through vias.

Abstract: A front panel of an optical disc drive is provided. The optical disc drive further includes a LED indicator for displaying a working status of the optical disc drive. The front panel includes a light-transmissible zone corresponding to the LED indicator. A thickness of the light-transmissible zone is smaller than an average thickness of the front panel. The light-transmissible zone is integrally formed with the front panel.

Abstract: A computerized font size adjustment method of an electronic device, the electronic device includes an image capturing device. Images of a user are captured using the image capturing device at intervals. A smallest rectangle framing an eye portion of a current image of the user and a ratio of a length to a width of the smallest rectangle are calculated. Then the ratio is compared with a predetermined value range, and the font size of the electronic device is adjusted according to the comparison.

Abstract: In a method for detecting working states of I/O pins of electronic components, a signal is transmitted between at least two of the I/O pins. A probe of an oscilloscope is connected to an I/O pin. A waveform of the signal through the I/O pin is detected. Charges are transmitted to the probe. A working state of the I/O pin is determined by detecting whether the waveform of the signal through the I/O pin is changed when the charges are transmitted to the probe.

Abstract: A system for monitoring a vehicle and a method for monitoring a vehicle are provided. The system includes a digital signal processor, a plurality of monitoring devices, and an event recorder. The digital signal processor measures the speed of the vehicle to generate measurement data, and analyzes the measurement data to obtain monitoring instruction corresponding to the speed of the vehicle. The monitoring device actuates at least one of the monitoring devices according to the monitoring instruction output by the digital signal processor to generate monitoring data. The event recorder receives the monitoring data output and displays and records the monitoring data. Therefore, the present invention provides an all-directional security system and generates a variety of monitoring mechanism according to the speed of the vehicle, so as to achieve an improved monitoring effect.

Abstract: A capacitive touch panel includes a transparent substrate, a plurality of first sensing electrode sets and second sensing electrode sets provided on the transparent substrate. Each first sensing electrode set includes a plurality of first sensing electrodes electrically coupled in series through a plurality of first wires. Each second sensing electrode set includes a plurality of second sensing electrodes. A color compensation layer having a mesh-like pattern is provided between the first sensing electrodes and the second sensing electrodes. The second wires cover part of the surface of the color compensation layer to couple the second sensing electrodes in series.