Abstract: A driving module for an organic light-emitting diode display device includes a converting unit, for adjusting a voltage range of a plurality of data signals from a first voltage range to a second voltage range; and a driving unit, for generating a plurality of driving signals within the second voltage range to the organic light-emitting diode display device according to the plurality of data signals; wherein the maximum voltage of the second voltage range is greater than or equal to the maximum driving voltage of display components coupled to the driving signals in the organic light-emitting diode display device, and the minimum voltage of the second voltage range is smaller than or equal to the minimum driving voltage of display components coupled to the driving signals in the organic light-emitting diode display device.

Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.

Abstract: Embodiments of mechanisms for forming dislocations in source and drain regions of finFET devices are provided. The mechanisms involve recessing fins and removing the dielectric material in the isolation structures neighboring fins to increase epitaxial regions for dislocation formation. The mechanisms also involve performing a pre-amorphous implantation (PAI) process either before or after the epitaxial growth in the recessed source and drain regions. An anneal process after the PAI process enables consistent growth of the dislocations in the source and drain regions. The dislocations in the source and drain regions (or stressor regions) can form consistently to produce targeted strain in the source and drain regions to improve carrier mobility and device performance for NMOS devices.

Abstract: A display device includes an outer frame, a transparent cover, a back cover, a display module, and a separating structure. The outer frame has a display opening, the transparent cover covers the display opening, and the back cover is opposite to the display opening. The display module is disposed inside the outer frame and has a front surface facing the transparent cover and a rear surface facing the back cover. The separating structure is connected between the back cover and the rear surface of the display module. A first space formed between at least the transparent cover, the front surface of the display module, the outer frame, the back cover, and the separating structure is an enclosed space. A second space formed between at least the rear surface of the display module, the separating structure, and the back cover is connected to an outside and surrounded by the first space.

Abstract: The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.

Abstract: A projection device includes a light source module, an optical engine module, a projection lens, a housing, and at least one first heat dissipating element. The housing comprises a first end and a second end opposite to each other. The at least one first heat dissipating element is disposed in the housing, and each of the at least one first heat dissipating element includes a first plate portion, a second plate portion, and a first fin portion. The first plate portion is connected to the light source module. The second plate portion is connected to the first plate portion. The first fin portion is connected to the second plate portion and includes a plurality of first fins arranged at intervals. These first fins are arranged between the first end and the second end.

Abstract: A blender includes abase and a container unit mounted rotatably and detachably on the base. The container unit includes a container, and a blade assembly disposed on a bottom portion of the container. The base includes a first push portion adjacent to the blade assembly which has a second push portion. When the container unit is rotated relative to the base until the second push portion contacts with the first push portion, the first push portion pushes upward the second push portion as the container unit is continuously rotated relative to the base so as to move the container unit upwardly and away from the base.

Abstract: A head mounted display system and a scene scanning method thereof are provided. In the method, one or more first scene images and a second scene image in a real environment are obtained. A preliminary virtual environment corresponding to the real environment from the first scene images is generated. The preliminary virtual environment is displayed with a perspective at a visual position. The virtual position is corresponding to a real position in the real environment where the second scene image is captured. The perspective to present the virtual environment is modified in response to a change of a pose of the user's head. Accordingly, a convenient way to scan the real environment is provided, and a complete virtual environment may be obtained.

Abstract: An integrated antenna package structure including a chip, a circuit layer, an encapsulant, a coupling end, an insulating layer, a conductive connector, a dielectric substrate, and an antenna is provided. The circuit layer is electrically connected to the chip. The encapsulant is disposed on the circuit layer and covers the chip. The coupling end is disposed on the encapsulant. The insulating layer covers the coupling end. The insulating layer is not externally exposed. The conductive connector penetrates the encapsulant. The coupling end is electrically connected to the circuit layer by the conductive connection. The dielectric substrate is disposed on the encapsulant and covers the coupling end. The antenna is disposed on the dielectric substrate. A manufacturing method of an integrated antenna package structure is also provided.

Abstract: Embodiments include a method, a cognitive software porting assistant system, and a computer program product for operating a cognitive software porting assistant system. Embodiments include analyzing code to identify strings of the code, tokenizing the strings of the code into tokens, and identifying a first set of tokens and a second set of tokens from the tokens, wherein the first set of tokens corresponds to a first platform and the second set of tokens corresponds to the second platform. Embodiments also include generating a first syntax tree for the first set of tokens and a second syntax tree for the second set of tokens, and serializing the first syntax tree and the second syntax tree. Embodiments include comparing the first serialized syntax tree with the second serialized syntax tree, and saving a mapping of the first serialized syntax tree and second serialized syntax tree responsive to the comparison.

Abstract: Techniques are disclosed for an Ethernet Virtual Private Network (EVPN) Virtual Private Wire Service (VPWS) network with service interface-aware forwarding. In one example, a first network device signals to a second network device, using EVPN route advertisements, a multi-service service tunnel to transport network packets for a plurality of services. The services are identifiable by virtual local area network (VLAN) identifiers in the packets. The first network device is configured with a single transport interface for the service tunnel and the single transport interface is configured with respective service interfaces for the services. The first network device detects failure of a failed service interface of the service interfaces and outputs, in response to the failure, an EVPN route withdrawal message for the service tunnel that identifies the service corresponding to the failed service interface.

Abstract: The present invention discloses a novel 3-aryl-2-propen-1-one series derivative and the synthesis processes thereof. Besides, the present invention also discloses the series derivative as a pharmaceutical composition and their use for promoting myocardial regeneration.

Abstract: A wireless communication method adapted to an electrical gear-shifting system of bicycle comprises: establishing a first communication connection to an intermediate device by a master controller; establishing a second communication connection to the intermediate device by a slave controller, sending a control signal to the intermediate device through the first communication connection by the master controller, sending the control signal to the slave controller through the second communication connection by the intermediate device, wherein the slave controller controls a motor driver to perform a gear-shifting operation according to the control signal.

Abstract: A system and method for determining clearance between a fabrication tool and a workpiece is provided. In an exemplary embodiment, the method includes receiving a substrate within a tool such that a gap is defined there between. A transducer disposed on a bottom surface of the substrate opposite the gap provides an acoustic signal that is conducted through the substrate. The transducer also receives a first echo from a top surface of the substrate that defines the gap and a second echo from a bottom surface of the tool that further defines the gap. A width of the gap is measured based on the first echo and the second echo. In some embodiments, the bottom surface of the tool is a bottom surface of a nozzle, and the nozzle provides a liquid or a gas in the gap while the transducer is receiving the first and second echoes.

Abstract: A manufacturing method of a package structure is described. The method includes at least the following steps. A carrier is provided. A semiconductor die and a sacrificial structure are disposed on the carrier. The semiconductor die is electrically connected to the bonding pads on the sacrificial structure through a plurality of conductive wires. As encapsulant is formed on the carrier to encapsulate the semiconductor die, the sacrificial structure and the conductive wires. The carrier is debonded, and at least a portion of the sacrificial structure is removed through a thinning process. A redistribution layer is formed on the semiconductor die and the encapsulant. The redistribution layer is electrically connected to the semiconductor die through the conductive wires.

Abstract: Provided herein are pharmaceutical compositions, intravitreal implants and particle suspensions comprising a polymer matrix and at lest one therapeutic agent that is released in a substantially linear manner for a particular duration.

Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.

Abstract: A method of manufacturing chip package is disclosed. The method includes steps of providing a wafer with an upper surface and a lower surface opposite thereto, in which a plurality of conductive pads are disposed on the upper surface; forming a plurality of conductive bumps on the corresponding conductive pads; thinning the wafer from the lower surface towards the upper surface; forming an insulating layer under the lower surface; etching the upper surface of the wafer to form a plurality of trenches exposing the insulating layer; forming a passivation layer covering an inner wall of each of the trenches; and dicing the passivation layer and the insulating layer along each of the trenches to form a plurality of chip packages.

Abstract: Techniques are described for avoiding traffic black-holing in a multi-homed Ethernet virtual private networks (EVPNs) in which a customer device (CE) is multi-homed to a plurality of multi-homing provider edge devices (PEs) via respective links of an Ethernet segment. An overlay network is created over the Ethernet segment, and the multi-homing PEs of the EVPN are configured with a common anycast IP address for respective virtual network interfaces. Upon election as active designated forwarder (DF) for the EVPN, the DF PE of the multi-homing PEs advertises toward the customer network an IGP metric for the anycast IP address that is lower than the IGP metric(s) advertised by any of the non-DF standby PE routers segment to direct the CE to forward network packets from the customer network to the DF PE over the respective link of the Ethernet segment.

Abstract: The present invention relates to a stair exercise device for simulating stair climbing, the device having a plurality of steps which are activated by the weight of a person walking up them. A stationary platform at the base of the stair exercise device sends a signal to a controller to bring the exercise device to a controlled stop when an operator steps onto the platform. The steps of the exercise device stop in a predetermined location when the exercise device comes to a controlled stop, ensuring proper step location to allow the operator to easily enter and exit the exercise device. Steps have a step platform of a different color than the risers between steps to aid in foot placement.