Abstract: A space coordinate converting server and method thereof are provided. The space coordinate converting server receives a field video recorded with a 3D object from an image capturing device, and generates a point cloud model accordingly. The space coordinate converting server determines key frames of the field video, and maps the point cloud model to key images of the key frames based on rotation and translation information of the image capturing device for generating a characterized 3D coordinate set. The space coordinate converting server determines 2D coordinates of the 3D object in key images, and selects 3D coordinates from the characterized 3D coordinate set according to the 2D coordinates. The space coordinate converting server determines a space coordinate converting relation according to marked points of the 3D object and the 3D coordinates.

Abstract: A control method is provided. The control method is applied to an electronic device. The control method includes the following steps: detecting a virtual screen signal; allocating a virtual screen image buffer module for temporarily storing virtual screen image information according to the virtual screen signal; integrating the virtual screen image information and second screen image information into an integrated image data stream by a direct mode; outputting a first screen image data stream to a first screen of an electronic device, so that the first screen displays a first image according to the first screen image data stream; and outputting the integrated image data stream to a second screen of the electronic device, so that the second screen displays a second image according to the integrated image data stream.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: Described herein are compounds and compositions for treating glaucoma and/or reducing intraocular pressure. Compositions may comprise an isoquinoline compound and a prostaglandin or a prostaglandin analog. Compounds described herein include those in which an isoquinoline compound is covalently linked to a prostaglandin or a prostaglandin analog, and those in which an isoquinoline compound and a prostaglandin free acid together form a salt.

Abstract: A display panel able to receive full fingerprint impressions in a display area together with command touches, in addition to showing images, includes a substrate, scan lines, data lines, touch scan lines, touch lines, sub-pixels, and fingerprint sensing units. A method for driving such multifunctional touch display panel is also provided.

Abstract: Embodiments include a method, a cognitive software porting assistant system, and a computer program product for operating a cognitive software porting assistant system. Embodiments include analyzing code to identify strings of the code, tokenizing the strings of the code into tokens, and identifying a first set of tokens and a second set of tokens from the tokens, wherein the first set of tokens corresponds to a first platform and the second set of tokens corresponds to the second platform. Embodiments also include generating a first syntax tree for the first set of tokens and a second syntax tree for the second set of tokens, and serializing the first syntax tree and the second syntax tree. Embodiments include comparing the first serialized syntax tree with the second serialized syntax tree, and saving a mapping of the first serialized syntax tree and second serialized syntax tree responsive to the comparison.

Abstract: A TFT substrate for a touch display panel of reduced thickness defines a display area and a surrounding non-display area. The TFT substrate includes a first conductive layer on the substrate and a second conductive layer on the first conductive layer. In the display area, the first conductive layer includes data lines and the second conductive layer includes common electrodes. Each common electrode extends as a strip along a first direction. Each data line extends along a second direction. The first direction intersects the second direction. Each data line crosses the common electrodes. Each data line functions as a touch driving electrode and each common electrode functions as a touch sensing electrode.

Abstract: Embodiments of mechanisms for forming dislocations in source and drain regions of finFET devices are provided. The mechanisms involve recessing fins and removing the dielectric material in the isolation structures neighboring fins to increase epitaxial regions for dislocation formation. The mechanisms also involve performing a pre-amorphous implantation (PAI) process either before or after the epitaxial growth in the recessed source and drain regions. An anneal process after the PAI process enables consistent growth of the dislocations in the source and drain regions. The dislocations in the source and drain regions (or stressor regions) can form consistently to produce targeted strain in the source and drain regions to improve carrier mobility and device performance for NMOS devices.

Abstract: A device may determine a link aggregation group (LAG) that aggregates links that includes a first group of links that connects the device to a first provider edge (PE) device and a second group of links that connects the device to the second PE device, where the first PE device and the second PE device are on an Ethernet virtual private network (EVPN) and are multi-homed PE devices for the device, and where the first PE device provides a local connection to a customer edge (CE) device for the device. The device may receive a message from the first PE device indicating that the first PE device lacks a connection with the EVPN, and may send, based on the message, traffic intended for the CE device via the first PE device and traffic intended for the EVPN via the second PE device and not the first PE device.

Abstract: A self-luminescence display apparatus capable of detecting pressure of touches applied by a user, the apparatus includes a display panel having a plurality of conductive layers and a supporting frame. One of the conductive layers cooperates with the supporting frame to form a plurality of force sensing capacitors. When a touch is applied, the display panel deforms according to pressure applied, which cause the capacitances of the force sensing capacitors to alter. The change in capacitance value, corresponding to a position where the touch operation is applied, can be calculated.

Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.

Abstract: The present invention provides a body-worn structure, and more particularly a body-worn structure that applies a containing structure to the body of an animal, including a person or pet, and uses a multifunctional structure for use by a user in various different circumstances. For example, the structure can be applied as a body protective device in an emergency situation in outdoor activities, such as riding a motorcycle, mountain-climbing, skiing, hand gliding, paragliding, and boating, when the body-worn structure is applied as a protective clothing, an airbag, airbag clothing, etc. Moreover, the body-worn structure is an all-in-one functional device, including use when taking a pet outdoors, when the structure can be applied as a pet knapsack, pet weatherproof clothing, pet carrier bag, and a fixing device for a pet droppings collection bag.

Abstract: Disclosed herein an apparatus and a method for detecting buried features using backscattered particles. In an example, the apparatus comprises a source of charged particles; a stage; optics configured to direct a beam of the charged particles to a sample supported on the stage; a signal detector configured to detect backscattered particles of the charged particles in the beam from the sample; wherein the signal detector has angular resolution. In an example, the methods comprises obtaining an image of backscattered particles from a region of a sample; determining existence or location of a buried feature based on the image.

Abstract: A method of manufacturing chip package is disclosed. The method includes steps of providing a wafer with an upper surface and a lower surface opposite thereto, in which a plurality of conductive pads are disposed on the upper surface; forming a plurality of conductive bumps on the corresponding conductive pads; thinning the wafer from the lower surface towards the upper surface; forming an insulating layer under the lower surface; etching the upper surface of the wafer to form a plurality of trenches exposing the insulating layer; forming a passivation layer covering an inner wall of each of the trenches; and dicing the passivation layer and the insulating layer along each of the trenches to form a plurality of chip packages.

Abstract: Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.

Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

Abstract: For use in an Ethernet Virtual Private Network (EVPN) in which a site including at least one MAC-addressable device is multihomed, via a customer edge device (CE), to at least two provider edge devices (PE1 and PE2), the potential problem of one of the at least two provider edge devices (PE2) dropping or flooding packets designed for a MAC-addressable device of the multihomed site is solved by controlling advertisements of an auto-discovery per EVPN instance (A-D/EVI) route (or an auto-discovery per Ethernet segment identifier (A-D/ESI) route) to a remote provider edge device (PE3), belonging to the EVPN but not directly connected with the CE.

Abstract: A touch display device includes a touch display module. The touch display module includes a TFT substrate, a color filtering substrate, and a liquid crystal layer encapsulated between the TFT substrate and the color filtering substrate. A first electrode layer is formed on a surface of the color filtering substrate facing the TFT substrate. A second electrode layer is formed on a surface of the TFT substrate facing the color filtering substrate. The touch display device further includes at least one supporting element on a side of the touch display module. The supporting element is elastic and configured for elastically resisting against the touch display module.

Abstract: Techniques are disclosed for an Ethernet Virtual Private Network (EVPN) Virtual Private Wire Service (VPWS) network with service interface-aware forwarding. In one example, a first network device signals to a second network device, using EVPN route advertisements, a multi-service service tunnel to transport network packets for a plurality of services. The services are identifiable by virtual local area network (VLAN) identifiers in the packets. The first network device is configured with a single transport interface for the service tunnel and the single transport interface is configured with respective service interfaces for the services. The first network device detects failure of a failed service interface of the service interfaces and outputs, in response to the failure, an EVPN route withdrawal message for the service tunnel that identifies the service corresponding to the failed service interface.