Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

Abstract: A display device includes a display and a detection module. The display includes a display surface and a casing, and the casing exposes the display surface. The detection module includes a pivoting component and a sensing component. The pivoting component is disposed on the casing and includes a bearing. The sensing component includes a sensor and a sensing surface. The sensing component is disposed on the bearing and is configured to rotate about an axis of the bearing so that the sensing surface faces the display surface. The sensor is configured to provide a position sensing signal for determining whether the sensing component has rotated to a detection position. A display calibration method is also provided.

Abstract: A semiconductor device includes a P-type Field Effect Transistor (PFET) and an NFET. The PFET includes an N-well disposed in a substrate, a first fin structure disposed over the N-well, a first liner layer disposed over the N-well, and a second liner layer disposed over the first liner layer. The first liner layer and the second liner layer include different materials. The NFET includes a P-well disposed in the substrate, a second fin structure disposed over the P-well, a third liner layer disposed over the P-well. The third liner layer and the second liner layer include the same materials.

Abstract: A wavelength conversion module includes a wavelength conversion wheel, a driving assembly, thermal conductive adhesive structures, and a deflector. The wavelength conversion wheel includes a rotatable disc and a wavelength conversion layer. The driving assembly is connected to the rotatable disc, and the wavelength conversion layer and the thermal conductive adhesive structures are respectively located on two opposite sides of the rotatable disc. The deflector is connected to the wavelength conversion wheel along the axis through the thermal conductive adhesive structures. Heat dissipation channels are formed among the deflector, the rotatable disc and the thermal conductive adhesive structures. An air inlet is defined by each of the heat dissipation channels and the deflector near the axis, and an air outlet is defined between each of the heat dissipation channels and a periphery of the deflector. An area of the air inlet is larger than an area of the air outlet.

Abstract: A backlight module includes a light source array, a reflector module, and an optical film. The light source array includes a plurality of light sources. The light emitted from the light source can be refracted by the lens unit to obtain a specific light-output angle and uniformity. The reflector module includes a plurality of reflector units. Each reflector unit includes a flat portion, a first wall portion, and a corner wall portion, which have structures and arrangements designed to enable the light source to achieve a display effect of less shadows and better contrast.

Abstract: An optical sensing module, including a frame, a light sensing element, and a diffusion element is provided. The light sensing element is disposed on the frame. The diffusion element is connected to the frame and is disposed above the light sensing element. In a first sensing mode, ambient light passes through the diffusion element before received by the light sensing element to make the optical sensing module to obtain light intensity of the ambient light. In a second sensing mode, the optical sensing module rotates around a first rotation axis to make the light sensing element face a display surface of the display device for receiving image light of the display surface so that the optical sensing module obtains brightness or chromaticity of the display device. A display device having this optical sensing module is also provided.

Abstract: A high and low-pressure integrated air pump includes a single housing including an air inlet and an air outlet. A high-pressure pump is disposed within the housing and in fluid communication with the air inlet, and uses a first outlet passage to discharge to the air outlet. A low-pressure pump is also disposed within the housing and in fluid communication with the air inlet, and uses a second outlet passage to discharge to the air outlet.

Abstract: The present disclosure relates to a biodegradable ocular implant comprising a biodegradable polymer containing a compound such as Edonentan, or a pharmaceutically acceptable salt thereof. Also disclosed are methods of treatment of ocular diseases with the biodegradable ocular implant and methods of preparation of the same.

Abstract: An optical communication system includes an optical module and a host. The optical module has a fiber connector and a laser condition pin, wherein the fiber connector is configured to connect to a laser output of an external laser source. The optical module is configured to set an output of the laser condition pin to have a first value when detecting a laser beam through the fiber connector. The host is connected to the laser condition pin and has a control connector, wherein the control connector is configured to connect to the external laser source. The host is configured to output a release signal through the control connector when detecting the first value on the laser condition pin, wherein the release signal changes the laser output from outputting a laser beam having a first power to outputting a laser beam having a second power higher than the first power.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: Disclosed herein are integrated circuit (IC) structures and methods for fabricating and testing such IC structures prior to dicing from a semiconductor wafer on which the IC structures are formed. In one example, a method for fabricating an IC structure includes contacting a first plurality of test pads of the IC structure with one or more test probes. The first plurality of test pads are disposed within or on a first dielectric layer within a scribe lane, i.e., a test region. A first metal layer is formed over the first plurality of test pads if a predefined test criteria is met as determined using information obtained through first plurality of test pads using the one or more test probes. The first metal layer is a layer formed in a die region of an IC die that is being fabricated in the wafer.

Abstract: A photolithographic apparatus includes a particle removing cassette, a pump and a compressor. The particle removing cassette includes a first slit that includes an array of parallel wind blade nozzles arranged along a length of the first slit, protruding from the first slit, and configured to eject and direct pressurized cleaning material to a patterning surface of a mask to remove debris particles on the patterning surface. The pump and the compressor are controlled by a controller to adjust a flow rate and a pressure of the pressurized cleaning material based on an amount of debris particles on the patterning surface of the mask.

Abstract: A method for forming a semiconductor structure is provided. The method includes forming a semiconductor fin structure including first semiconductor layers and second semiconductor layers alternatingly stacked, laterally recessing the first semiconductor layers of the semiconductor fin structure to form first notches in the first semiconductor layers, forming first passivation layers on first sidewalls of the first semiconductor layers exposed from the first notches, and forming first inner spacer layers in the first notches.

Abstract: In a method of manufacturing a semiconductor device a fin structure is formed in which first semiconductor layers and second semiconductor layers are alternately stacked over a substrate. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure that is not covered by the sacrificial gate structure is etched to form a source/drain space. An isolation region is formed at a bottom portion of the source/drain space. A source/drain epitaxial layer is formed over the isolation region in the source/drain space, and a void region in the isolation region is produced between the source/drain epitaxial layer and the substrate to cause electrical isolation between the source/drain region and the substrate.

Abstract: A display device including a display panel, an image capture element, and a processor is disclosed. The display panel displays a display screen, and to display an on screen display on the display screen. The image capture element captures an image. The processor analyzes the image to obtain an operator location information of an operator of the image and performs a face recognition operation corresponding to the operator, performs an eye recognition operation corresponding to the operator to obtain an operator eye information of the operator, and determines a display position and a display size of the on screen display on the display screen according to the operator location information and the operator eye information. The display panel displays the on screen display on the display screen according to the display position and the display size.

Abstract: An illumination system, including a housing, a first light source, a second light source, a polarization beam splitting element, and a heat dissipation module, is provided. The first light source and the second light source are disposed in the housing and are respectively configured to provide a first beam to the polarization beam splitting element along a first optical axis and a second beam to the polarization beam splitting element along a second optical axis. A portion of an inner surface of the housing has a light absorption region. The light absorption region is configured to absorb the first beam that is not reflected by the polarization beam splitting element and the second beam that does not penetrate the polarization beam splitting element, so as to convert them into heat. The heat generated by the light absorption region is dissipated by the heat dissipation module.

Abstract: The present disclosure relates to as external composition for wound healing containing a Lactobacillus fermentation product, which comprises a Lactobacillus fermentation product as an effective component. The Lactobacillus fermentation product is a bacteria-free concentrated filtrate from fermentation of Lactobacillus plantarum and the effective component is loaded onto a pharmaceutically acceptable absorbent carrier or carrying agent. The external composition for wound healing has anti-inflammatory and healing promoting effects on a skin wound after applied directly onto the skin wound.

Abstract: A serial peripheral interface circuit includes a serial peripheral interface device with a master-in-slave-out (MISO) line, a master-out-slave-in (MOSI) line, a serial clock (SCLK) line and a slave select (SS) line, a first conducting line, a second conducting line, a first resistor connecting the MISO line and the first conducting line, and a second resistor connecting the MOSI line and the second conducting line.

Abstract: A deep neural network (DNN) processing device with a decompressing module, comprises a storage module, for storing a plurality of binary codes, a coding tree, a zero-point value and a scale; a decompressing module, coupled to the storage module, for generating a quantized weight array according to the plurality of binary codes, the coding tree and the zero-point value wherein the quantized weight array is generated according to an aligned quantized weight array and the zero-point value; and a DNN processing module, coupled to the decompressing module, for processing an input signal according to the quantized weight array and the scale.

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.