Abstract: A backlight module includes a light source array, a reflector module, and an optical film. The light source array includes a plurality of light sources. The light emitted from the light source can be refracted by the lens unit to obtain a specific light-output angle and uniformity. The reflector module includes a plurality of reflector units. Each reflector unit includes a flat portion, a first wall portion, and a corner wall portion, which have structures and arrangements designed to enable the light source to achieve a display effect of less shadows and better contrast.

Abstract: A light-emitting device includes a first carrier, which includes a side surface between a first surface and a second surface, upper conductive pads on the first surface, and lower conductive pads under the second surface; a RDL pixel package includes a RDL which includes bonding pads and bottom electrodes, and the light-emitting units on the RDL, and connected to the bonding pads. A light-transmitting layer on the RDL and covers the light-emitting units, an upper surface, a lower surface, and a lateral surface between the upper surface and the lower surface. The RDL pixel package is on the first surface and electrically connected to the upper conductive pads. A protective layer covers the first surface and contacting the side surface of the RDL pixel package. The lower electrodes and the upper conductive pads are connected, and the distance between two adjacent bonding pads is less than 30 ?m.

Abstract: A plurality of switches may be arranged according to a spine and leaf topology in which each spine switch is connected to all leaf switches. A leaf switch includes a memory configured to store a plurality of policies, each of the plurality of policies being associated with a respective source identifier value and a respective destination address; a network interface communicatively coupled to one of the spine switches; and a processor implemented in circuitry and configured to: receive a packet from the spine switch via the network interface, the packet being encapsulated with a Virtual Extensible Local Area Network (VXLAN) header; extract a source identifier value from the VXLAN header; determine a destination address for the packet; determine a policy of the plurality of policies to apply to the packet according to the source identifier value and the destination address; and apply the policy to the packet.

Abstract: A semiconductor device includes a semiconductor substrate, a dielectric structure, an electrical insulating and thermal conductive layer and a circuit layer. The electrical insulating and thermal conductive layer is disposed over the semiconductor substrate. The dielectric structure is disposed over the electrical insulating and thermal conductive layer, wherein a thermal conductivity of the electrical insulating and thermal conductive layer is substantially greater than a thermal conductivity of the dielectric structure. The circuit layer is disposed in the dielectric structure.

Abstract: A projection apparatus including a liquid crystal on silicon panel and a processor is provided. The liquid crystal on silicon panel is configured to display a plurality of phase images. The phase images include a first phase image and a second phase image. The processor is coupled to the liquid crystal on silicon panel. The processor is configured to generate and output the phase images to drive the liquid crystal on silicon panel to display the phase images. The processor generates the first phase image according to a first phase information, and the processor generates the second phase image according to the first phase image.

Abstract: Provided are a micro light-emitting diode chip and a manufacturing method therefor, and a display device. The micro light-emitting diode chip comprises: a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer which are sequentially stacked, wherein the light-emitting layer is located between the first-type semiconductor layer and the second-type semiconductor layer; and a reflective layer provided at a light-emitting side of the light-emitting layer, wherein the reflective layer is configured to block light emitted by the light-emitting layer to an edge of the micro light-emitting diode chip.

Abstract: A method for aligning a camera lens with a light source is provided. The method is used in an aligning system. The aligning system includes an alignment element, a reference camera and a fixture. Firstly, the reference camera shoots a reference chart on the alignment element. Then, the light source is placed on the fixture. The light source illuminates the alignment element to generate an illumination result. The reference camera shoots the illumination result. If the illumination result does not comply with a preset specification represented by the reference chart, the fixture adjusts the light source. Then, the camera lens is placed on the fixture. Then, the camera lens shoots the reference chart on the alignment element to acquire a shooting result. If the shooting result does not comply with the preset specification, the fixture adjusts the camera lens.

Abstract: An illumination system, including a housing, a first light source, a second light source, a polarization beam splitting element, and a heat dissipation module, is provided. The first light source and the second light source are disposed in the housing and are respectively configured to provide a first beam to the polarization beam splitting element along a first optical axis and a second beam to the polarization beam splitting element along a second optical axis. A portion of an inner surface of the housing has a light absorption region. The light absorption region is configured to absorb the first beam that is not reflected by the polarization beam splitting element and the second beam that does not penetrate the polarization beam splitting element, so as to convert them into heat. The heat generated by the light absorption region is dissipated by the heat dissipation module.

Abstract: Techniques directed to forming and using coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards are described. One technique includes forming a substrate (205) comprising: first and second interconnect pads (213A, 213B) in or on a build-up layer (203); and first and second interconnects (211A, 211B) on the first and second interconnect pads (213A, 213B). The first interconnect pad (213A) can be located at a lower position than the second interconnect pad (213B) with regard to a z-position. The techniques described herein can assist with minimizing or eliminating solder ball bridge defects (SBBDs) that may be creating during performance of coupling technique (e.g., a reflow process, etc.).

Abstract: A heat dissipation module includes a base, a cover and a plurality of heat dissipation fins. The cover is disposed on the base and forms an accommodation space with the base. The plurality of heat dissipation fins is disposed in the accommodation space. The cover includes a top, at least one side wall, a first opening and a second opening. The first opening and the second opening are disposed on the top or the at least one side wall. The at least one side wall surrounds the top and is connected to the base. The distances between the plurality of heat dissipation fins and one of the at least one side wall in a first direction are different. A projection apparatus is also provided, which includes a light source module, a light valve, the aforementioned heat dissipation module and a projection lens.

Abstract: A method for aligning a camera lens with a light source is provided. The method is used in an aligning system. The aligning system includes an alignment element, a reference camera and a fixture. Firstly, the reference camera shoots a reference chart on the alignment element. Then, the light source is placed on the fixture. The light source illuminates the alignment element to generate an illumination result. The reference camera shoots the illumination result. If the illumination result does not comply with a preset specification represented by the reference chart, the fixture adjusts the light source. Then, the camera lens is placed on the fixture. Then, the camera lens shoots the reference chart on the alignment element to acquire a shooting result. If the shooting result does not comply with the preset specification, the fixture adjusts the camera lens.

Abstract: A wavelength conversion element, including a turntable, is provided. The turntable is configured to rotate along a central axis. The turntable has a first surface and a plurality of first turbulence portions and a plurality of second turbulence portions located on the first surface, wherein the first turbulence portions and the second turbulence portions are arranged by surrounding the central axis, a shape of each of the first turbulence portions is different from a shape of each of the second turbulence portions, and at least one of the second turbulence portions is arranged between two adjacent first turbulence portions of the first turbulence portions. A projector, including the wavelength conversion element, is further provided. The wavelength conversion element and the projector effectively improve the heat dissipation effect.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: A wavelength conversion module includes a wavelength conversion wheel, a driving assembly, thermal conductive adhesive structures, and a deflector. The wavelength conversion wheel includes a turntable and a wavelength conversion layer. The driving assembly is connected to the turntable, and the wavelength conversion layer and the thermal conductive adhesive structures are respectively located on two opposite sides of the turntable. The deflector is connected to the wavelength conversion wheel along the axis through the thermal conductive adhesive structures. A plurality of heat dissipation channels are formed among the deflector, the turntable and the thermal conductive adhesive structures. An air inlet is defined by each of the heat dissipation channels and the deflector near the axis, and an air outlet is defined between each of the heat dissipation channels and a periphery of the deflector. An area of the air inlet is larger than an area of the air outlet.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: A battery charging method is disclosed. The method includes: obtaining historical working durations in which the electronic device was powered by a battery of the electronic device; in response to an electronic device connected to a charging power source, obtaining a remaining battery level and a target capacity of a battery of the electronic device, and accordingly defining a capacity to be charged; obtaining a current system time when the electronic device is connected to the charging power source; obtaining a specific time difference between the current system time and a predicted working duration, wherein the predicted working duration is a specific working duration chosen from the historical working durations subsequent to the current system time; and using the capacity to be charged to correspond to the specific time difference to obtain a predicted charging current value.

Abstract: The present invention provides a human-computer interactive rehabilitation system, which can automatically calculate rehabilitation strength suitable for the patient, so that it is not necessary to manually evaluate and adjust the parameter settings in human-computer interactive rehabilitation system when different patients use it. At the same time, the human-machine interactive rehabilitation system and the hospital end can track the rehabilitation status and intervene through the data platform at any time. The platform establishes a cloud community feedback and encouragement mechanism, and immediately transmits the rehabilitation results to the designated barriers of the patients, provides patient encouragement feedback, and strengthens the community interaction and linkage in the medical relationship.

Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.

Abstract: A wavelength conversion module includes a driving element, a wavelength conversion wheel, and at least one flow guide. The wavelength conversion wheel includes a rotary disc and at least one wavelength conversion layer. The driving element is connected to the rotary disc to drive the wavelength conversion wheel to rotate along an axis of the driving element as a central axis. The flow guide is disposed beside the wavelength conversion wheel at intervals along the axis, and at least one airflow channel is formed between the flow guide and the wavelength conversion wheel. The flow guide and the driving element are disposed at intervals, and the flow guide does not contact the rotary disc and the driving element. An orthographic projection of the flow guide on the rotary disc overlaps the wavelength conversion layer. When the wavelength conversion wheel rotates, the wavelength conversion wheel and the flow guide move relatively.

Abstract: The present disclosure provides an ophthalmic composition comprising 4-(3-amino-1-(isoquinolin-6-ylamino)-1-oxopropan-2-yl)benzyl 2,4-dimethylbenzoate or its pharmaceutically acceptable salts; about 0.01% weight/volume to about 1.0% weight/volume of a buffer; and about 0.01% weight/volume to about 10% weight/volume of a tonicity agent.