Patents by Inventor Wen Ling

Wen Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090062446
    Abstract: A composition includes a coupling agent composition and a polymer precursor. The coupling agent composition includes an aromatic amine and a first cycloolefin substituted with at least one epoxy group. The polymer precursor includes a second cycloolefin and an epoxy compound. The coupling agent composition is capable of bonding to a filler having a corresponding binding site and the coupling agent composition is compatible with a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted to the first cycloolefin or the second cycloolefin. An associated method is also provided.
    Type: Application
    Filed: September 4, 2007
    Publication date: March 5, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Xiaolan Wei, Wendy Wen-Ling Lin, Warren Rosal Ronk
  • Publication number: 20090061713
    Abstract: An article includes a reaction product of a filler having binding sites, a coupling agent composition including an aromatic amine and a first cycloolefin substituted with at least one epoxy group, a polymer precursor including a second cycloolefin, and a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted to the first cycloolefin or the second cycloolefin. The coupling agent composition is capable of bonding to the filler and the coupling agent composition is compatible with a metathesis catalyst. An associated method is also provided.
    Type: Application
    Filed: September 4, 2007
    Publication date: March 5, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Wendy Wen-Ling Lin, Scott Roger Finn, Warren Rosal Ronk, Xiaolan Wei, Rachel Marie Suffield
  • Publication number: 20080305340
    Abstract: A method for manufacturing a multi-resin composite article is provided. The method comprises providing at least one fiber preform in a mold; injecting a plurality of resins into the at least one fiber preform at a plurality of locations on the at least one fiber preform; and forming at least one transition region along a mutual contact surface between the resins. Each of the at least one transition regions is defined by a gradual transition in composition from one of the resins to another of the resins. A multi-resin composite article is also provided. The article comprises: at least one fiber preform; a plurality of resins, wherein the at least one fiber preform is infused with the resins; and at least one transition region extending along a mutual contact surface between respective ones of the resins. A system for manufacturing such a multi-resin composite article is also provided.
    Type: Application
    Filed: June 7, 2007
    Publication date: December 11, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Xiaomei Fang, Wendy Wen-Ling Lin, Ming Xie, Scott Roger Finn
  • Patent number: 7429165
    Abstract: To address certain deficiencies of carbon fiber material as a filler in a hybrid blade, a glass composite layer is provided as a barrier layer between a carbon fiber resin filler and the metallic main body of the blade. The glass composite layer also advantageously provides a gradient in thermal expansion between the carbon fiber composite and the body of the blade (steel) to reduce interfacial residual stress.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: September 30, 2008
    Assignee: General Electric Company
    Inventors: Steven Sebastian Burdgick, Wendy Wen-Ling Lin, Adegboyega Makinde, Christophe Lanaud, Amitabh Bansal
  • Publication number: 20080145048
    Abstract: The present invention provides an optical fiber monitoring system and method incorporated with an automatic fault protection mechanism. The optical fiber monitoring system includes a primary optical channel, a secondary optical channel, an optical channel fault examination device, a plurality of automatic fault protection devices, and a plurality of optical terminal equipments. When an automatic fault protection device detects a fault, it switches the connection of the optical terminal equipments from the primary optical channel to the secondary optical channel; meanwhile, a test optical channel is selected to be checked by the optical channel fault examination device.
    Type: Application
    Filed: December 19, 2006
    Publication date: June 19, 2008
    Inventors: Hsuan-Hung Wu, Teng-Yuan Chi, Tien-Hsiang Lu, Wen-Ling Liao
  • Publication number: 20080086000
    Abstract: An isolated polypeptide containing the sequence of SEQ ID NO:1 or a functional equivalent of SEQ ID NO:1, in which the polypeptide reduces 15-keto prostaglandin but not leukotriene B4. Also disclosed is an antibody that binds specifically to the polypeptide and a double-stranded ribonucleic acid for inhibiting expression of the 15-keto prostaglandin-?13-reductase.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 10, 2008
    Inventors: Lee-Ming CHUANG, Zee-Fen CHANG, Wen-Ling CHOU
  • Publication number: 20070292274
    Abstract: To address certain deficiencies of carbon fiber material as a filler in a hybrid blade, a glass composite layer is provided as a barrier layer between a carbon fiber resin filler and the metallic main body of the blade. The glass composite layer also advantageously provides a gradient in thermal expansion between the carbon fiber composite and the body of the blade (steel) to reduce interfacial residual stress.
    Type: Application
    Filed: June 14, 2006
    Publication date: December 20, 2007
    Applicant: General Electric Company
    Inventors: Steven Sebastian Burdgick, Wendy Wen-Ling Lin, Adegboyega Makinde, Christophe Lanaud, Amitabh Bansal
  • Publication number: 20070292265
    Abstract: A steam turbine system for use in conjunction with hybrid last stage(s) LP buckets. The system is adapted to cool the bucket tip region during low VAN windage conditions whereby the beneficial design and efficiency outcomes of the use of hybrid blades can be realized.
    Type: Application
    Filed: June 14, 2006
    Publication date: December 20, 2007
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Steven Sebastian Burdgick, Christophe Lanaud, Peter Michael Finnigan, Wendy Wen-ling Lin
  • Patent number: 7281231
    Abstract: The present invention discloses an integrated circuit structure and a design method thereof, in which a circuit passageway is arranged at each circuit element terminal in circuit design stage. The arranged circuit passageway does not only increase layout flexibility in circuit simulation stage but also simplify layout difficulty when the circuit layout needs to be modified after taping out stage. Also, the circuit passageway can minimize modified metal layers, i.e. the number of modified masks is minimized. Because the expense of fab is based on the utilized layers and number of masks instead of designs of masks, the present invention will not increase the expense in taping out stage and can save the cost of research and development when modifications are required.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: October 9, 2007
    Assignee: ALi Corporation
    Inventors: Tsang-Chi Kan, Wen-Ling Chen, Min-Chih Liu
  • Patent number: 7187096
    Abstract: An enclosure for a rotor in a generator including the rotor, rotor windings and a stator, the enclosure comprising a plurality of composite rings located adjacent one another along a length dimension of the rotor so as to contain the rotor windings on the rotor, the rings each comprising at least two layers selected from the group consisting essentially of metals, glass fiber laminates and graphite fiber laminates.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: March 6, 2007
    Assignee: General Electric Company
    Inventors: Yu Wang, Christopher Anthony Kaminski, Erwin W. Liang, Ronald Ralph Cairo, Wendy Wen-Ling Lin, Andrew Jay Salem
  • Patent number: 7164134
    Abstract: An apparatus and method for fabricating a high performance reflective material for use on scintillator elements in a computed tomograph (CT) imaging device. Adjacent scintillator elements are separated by gaps filled with a reflective coating layer. In one embodiment, the reflective coating layer consists of a surface level coating layer, an adhesion layer, a metallic reflective layer, and a top layer consisting of either a barrier coating layer or a polymeric encapsulant, or both. In another embodiment, the metallic reflective coating layer is applied to the scintillator element via an electroless metal deposition process utilizing a reducing agent and a metal complex. The CT reflectors formed by either embodiment have improved light output, minimized cross talk, higher geometric efficiency, and decreased performance degradation as compared with current CT reflectors that utilize organic binders and titanium dioxide fillers is achieved.
    Type: Grant
    Filed: August 1, 2003
    Date of Patent: January 16, 2007
    Assignee: General Electric Company
    Inventors: Chang Wei, Robert Joseph Lyons, Richard Louis Hart, Jaime Andres Echeverry, Wendy Wen-Ling Lin
  • Publication number: 20060276340
    Abstract: The present invention relates to a herbicidal composition, especially used as a rape field herbicide, prepared by mixing pyrimidinyl benzylamine herbicide (Pyribambenz-propyl or Pyribambenz-isopropyl) with at least one rape field herbicide selected from a group consisting of: acetyl-CoA carboxylase (ACCase) inhibitors including quizalofop-ethyl, fluazifop-p-butyl, haloxyfop, fenoxaprop, and sethoxydim; chloro-amido herbicides including acetochlor, alachlor, napropamide, ehaprochlor, and metolachlor; ethametsulfuron; and benazolin. The composition of the present invention is of synergistic effect, reduced dosage, broadened spectrum of weed control, delayed resistance and increased safety toward rape.
    Type: Application
    Filed: July 2, 2004
    Publication date: December 7, 2006
    Applicants: Zhejiang Chem-Tech Group Co., Ltd., Shanghai Institute of Organic Chemistry, Chinese
    Inventors: Jie Chen, Long Lu, Jun Yuan, Xiaoyan Xu, Wen Ling, Lishang Mao, Yonghua Wang
  • Publication number: 20060228550
    Abstract: A method for synthesizing monodipersive polymeric microspheres is disclosed. The method can control the diameter distribution of the microspheres and make it homogeneous. The manufactured polymeric microspheres also have plural functional groups on the surface for depositing metal particles thereon through redox. Moreover, the metal particles can be distributed on the surface of the polymeric microspheres homogeneously.
    Type: Application
    Filed: July 22, 2005
    Publication date: October 12, 2006
    Applicant: Chung Cheng Institute of Technology, National Defense University
    Inventors: Jinn-Luh Ou, Ming-Der Ger, Yuh Sung, Hui Chen, Wang-Do May, Chun-Chieh Tseng, Hung-Wen Ling
  • Patent number: 7052939
    Abstract: A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: May 30, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wen Ling M. Huang, Sushil Bharatan, Carl Kyono, David J. Monk, Kun-Hin To, Pamela J. Welch
  • Publication number: 20060036394
    Abstract: A wafer testing real-time monitoring software system and its unique open software architecture which achieves real-time monitoring of wafer test results and on-line changing of externally hooked software to satisfy customer needs without changing its main program. The software structure receives and processes binary files from different probers and converts these into readable ASCII files. The system consists of four software programs that can operate independently. These programs are an automatic transfer program, a program which converts wafer test results from a binary file to an ASCII file, a program which receives the ASCII files and performs wafer map editing, and an auto-ftp program which automatically scans data and sends data to remote locations. Additionally, multiple workstations can process data from probers simultaneously. The on-line monitor on a production line can see production results from multiple major workstations through the network drive and drive mapping functions.
    Type: Application
    Filed: August 12, 2004
    Publication date: February 16, 2006
    Inventors: Wen-Ling Chen, Ming Wei
  • Publication number: 20060003410
    Abstract: An isolated polypeptide containing the sequence of SEQ ID NO: 1 or a functional equivalent of SEQ ID NO:1, in which the polypeptide reduces 15-keto prostaglandin but not leukotriene B4. Also disclosed is an antibody that binds specifically to the polypeptide and a double-stranded ribonucleic acid for inhibiting expression of the 15-keto prostaglandin-?13-reductase.
    Type: Application
    Filed: June 8, 2005
    Publication date: January 5, 2006
    Inventors: Lee-Ming Chuang, Wen-Ling Chou
  • Publication number: 20050186856
    Abstract: The invention relates to a connecting plate of a multi-layers IC board, which includes the connecting plate being provided one end with an engaging step to connect with another engaging step of another connecting plate for shortening the length of the assembly. And the assembled plate can be used on a smaller multi-layers IC board that can provide a lighter and smaller product for being used effectively.
    Type: Application
    Filed: February 19, 2004
    Publication date: August 25, 2005
    Inventor: Wen-Ling Lo
  • Publication number: 20050183885
    Abstract: The invention relates to a conducting structure of a multi-layers IC board, which includes conducting rod being received in aperture of the IC board to obtain an effective connection and conduction. And the conducting wire is placed horizontally on the IC board, which has its ending pin and annular metal ring to contact with two apertures respectively and to be welded thereon for perfect conduction and smaller assembled volume.
    Type: Application
    Filed: February 19, 2004
    Publication date: August 25, 2005
    Inventor: Wen-Ling Lo
  • Patent number: 6884507
    Abstract: The present invention provides tough, high modulus, low density thermoset polyurethane compositions which are useful in general as, for example, cast structural materials and in a preferred embodiment can be cured directly onto an aircraft engine fan blade, thereby providing a lighter blade, without concomitant loss in structural integrity or blade performance due to, for example, resistance to foreign object impacts and fuel efficiency. In a preferred embodiment, the composition is comprised of bis-amine compounds reacted with isocyanate-functional polyether polymers in the presence of hollow polymeric microspheres. The thermoset polymer compositions are formed by casting into a mold which is formed by a cavity within the metallic or composite fan blade or guide vane in the form of a pocket and a removable caul sheet. After the elastomeric polyurethane foam is injected through at least one injector port into the mold, the foam is cured.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: April 26, 2005
    Assignee: General Electric Company
    Inventors: Wendy Wen-Ling Lin, Scott Roger Finn, Kevin Warner Flanagan, Joseph Timothy Stevenson, James Claude Carnahan
  • Publication number: 20050028126
    Abstract: The present invention discloses an integrated circuit structure and a design method thereof, in which a circuit passageway is arranged at each circuit element terminal in circuit design stage. The arranged circuit passageway does not only increase layout flexibility in circuit simulation stage but also simplify layout difficulty when the circuit layout needs to be modified after taping out stage. Also, the circuit passageway can minimize modified metal layers, i.e. the number of modified masks is minimized. Because the expense of fab is based on the utilized layers and number of masks instead of designs of masks, the present invention will not increase the expense in taping out stage and can save the cost of research and development when modifications are required.
    Type: Application
    Filed: January 21, 2004
    Publication date: February 3, 2005
    Inventors: Tsang-Chi Kan, Wen-Ling Chen, Min-Chih Liu