Abstract: A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).

Abstract: A wafer testing real-time monitoring software system and its unique open software architecture which achieves real-time monitoring of wafer test results and on-line changing of externally hooked software to satisfy customer needs without changing its main program. The software structure receives and processes binary files from different probers and converts these into readable ASCII files. The system consists of four software programs that can operate independently. These programs are an automatic transfer program, a program which converts wafer test results from a binary file to an ASCII file, a program which receives the ASCII files and performs wafer map editing, and an auto-ftp program which automatically scans data and sends data to remote locations. Additionally, multiple workstations can process data from probers simultaneously. The on-line monitor on a production line can see production results from multiple major workstations through the network drive and drive mapping functions.

Abstract: An isolated polypeptide containing the sequence of SEQ ID NO: 1 or a functional equivalent of SEQ ID NO:1, in which the polypeptide reduces 15-keto prostaglandin but not leukotriene B4. Also disclosed is an antibody that binds specifically to the polypeptide and a double-stranded ribonucleic acid for inhibiting expression of the 15-keto prostaglandin-?13-reductase.

Abstract: The invention relates to a conducting structure of a multi-layers IC board, which includes conducting rod being received in aperture of the IC board to obtain an effective connection and conduction. And the conducting wire is placed horizontally on the IC board, which has its ending pin and annular metal ring to contact with two apertures respectively and to be welded thereon for perfect conduction and smaller assembled volume.

Abstract: The invention relates to a connecting plate of a multi-layers IC board, which includes the connecting plate being provided one end with an engaging step to connect with another engaging step of another connecting plate for shortening the length of the assembly. And the assembled plate can be used on a smaller multi-layers IC board that can provide a lighter and smaller product for being used effectively.

Abstract: The present invention provides tough, high modulus, low density thermoset polyurethane compositions which are useful in general as, for example, cast structural materials and in a preferred embodiment can be cured directly onto an aircraft engine fan blade, thereby providing a lighter blade, without concomitant loss in structural integrity or blade performance due to, for example, resistance to foreign object impacts and fuel efficiency. In a preferred embodiment, the composition is comprised of bis-amine compounds reacted with isocyanate-functional polyether polymers in the presence of hollow polymeric microspheres. The thermoset polymer compositions are formed by casting into a mold which is formed by a cavity within the metallic or composite fan blade or guide vane in the form of a pocket and a removable caul sheet. After the elastomeric polyurethane foam is injected through at least one injector port into the mold, the foam is cured.

Abstract: The present invention discloses an integrated circuit structure and a design method thereof, in which a circuit passageway is arranged at each circuit element terminal in circuit design stage. The arranged circuit passageway does not only increase layout flexibility in circuit simulation stage but also simplify layout difficulty when the circuit layout needs to be modified after taping out stage. Also, the circuit passageway can minimize modified metal layers, i.e. the number of modified masks is minimized. Because the expense of fab is based on the utilized layers and number of masks instead of designs of masks, the present invention will not increase the expense in taping out stage and can save the cost of research and development when modifications are required.

Abstract: The present invention provides tough, high modulus, low density thermoset polyurethane compositions which are useful in general as, for example, cast structural materials and in a preferred embodiment can be cured directly onto an aircraft engine fan blade, thereby providing a lighter blade, without concomitant loss in structural integrity or blade performance due to, for example, resistance to foreign object impacts and fuel efficiency. In a preferred embodiment, the composition is comprised of bis-amine compounds reacted with isocyanate-functional polyether polymers in the presence of hollow polymeric microspheres. The thermoset polymer compositions are formed by casting into a mold which is formed by a cavity within the metallic or composite fan blade or guide vane in the form of a pocket and a removable caul sheet. After the elastomeric polyurethane foam is injected through at least one injector port into the mold, the foam is cured.

Abstract: This invention relates to new 2-pyrimidinyloxy-N-aryl-benzylamine derivatives, their preparation processes and uses as chemical herbicides in agriculture. The compound has the following structure: wherein, D or E is hydrogen, halogen, C1-C4 alkyl, C1-C4 alkoxy, C1-C4 haloalkyl or C1-C4 haloalkoxy; R1 is hydrogen, halogen, C1-C4 alkyl, C1-C4 alkoxy; R2 is hydrogen, halogen, C1-C4 alkyl, C1-C4 alkoxy, C1-C4 carbamyl, C1-C4 alkoxycarbonyl, C1-C4 haloalkyl, cyano, nitro, carboxy or its alkali metal, alkali earth metal and organoammonium salts, C1-C4 alkylamido, C1-C4 haloalkylamido, heterocyclic amido, benzamido or substituted benzamido, benzo or substituted benzo compounds; R3 is hydrogen, C1-C4 alkanoyl, C1-C4 haloalkanoyl, benzoyl or C1-C4 alkoxyacetyl; X is CH or N; n=1-3.

Abstract: A thermal responsive, water soluble polymer. The polymer comprises the co-polymerization product of: (a) 5˜95 wt % of N-isopropyl acrylamide (NIP); (b) 0.1˜80 wt % of 1-vinyl-2-pyrrolidinone (VPD); and optionally, (c) 0.1˜30 wt % of acrylic acid (AA). As the proportion of component (b) VPD increases, the Lower Critical Solution Temperature (LCST) and water solubility of the polymer increases. On the other hand, as the proportion of component (c) AA increases, the Lower Critical Solution Temperature (LCST) decreases and the COOH reactive groups increases, which impart high reactivity to the copolymer. By adjusting the proportion of the monomers, a broad range of LCST can be manipulated from about 20 to 80° C.

Abstract: A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).

Abstract: An assembled and convertible decorating assembly includes at least three partition assemblies. Each partition assembly mainly includes several fixing elements, a pair of vertical rods, a pair of horizontal rods, a decorating element, and a pair of auxiliary horizontal rods. By several pivoting elements, this invention has the following three modes: a complete detached mode, a linear assembled mode that is a screen and an enclosed assembled mode that is an illuminating device. It is easy for storage or transportation. It can be assembled or re-arranged by the user. And, it has many functions such as a regular upright screen, an illuminating device, and an exhibition post, etc.

Abstract: An assembled and convertible decorating assembly includes at least three partition assemblies. Each partition assembly mainly includes several fixing elements, a pair of vertical rods, a pair of horizontal rods, a decorating element, and a pair of auxiliary horizontal rods. By several pivoting elements, this invention has the following three modes: a complete detached mode, a linear assembled mode that is a screen and an enclosed assembled mode that is an illuminating device. It is easy for storage or transportation. It can be assembled or re-arranged by the user. And, it has many functions such as a regular upright screen, an illuminating device, and an exhibition post, etc.

Abstract: An integrated circuit that supports digital circuits, analog circuits, and RF circuits on a single IC. Digital CMOS circuitry lies on a low resistivity layer that provides good latch-up qualities and allows for dense PAD I/O. Analog CMOS circuitry rests on an isolated well region on a highly resistive layer in order to minimize signal crosstalk through the substrate. Analog BJT devices also sit on a highly resistive region within its own well structure in order to minimize parasitic capacitances and provide for high frequency device switching. RF passive elements, such as inductors and capacitors, rest on a highly resistive region in order to minimize signal losses that especially occur at high frequencies. RF active components rest on a highly resistive region to maximize device performance.

Abstract: Epoxy polymer precursors and epoxy polymers resulting therefrom are tolerant to bombardment by high-energy radiation. The epoxy polymer precursors comprise at least an epoxy resin free of aromatic units and at least a curing agent selected from the group consisting of aliphatic polyamines, cycloaliphatic polyamines, polyamides, aliphatic anhydrides, cycloaliphatic anhydrides, and mixtures thereof. In one embodiment of the invention the epoxy resin comprises at least a cycloparaffinic group, and the curing agent comprises a polyamine derived from cyclohexane. Such epoxy polymer compositions are used to form reflectors elements between adjacent scintillator elements in high-energy radiation detector array.

Abstract: This invention relates to new 2-pyrimidinyloxy-N-aryl-benzylamine derivatives, their preparation processes and uses as chemical herbicides in agriculture.

Abstract: A multi-component hybrid turbine blade comprises a shank portion and an airfoil portion. The airfoil portion comprises a composite section having a first density. The composite section comprises a recess and an insert section. The insert section has a second mass density, which is less than the first mass density. The insert section is disposed in the recess, and the insert section is bonded to the composite section. The composite section and the insert section together define an airfoil shape. A fabrication method comprising laying up composite material layers to form a portion of the composite section. The portion of the composite section comprises a recess. Disposing the insert section in the recess. Laying up additional composite material layers to achieve a final desired thickness of the composite section while covering the insert section.

Abstract: A multi-component hybrid turbine blade comprises a shank portion and an airfoil portion. The airfoil portion comprises a composite section having a first density. The composite section comprises a recess and an insert section. The insert section has a second mass density, which is less than the first mass density. The insert section is disposed in the recess, and the insert section is bonded to the composite section. The composite section and the insert section together define an airfoil shape. A fabrication method comprising laying up composite material layers to form a portion of the composite section. The portion of the composite section comprises a recess. Disposing the insert section in the recess. Laying up additional composite material layers to achieve a final desired thickness of the composite section while covering the insert section.

Abstract: A thermal responsive, water soluble polymer. The polymer comprises the co-polymerization product of: (a) 5˜95 wt % of N-isopropyl acrylamide (NIP); (b) 0.1˜80 wt % of 1-vinyl-2-pyrrolidinone (VPD); and optionally, (c) 0.1˜30 wt % of acrylic acid (AA). As the proportion of component (b) VPD increases, the Lower Critical Solution Temperature (LCST) and water solubility of the polymer increases. On the other hand, as the proportion of component (c) AA increases, the Lower Critical Solution Temperature (LCST) decreases and the COOH reactive groups increases, which impart high reactivity to the copolymer. By adjusting the proportion of the monomers, a broad range of LCST can be manipulated from about 20 to 80° C.

Abstract: The present invention provides tough, high modulus, low density thermoset polyurethane compositions which are useful in general as, for example, cast structural materials and in a preferred embodiment can be cured directly onto an aircraft engine fan blade, thereby providing a lighter blade, without concomitant loss in structural integrity or blade performance due to, for example, resistance to foreign object impacts and fuel efficiency. In a preferred embodiment, the composition is comprised of bis-amine compounds reacted with isocyanate-functional polyether polymers in the presence of hollow polymeric microspheres. The thermoset polymer compositions are formed by casting into a mold which is formed by a cavity within the metallic or composite fan blade or guide vane in the form of a pocket and a removable caul sheet. After the elastomeric polyurethane foam is injected through at least one injector port into the mold, the foam is cured.