Patents by Inventor Wen Liu

Wen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153881
    Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Inventors: Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
  • Publication number: 20240152855
    Abstract: Disclosed in the present disclosure is an information-based intelligent quality traceability system for fresh milk, which includes a database module configured to store information of the system, a data encryption module configured to encrypt obtained information, an enterprise information module, a raw material information module, a first measurement module, a destruction information module, a transportation information module, a second measurement module, a processing information module, and a delivery information module. Each information module obtains information, a data decryption module is configured to decrypt obtained information, a vehicle condition analysis module is configured to analyze a relation between a vehicle running condition and product quality, and a data analysis module is configured to analyze the data of the system.
    Type: Application
    Filed: June 2, 2023
    Publication date: May 9, 2024
    Inventors: Qi Yang, Ming HAN, Weihua LIU, Junhua YANG, Juan ZHAO, Xin LI, Wen ZHANG, Yating DENG
  • Patent number: 11975329
    Abstract: An incubation system includes an actuator, a platform, an incubation lid, and a dispenser. The actuator includes a motion disc and a shaft connected to the motion disc. The shaft extends away from the motion disc. The platform is connected to the shaft of the actuator in a manner allowing movement transmission. The platform has a through hole and a thermal conductive plate. One end of the through hole is sealed by the thermal conductive plate. The incubation lid is movably disposed over the platform. The platform is thermal insulating. The incubation lid has an opening allowing fluid communication, and the dispenser suspends over the thermal conductive plate of the platform.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: May 7, 2024
    Assignee: LifeOS Genomics Corporation
    Inventors: Timothy Z. Liu, Hung-Wen Chang
  • Patent number: 11979606
    Abstract: Methods and apparatuses of encoding a video stream using video point cloud coding include obtaining a source point cloud; generating a geometry map and a texture map based on the source point cloud; generating a reconstructed geometry map and a reconstructed texture map using lossy coding without using recoloring, wherein a resolution of the reconstructed geometry map is same as a resolution of the reconstructed texture map; obtaining a point of the source point cloud corresponding to a geometry pixel of the geometry map and a texture pixel of the texture map; selecting a color of the texture pixel based on a color of the obtained point; and generating an encoded video stream based on the selected color, the geometry map, and the texture map.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: May 7, 2024
    Assignee: TENCENT AMERICA LLC
    Inventors: Xiang Zhang, Wen Gao, Shan Liu, Weiwei Feng, Bing Jian
  • Publication number: 20240144717
    Abstract: Disclosed are systems, apparatuses, processes, and computer-readable media to capture images. A method of processing image data includes determining a first region of interest (ROI) in an image. The first ROI is associated with a first object. The method can include determining one or more image characteristics of the first ROI. The method can further include determining whether to perform an upsampling process on image data in the first ROI based on the one or more image characteristics of the first ROI.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: Wen-Chun FENG, Kai LIU, Su-Chin CHIU, Chung-Yan CHIH, Yu-Ren LAI
  • Publication number: 20240145398
    Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Liang HSU, Wan-Rou CHEN, Hsin-Yin CHANG, Tsung-Li LIN, Hsiu-Jung LI, Chiu-Lien LI, Fu-Quan XU, Yi-Wen LIU, Chih-Chieh SUN
  • Publication number: 20240143791
    Abstract: The invention introduces an apparatus for detecting errors during data encryption. The apparatus includes a search circuitry and a substitution check circuitry. The key generation circuitry is arranged operably to convert a first value of one byte corresponding to a plaintext, an intermediate encryption result, or a round key into a second value of a K-bit according to an 8-to-K lookup table, where K is an integer ranging from 10 to 15 and the second value comprises (K minus 8) bits of a Hamming parity. The substitution check circuitry is arranged operably to employ check formulae corresponding to the 8-to-K lookup table to determine whether an error is occurred during a conversion of the first value of the one byte into the second value of the K-bit, and output an error signal when finding the error, where a total amount of the formulae is K minus 8.
    Type: Application
    Filed: May 30, 2023
    Publication date: May 2, 2024
    Applicant: Silicon Motion, Inc.
    Inventors: Wun-Jhe WU, Po-Hung CHEN, Chiao-Wen CHENG, Jiun-Hung YU, Chih-Wei LIU
  • Publication number: 20240139446
    Abstract: A method for determining a degree of degradation of a user interface worn by an individual during one or more uses of a respiratory therapy system includes receiving data associated with the user interface. The method further includes determining, based at least in part on the received data, a value of at least one degradation indicator associated with the user interface. The method further includes determining the degree of degradation of the user interface based at least in part on the value of the at least one degradation indicator.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 2, 2024
    Inventors: Nathan Zersee Liu, Priyanshu Gupta, Andrew Chan, Gregory Robert Peake, Wendy Wen Yi Leong, Genevieve Claire Atkinson, Jaiden James Choy
  • Patent number: 11974071
    Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.
    Type: Grant
    Filed: August 21, 2022
    Date of Patent: April 30, 2024
    Assignee: MEDIATEK INC.
    Inventors: Kang-Yi Fan, Chin-Wen Liang, Chang-Chu Liu, Sheng-Hsiang Chang, You-Min Yeh
  • Publication number: 20240133490
    Abstract: The present disclosure provides a bainite geological drilling pipe, comprising the following chemical elements in percentage by mass: 0.14-0.22% of C, 0.2-0.55% of Si, 2.1-2.9% of Mn, 0.01-0.04% of Nb, 0.015-0.04% of Al, 0.001-0.005% of B, 0<N?0.007%, with the balance being Fe and inevitable impurities, wherein a content ratio of Al to N is Al/N?3. In addition, the present disclosure further provides a manufacturing method for the bainite geological drilling pipe, comprising the following steps: (1) performing smelting and casting on molten steel to obtain a pipe blank; (2) performing heating, piercing, continuous rolling and sizing on the pipe blank to obtain a pipe body; and (3) performing two-stage air cooling on the pipe body; in first-stage air cooling, performing air circular blowing cooling on the outer surface of the pipe body, the temperature before cooling is greater than or equal to Ar/3+50° C., the cooling rate is 5-15° C./s, and cooling to a temperature range from Bs-100° C. to Bs-50° C.
    Type: Application
    Filed: February 25, 2022
    Publication date: April 25, 2024
    Applicant: BAOSHAN IRON & STEEL CO., LTD.
    Inventors: Wen SUN, Yaoheng LIU, Zhonghua ZHANG, Ping HU, Yannan MA
  • Publication number: 20240136316
    Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
  • Patent number: 11967645
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a field plate, a gate electrode, and a first dielectric layer. The substrate has a top surface. The substrate includes a first drift region with a first conductivity type extending from the top surface of the substrate into the substrate, and includes a second drill region with the first conductivity type extending from the top surface of the substrate into the substrate and adjacent to the first drift region. The field plate is over the substrate. The gate electrode has a first portion and a second portion, wherein the first portion of the gate electrode is located over the field plate. The first dielectric layer is between the substrate and the field plate. The first portion of the gate electrode is overlapping with a boundary of the first drift region and the second drift region in the substrate.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yogendra Yadav, Chi-Chih Chen, Ruey-Hsin Liu, Chih-Wen Yao
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Patent number: 11967820
    Abstract: Various embodiments of the teachings herein include a method for deploying power quality monitoring (PQM) devices. The method may include: determining a maximum number of PQM devices and historical power data of candidate deployment points, wherein the number of the candidate deployment points is greater than the maximum number of the PQM devices; clustering the historical power data of the candidate deployment points, wherein a target number of categories is determined on the basis of a silhouette coefficient of each candidate number of categories and the maximum number of the PQM devices; and determining PQM device deployment points based on the center of each category in the target number of categories.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: April 23, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Dan Wang, Jing Li, Hao Liu, Wen Tao Hua, Ang Li, Peng Fei Zhang
  • Patent number: 11967120
    Abstract: A method, computer program, and computer system is provided for point cloud coding. The method includes receiving, from a bitstream, data corresponding to a point cloud; reconstructing, based on the data, a first attribute value of a first duplicate point from among a plurality of duplicate points corresponding to a single geometry position; obtaining at least one prediction residual corresponding to at least one remaining attribute value of at least one remaining duplicate point from among the plurality of duplicate points; reconstructing the at least one remaining attribute value based on the reconstructed first attribute and the at least one prediction residual; and decoding the data corresponding to the point cloud based on the reconstructed first attribute value and the reconstructed at least one remaining attribute value.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: April 23, 2024
    Assignee: TENCENT AMERICA LLC
    Inventors: Xiang Zhang, Wen Gao, Shan Liu
  • Publication number: 20240124350
    Abstract: A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: Ching LIU, Wen-Tse HUANG, Ru-Shi LIU, Pei Cong YAN, Chai-Chun HSIEH, Hung-Chun TONG, Yu-Chun LEE, Tzong-Liang TSAI
  • Publication number: 20240124241
    Abstract: A transporting device can transport at least one product, the transporting device includes a mounting frame, a driving mechanism, a transmitting mechanism including a plurality of bent portions, a plurality of guiding mechanisms, and a supporting mechanism. Each guiding mechanism includes a rotating wheel and a guiding plate. Each bent portion is connected to the rotating wheel. The guiding plate is connected to the rotating wheel. The supporting mechanism can support the product. The driving mechanism is further connected to the rotating wheel and can drive the transmitting mechanism to rotate to drive the supporting mechanism to move. The driving mechanism is further connected to the guiding plate, the guiding plate and the rotating wheel can synchronously rotate to drive the supporting mechanism to pass through the bent portions. The present disclosure further provides a heating device.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Huan ZHANG, Qi KUANG, Hua WAN, Yi LIU, Wei-Wei WU, Jing-Chao YANG, Wen-Jin XIA
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Publication number: 20240128477
    Abstract: This disclosure relates to electrolyzer composite membranes, and in particular, to a composite membrane having at least two reinforcing layers comprising a microporous polymer structure and a surprisingly high resistance to piercing. The electrolyzer composite membranes have a recombination catalyst configured to be disposed closer to an anode than to a cathode in a membrane-electrode assembly (MEA). The disclosure also relates to membrane-electrode assemblies and electrolyzers comprising the membranes, and to method of manufacture of the membranes.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 18, 2024
    Inventors: Joshua M. Bartels, Wen Liu, Alexander L. Agapov
  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu