Abstract: A biosensor including a first sensor, a second sensor, a patterned dielectric layer and a cover is provided. The first sensor includes a first voltage-reference device and a first bio-sensing device. The second sensor is disposed adjacent to the first sensor, the second sensor includes a second voltage-reference device and a second bio-sensing device, the first sensor is spaced apart from the second sensor by a lateral distance, and the lateral distance is greater than a half of an average lateral dimension of the first voltage-reference device and the second voltage-reference device. The patterned dielectric layer includes sensing wells located above the first voltage-reference device, the first bio-sensing device, the second voltage-reference device and the second bio-sensing device. The cover includes fluid channels communicating with the sensing wells.

Abstract: Methods for improving joinder between a surface-mount package and a printed circuit board are disclosed. The warpage at a corner of the surface-mount package and at a corresponding corner of a joint area on the printed circuit board are measured to determine the degree of mismatch. A mini-pad is applied to the corner between the surface-mount package and the joint area on the printed circuit board. The thickness of the mini-pad pushes against the surface-mount package and the printed circuit board, reducing the degree of mismatch below a critical dimension of a ball grid array of the surface-mount package. The surface-mount package can then be soldered to the joint area, reducing or preventing the formation of solder bridges and short circuits.

Abstract: An ultrasound imaging system is configured to interface with a dual frequency ultrasound transducer having one or more low frequency ultrasound arrays and one or more high frequency ultrasound arrays. The imaging system produces driving pulses for both the high frequency ultrasound array and the low frequency ultrasound imaging array. Analog echo signals are processed to produce a low frequency ultrasound image and a high frequency ultrasound image that are simultaneously displayed. Tissue shown in the high frequency ultrasound image is a portion of the tissue shown in the low frequency ultrasound image.

Abstract: A semiconductor module includes a substrate, at least one chip, at least one signal assembly and an encapsulant. The chip is disposed on and electrically connected to the substrate. The signal assembly is disposed on the substrate along a normal direction of the substrate and electrically connected the substrate. The signal assembly includes at least one power semiconductor package signal connection element disposed on the substrate and at least one implanted signal pin inserted into the power semiconductor package signal connection element. The encapsulant is disposed on the substrate and has at least one groove. The encapsulant covers the chip and the power semiconductor package signal connection element. From a top surface of the encapsulant relatively away from the substrate, the groove extends toward the substrate until at least an upper surface of the power semiconductor package signal connection element is exposed.

Abstract: An optical fiber distribution sub-frame including a base plate, two opposite sides of which are each provided with a mounting point position; a bracket, which is detachably mounted at the mounting point position on any side of the base plate; and an optical fiber channel tray, which is hinged to the bracket. When the bracket is mounted at the mounting point positions on different sides, the optical fiber channel tray is reversed along with the bracket. When the bracket changes position, the optical fiber channel tray connected to the bracket can be reversed together, so that the bracket and the optical fiber channel tray can be replaced from one side of the base plate to the opposite side, and after reversing, the base plate can be replaced from one rotation direction to the other relative to the optical fiber channel tray.

Abstract: The present disclosure relates to the technical field of automobile part processing, and specifically provides a clamping device and a sandblasting device for automobile part processing. The clamping device comprises a clamping component for clamping an automobile part, and an auxiliary component; the auxiliary component comprises a supporting part, a pull rod, a protective pad, and a return spring, wherein the pull rod is movably provided on the supporting part, one end of the pull rod is connected to the protective pad having deformation performance, and the protective pad is used for being arranged between the automobile part and the clamping component; the return spring is used for being installed between the supporting part and the protective pad; the pull rod is pulled so that the pull rod pulls the protective pad to move towards the direction close to the supporting part.

Abstract: The present disclosure relates to data compression and data decompression methods and apparatuses, and storage media. The method includes: acquiring delay data from a plurality of focuses to different array elements during ultrasonic imaging; determining focus phase description information corresponding to the array elements based on the delay data; and compressing the focus phase description information corresponding to the array elements to obtain compressed delay data.

Abstract: Disclosed herein are methods of identifying or selecting subjects having a sensitivity to WEE1 inhibitors e.g., ZN-c3 and using a WEE1 inhibitor e.g., ZN-c3 to treat or inhibit a cancer including non-small cell lung cancer, breast cancer, colorectal cancer, ovarian cancer, endometrial cancer, or uterine serous carcinoma (USC).

Abstract: Disclosed is a method for determining 224Ra in a sediment by using a pulse ionization chamber emanometer, which belongs to the technical field of analysis and measurement. A pulse ionization chamber emanometer (PIC), a new emanometer, is used. Based on the half-life characteristics of different radon isotopes, one can separate the 220Rn activity from the total counts by dual counting. The resulting 220Rn measurement then can be used to determine the 224Ra activity in sediment according to the principle of secular radioactive equilibrium.

Abstract: A network communication device having an antenna frame includes a circuit board, a network communication chip, an antenna, a signal cable and an antenna frame. The network communication chip is disposed on the circuit board. The signal cable is electrically connected to the antenna and the circuit board. The antenna frame is assembled on the circuit board. The antenna frame has a slot. The antenna is engaged in the slot. The antenna is directly fixed on the circuit board through the antenna frame, and the assembling of the antenna is easy to complete.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a substrate, a first semiconductor die disposed on the substrate, and a second semiconductor die disposed on the substrate spaced from the first semiconductor die to define a gap between the first semiconductor die and the second semiconductor die. The semiconductor device assembly may include a thermally-conductive filler disposed in the gap between the first semiconductor die and the second semiconductor die.

Abstract: An electronic package and manufacturing method are provided. The electronic package includes a carrier structure and an electronic element. The carrier structure has a first side and a second side opposing the first side and includes at least one insulation layer and at least one circuit layer bonded to the at least one insulation layer. The electronic element is disposed on the first side of the carrier structure. A portion of each of the circuit layers of the carrier structure in a response region below the electronic element is hollowed out to reduce signal interference during high frequency signal transmission and to enhance the reliability of high frequency transmission.

Abstract: A profile download method includes a primary device obtaining an embedded integrated circuit card identifier (EID) of a secondary device, where the EID is used by the primary device to obtain, from a mobile operator server, profile download information that matches the EID. The primary device receives the profile download information from the mobile operator server and sends the profile download information to the secondary device, where the profile download information is used by the secondary device to download a profile from a profile management server, and where the profile is installed in an embedded UICC (eUICC) of the secondary device after the download is complete.

Abstract: The present disclosure relates to novel urocortin-2 polypeptides, having activity at the corticotropin-releasing hormone receptor-2 (CRHR2), pharmaceutical compositions comprising the polypeptides, and methods of using the polypeptides to treat disorders associated with CRHR2.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a fin active region formed on a semiconductor substrate and spanning between a first sidewall of a first shallow trench isolation (STI) feature and a second sidewall of a second STI feature; an anti-punch through (APT) feature of a first type conductivity; and a channel material layer of the first type conductivity, disposed on the APT feature and having a second doping concentration less than the first doping concentration. The APT feature is formed on the fin active region, spans between the first sidewall and the second sidewall, and has a first doping concentration.

Abstract: A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.

Abstract: A monitoring method for spring protection, the method comprises: based on an actual flow rate of a spring eye, determining whether the flow rate is interfered by an urban construction project, and if so, determining a descending rate of the flow rate under an interference of urban construction projects; determining a corresponding target duration range according to the descending rate, and determining a corresponding interference node of the urban construction project in each groundwater recharge path, wherein the target duration range is a duration range required for the urban construction project to generate interference on the flow and determining a target flow duration of the groundwater from each interference node, and if the target flow duration is within the target duration range, determining the urban construction project to which the corresponding interference node belongs to be a preferentially censored project.

Abstract: A protein analysis platform includes a platform body comprising: a gel working unit provided in a top portion of the platform body and comprising a gel accommodation area for accommodating at least one gel; at least one electrophoresis tank provided along a side of the gel accommodation area and provided with at least one electrode; and a blotting layer stack provided in a bottom portion of the gel working unit and comprising an electrode layer; wherein a removable bottom plate is provided between the gel working unit and the blotting layer stack and detachably corresponds to a bottom side of the gel accommodation area. The protein analysis platform is used for western blotting or next-generation western blotting, wherein the protein analysis platform can quickly complete steps such as gel casting, electrophoresis, and blotting in one platform.

Abstract: In some embodiments, a computer-implemented method includes ascertaining a multitier topology representation of an edge cloud network; generating a pseudo node topology representation of the edge cloud network from the multitier topology representation; and utilizing the pseudo node topology representation of the edge cloud network to ascertain minimum-latency pseudo-node-based edge cloud clusters (ECCs), the minimum-latency pseudo-node-based ECCs being utilized to minimize a latency of user requests routed through the edge cloud network from a user of the edge cloud network. In some embodiments of the computer-implemented method, the minimum-latency pseudo-node-based ECCs are ascertained based upon a pseudo-node-based round-trip-times (RTTs) assessment from the user of the edge cloud network, the user requests being routed to the minimum-latency pseudo-node-based ECCs ascertained using the pseudo node topology representation.

Abstract: Metal oxide films are reduced to metal with an atmospheric pressure argon and hydrogen plasma at temperatures between 25 and 250° C. A 40-nm-thick copper oxide layer on a copper-coated silicon wafer, 300 mm in diameter, can be fully removed by the argon and hydrogen plasma in under two minutes at 150° C. The fast rate of metal oxide reduction to metal demonstrates that this process is well suited for front- and back-end semiconductor manufacturing, such as for example, flux-free flip chip bonding of microbumps.