Patents by Inventor Wen Peng

Wen Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180327180
    Abstract: Provided is a base plate unit, which is of an integrated structure made of fiber reinforced polymer-matrix composite and comprises a base plate unit body and foot plates. The base plate unit body comprises at least one bearing part, each bearing part comprising a panel, a plurality of web plates extending downwards from the bottom of the panel, and bottom supports disposed at the lower end of the web plates. The web plates comprise two side-web plates on the two sides of the panel and a middle web plate in the middle. The foot plates are disposed on the two outer sides of the bottom of the base plate unit body, and are formed by the bottoms of the two side-web plates on the outmost side of the base plate unit body respectively extending outwards horizontally. Also provided is a base plate unit provided with a cavity filling member.
    Type: Application
    Filed: November 20, 2015
    Publication date: November 15, 2018
    Applicants: Nantong CIMC ECO New Materials Development CO., LTD., CIMC CONTAINER HOLDINGS LIMITED CO., LTD., CHINA INTERNATIONAL MARINE CONTAAINERS (GROUP) LTD.
    Inventors: Shuang HE, Fuyou WANG, Wen PENG
  • Publication number: 20180260354
    Abstract: An apparatus includes a first device connector configured to be coupled to a first device. The apparatus also includes a second device connector configured to be coupled to a second device. The apparatus further includes at least two connection arms forming a hinged connection between the first device connector and the second device connector. In addition, the apparatus includes a flexible connector coupled to the first device connector and the second device connector, at least a portion of the flexible connector extending through the at least two connection arms, the flexible connector comprising a flexible printed circuit board assembly (PCBA) or a flexible flat cable (FFC).
    Type: Application
    Filed: March 7, 2017
    Publication date: September 13, 2018
    Inventors: Shimei Deng, Wen Peng, Fangyin Wan, Lei Zou
  • Publication number: 20180211966
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Application
    Filed: March 21, 2018
    Publication date: July 26, 2018
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Patent number: 10023392
    Abstract: A belt driven linear actuator includes: a base, a linearly movable unit, a belt driven unit, a first cover, a second cover, a drive source, and a slide block. With the first and second covers removably disposed on the base, the first and second covers can be located at different positions to define different gaps in different directions, so as to allow the slide block to be assembled in different directions, and reduce the restriction on the assembling direction of the drive source. Besides, the width of the base is equal to the height of the base, and the height of the cover portion is equal to the height and the width of the base, which allows the base to be assembled in the same position while in different directions.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: July 17, 2018
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventor: Tsung-Wen Peng
  • Patent number: 9966382
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: May 8, 2018
    Assignee: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Patent number: 9933057
    Abstract: A linear actuator includes a linear module including a base, a screw rod mounted in the base and a transmission carriage threaded onto the screw rod, and a support module including two support carriages movably mounted on the screw rod at two opposite sides relative to the transmission carriage, a protective cover disposed at one side of the base and connected to the two support carriages, two pulley blocks mounted at the two opposite ends of the protective cover and a cable wound round the pulleys of the pulley blocks and connected to the transmission carriage and the base by a respective cable connection plate. Thus, the transmission carriage utilizes the cable to carry one pulley block and then the protective cover, causing the protective cover to carry the two support carriages and the other pulley block, achieving the effect of supporting the screw rod.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: April 3, 2018
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Tsung-Wen Peng, Meng-Lung Tsai
  • Publication number: 20180053771
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Application
    Filed: August 16, 2016
    Publication date: February 22, 2018
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Patent number: 9766749
    Abstract: A touch device and a sensing compensation method are provided. The touch device may include a touch panel, a sensing compensation circuit and a sensing circuit. The sensing compensation circuit may be coupled to the touch panel for providing a compensation-impedance according to features of the touch panel. The sensing circuit may be coupled to the sensing compensation circuit. The sensing circuit receives touch information compensated by the sensing compensation circuit.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: September 19, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Yen-Lin Pan, Wei-Yen Lee, Chang-Po Chao, Hung-Ming Tsai, Hsuan-Wen Peng
  • Publication number: 20170233192
    Abstract: A belt driven linear actuator includes: a base, a linearly movable unit, a belt driven unit, a first cover, a second cover, a drive source, and a slide block. With the first and second covers removably disposed on the base, the first and second covers can be located at different positions to define different gaps in different directions, so as to allow the slide block to be assembled in different directions, and reduce the restriction on the assembling direction of the drive source. Besides, the width of the base is equal to the height of the base, and the height of the cover portion is equal to the height and the width of the base, which allows the base to be assembled in the same position while in different directions.
    Type: Application
    Filed: February 11, 2016
    Publication date: August 17, 2017
    Inventor: Tsung-Wen PENG
  • Patent number: 9730352
    Abstract: A system includes (i) a module configured to be mounted on a panel and (ii) a clamp. The clamp includes a retaining section configured to receive and retain a threaded structure. The retaining section is also configured to be connected to and apply force against the module. The clamp also includes a contact section configured to contact the panel and apply force against the panel. The clamp further includes a connecting portion connecting the retaining section and the contact section. The connecting portion is configured to allow part of the threaded structure to contact the contact section in order to create the forces applied against the panel and the module. The connecting portion can be elastic such that a separation of the retaining section and the contact section changes as the threaded structure pushes against the contact section.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: August 8, 2017
    Assignee: Honeywell International Inc.
    Inventors: Wen Peng, Lei Jiang, Chaohong Liu, Qiankun Jiang
  • Publication number: 20170094826
    Abstract: A guide and support apparatus is provided. The guide and support apparatus comprises a mounting portion, a support portion, and a guide and lock portion. The support portion extends to the guide and lock portion and ends at the mounting portion. The mounting portion extends downward from one or two ends of the support portion and comprises a lock structure. The guide and lock portion extends from the support portion to a certain height. Further, a method for manufacturing the guide and support apparatus is provided.
    Type: Application
    Filed: September 30, 2016
    Publication date: March 30, 2017
    Inventors: Wen Peng, Chaohong Liu, Lei Jiang
  • Publication number: 20170036238
    Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 9, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chuan-Sheng ZHUANG, Ching-Chih LIN, Steven LIN, Wei-Lun TAI, Wen-Peng TSENG, Ji-Bin HORNG
  • Patent number: 9533350
    Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: January 3, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chuan-Sheng Zhuang, Ching-Chih Lin, Steven Lin, Wei-Lun Tai, Wen-Peng Tseng, Ji-Bin Horng
  • Patent number: 9477496
    Abstract: A method and apparatus for loading classes to virtual machines and a method and apparatus for reorganizing class archives. The method for loading a class to a virtual machine includes organizing a class archive before class loading such that the organized class archive includes a class contraction portion and loading only the class contraction portion of the class archive to the virtual machine at the moment of class loading. By first loading the class contraction portion from the organized class archive to the virtual machine at the moment of loading, the present invention curtails code redundancy, shortens loading time and reduces occupied memory resources.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: October 25, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Chang Yan Chi, Xin Hui Li, Wen Peng Xiao
  • Patent number: 9379128
    Abstract: A split gate NVM device includes a semiconductor substrate, an ONO structure disposed on the semiconductor substrate, a first gate electrode disposed on the ONO structure, a second gate electrode disposed on the semiconductor substrate, adjacent to and insulated from the first gate electrode and the ONO structure, a first doping region with a first conductivity formed in the semiconductor substrate and adjacent to the ONO structure, a second doping region with the first conductivity formed in the semiconductor substrate and adjacent to the second gate electrode, and a third doping region with the first conductivity formed in the semiconductor substrate, disposed between the first doping region and the second doping region and adjacent to the ONO structure and the second gate electrode.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: June 28, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Liang Yi, Ko-Chi Chen, Shen-De Wang, Chia-Ching Hsu, Chun-Sung Huang, Wen-Peng Hsu
  • Publication number: 20160103508
    Abstract: A transparent conductive film includes a transparent substrate. A support layer is formed on one surface of the substrate. A surface of the support layer away from the substrate defines grooves formed in a mesh pattern. An ink layer is formed at a bottom of the grooves. A conductive layer is formed on the ink layer and in a mesh pattern. A top of the conductive layer protrudes out of the grooves.
    Type: Application
    Filed: November 28, 2014
    Publication date: April 14, 2016
    Inventors: TEN-HSING JAW, CHIN-YANG WU, CHIU-CHI CHEN, SHIH-WEN PENG, TE-JEN TSENG, CHENG-HSIN CHUANG
  • Publication number: 20160066465
    Abstract: A system includes (i) a module configured to be mounted on a panel and (ii) a clamp. The clamp includes a retaining section configured to receive and retain a threaded structure. The retaining section is also configured to be connected to and apply force against the module. The clamp also includes a contact section configured to contact the panel and apply force against the panel. The clamp further includes a connecting portion connecting the retaining section and the contact section. The connecting portion is configured to allow part of the threaded structure to contact the contact section in order to create the forces applied against the panel and the module. The connecting portion can be elastic such that a separation of the retaining section and the contact section changes as the threaded structure pushes against the contact section.
    Type: Application
    Filed: August 26, 2014
    Publication date: March 3, 2016
    Inventors: Wen Peng, Lei Jiang, Chaohong Liu, Qiankun Jiang
  • Patent number: 9246269
    Abstract: The invention is directed towards a connector with a guiding portion having a housing, a connecting interface having a plurality of conductive terminals, and a first guiding post disposed along the housing, whereby the first guiding post has a sloping guiding portion.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: January 26, 2016
    Assignee: Tyco Electronics Holdings Bermuda) No. 7 Ltd.
    Inventor: Sheng Wen Peng
  • Publication number: 20160021448
    Abstract: A microphone system includes an acoustic control unit and a microphone unit. The acoustic control unit transmits a clock signal and receives an acoustic audio signal and determines whether or not the acoustic audio signal is a valid audio data. The microphone unit receives the clock signal from the acoustic control unit and transmits the acoustic audio signal captured by the microphone unit to the acoustic control unit. Before the acoustic audio signal is determined as the valid audio data, the acoustic control unit transmits the clock signal which is turned on and off repeatedly with an ON duration and an OFF duration.
    Type: Application
    Filed: November 5, 2014
    Publication date: January 21, 2016
    Inventors: Chien-Wen Peng, Chao-Ping Chuang
  • Publication number: 20140375600
    Abstract: A touch device and a sensing compensation method are provided. The touch device may include a touch panel, a sensing compensation circuit and a sensing circuit. The sensing compensation circuit may be coupled to the touch panel for providing a compensation-impedance according to features of the touch panel. The sensing circuit may be coupled to the sensing compensation circuit. The sensing circuit receives touch information compensated by the sensing compensation circuit.
    Type: Application
    Filed: January 24, 2014
    Publication date: December 25, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Yen-Lin Pan, Wei-Yen Lee, Chang-Po Chao, Hung-Ming Tsai, Hsuan-Wen Peng