Abstract: An injection mold for molding a first insert element and a second insert element includes a male mold, a female mold matched with the male mold, and at least one fastening assembly. The first insert element includes a first material belt with at least one fastening hole formed therein, and a plurality of first conductive terminals. The second insert element includes a plurality of second conductive terminals. The male mold defines a male cavity for receiving the second conductive terminals therein. The female mold defines a female cavity for receiving the first conductive terminals therein. The fastening assembly includes a fastening element and a magnetic element with a center hole formed therein. The magnetic element is held in the female mold. A top of the fastening element passes through the fastening hole to be inserted in the center hole and attracted by the magnetic element.

Abstract: A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.

Abstract: An electrical connector for connection with a circuit board having a plurality of through holes and a plurality of SMT contacts. The electrical connector having a plurality of through hole terminals positioned according to the plurality of through holes and arranged in a top-down manner along an upper row and a lower row, and a plurality of SMT terminals positioned sequentially adjacent to each other along a common row in corresponding position to the plurality of SMT contacts on the circuit board.

Abstract: A heat dissipation device includes a base and a fin group fixed on the base. The base includes a container, a flattened heat pipe and a solid supporting member. The container includes a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween. The heat pipe and the supporting member are housed in the receiving chamber. Opposite sides of the heat pipe and the supporting member respectively abut against the baffle plate and the cover of the container.

Abstract: Disclosed is an apparatus for managing a working task based on a communication message. The apparatus may include a rule matching module configured to, in response to receiving a communication message, match the communication message using a matching rule. An application determining module is configured to determine an application managing a working task associated with the communication message according to the matching result. A prompting module is configured to prompt the user to perform an operation on the application managing the working task.

Abstract: A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon.

Abstract: A method for managing a working task based on a communication message. The method may include the steps of: in response to receiving a communication message, matching the communication message using a matching rule; determining an application managing a working task associated with the communication message according to the matching result; prompting the user to perform an operation on the application managing the working task.

Abstract: An exemplary heat dissipation device includes a base and fasteners. The base includes a bottom plate, a top plate, a heat pipe, and a frame. The heat pipe is sandwiched between peripheries of the bottom plate and the top plate. The frame is sandwiched between the bottom plate and the top plate. The frame surrounds the heat pipe. The fasteners extend through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.

Abstract: An injection mold for molding a product having at least one bar formed at one side thereof. The injection mold includes a stationary mold including an inclined pillar and a movable mold including a movable core and a sliding block mounted on a top thereof. The inclined pillar inserted in the sliding block to drive the sliding block to slide towards or away from the movable core. A shaping cavity for molding the product is formed among the movable core, the sliding block and the stationary mold. The end surface of the sliding block further defines at least one shaping groove connected with the shaping cavity for molding the bar. The movable mold further includes an ejector pin and a maintaining pillar. The maintaining pillar resists against a bottom of the sliding block to avoid the ejector pin moving upward before the bar completely parted from the shaping groove.

Abstract: An injection mold for molding a product having a hook portion includes a stationary mold, a return pin, a movable mold, an ejector mechanism and a plurality of ejector pins for ejecting the product out of the injection mold. The movable mold defines an inserting perforation, a receiving groove and a receiving gap. The ejector mechanism includes a slide block located in the receiving groove, a supporting bar stretching into the receiving groove, and an inclined ejector pin having a tail at a top thereof movably inserted in the inserting perforation and fastened on the slide block. The slide block is pressed downward by the return pin when the injection mold is closed. When the injection mold is opened, the slide block drives the inclined ejector pin to move upward and sideward under an upward push of the supporting bar to make the hook portion parted from the tail.

Abstract: Disclosed is an insert molding apparatus employed to form a plastic product with an insert. The insert has an inserting unit and an extending unit. The insert molding apparatus comprises a cope plate, a lower die and a holding mechanism. The cope plate is formed with a cavity. The extending unit dips into the cavity. The holding mechanism is installed on the lower die to hold the extending unit of the insert. When the insert molding apparatus of the present invention is opened, the holding mechanism can hold the extending unit of the insert to prevent the plastic product sticking to the cope plate. Accordingly, it is capable to prevent the plastic product crushed when the insert molding apparatus is closed again.

Abstract: An injection mold includes a fixed mold having a clamping plate and a fixed plate mounted underneath the clamping plate. An angular pin has an upper end fastened in a through hole of the fixed plate and a lower end projected underneath the fixed plate. A side-compression block fastened underneath the fixed plate has a securing portion. A movable mold movably engaged with the fixed mold has a movable plate and a sliding plate slidably mounted on the movable plate and capable of sliding sideward on the movable plate under the actions of the lower end of the angular pin and the side-compression block. The sliding plate defines a guiding hole to receive the lower end of the angular pin therein when the injection mold is closed. A top surface of the movable plate defines a securing groove for securing the securing portion therein.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.

Abstract: Disclosed is a shaping mold for products with a circular hole, comprising a male mold and a female mold corresponding thereto, forming a core cavity therebetween after the shaping mold is closed. A pin mold core and a female mold core capable of dipping into the core cavity are in the male mold and female mold respectively. A mating face of the pin mold core and the inner face of a square hole shaping portion of the female mold core compress with each other after the shaping mold is closed. With the limitation head and the limitation boards buckling up, the shaping mold of the present invention restricts the pin mold core not rotated in the core cavity to prevent dislocation of the mating face and the square hole shaping portion happening during the insert and shut off operation. Accordingly, the shaping accuracy of the products can be guaranteed.

Abstract: An injection mold for molding an insert element which includes a material belt with two belt holes formed therein and a plurality of terminals. Each terminal has a fastening portion with an inserting hole formed therein and a contact portion. The injection mold includes a male mold, a plurality of locating elements, a fastening element, a plurality of locating pieces and a female mold. The male mold has a cavity and a plurality of inserting grooves. Each locating element mounted to the male mold has a locating head extending beyond the male mold for inserting into the belt holes. The fastening element mounted to the cavity has a plurality of fastening grooves for respectively receiving the fastening portions. Each locating piece inserted into the inserting grooves has an inserting portion passing through the inserting hole and supporting the contact portion. The female mold is engaged with the male mold.

Abstract: A connector having a basic structure of a Slimline SATA connector with terminal sets for transmitting PCIe signals. The connector includes a first plurality of conductive terminals and a first insulating body, as well as second plurality of conductive terminals and a second insulating body. The first insulating body includes a port and a plurality of terminal grooves for receiving the first plurality of conductive terminals. The second insulating body includes a slot, L-shaped tongue members, and a plurality of terminal grooves for engagement with the second plurality of conductive terminals.

Abstract: Disclosed is an insert molding employed to form a plastic product with an insert. The insert has an inserting unit and an extending unit. The insert molding comprises a cope plate, a lower die and a holding mechanism. The cope plate is formed with a cavity. The extending unit dips into the cavity. The holding mechanism is installed on the lower die to hold the extending unit of the insert. When the insert molding of the present invention is opened, the holding mechanism can hold the extending unit of the insert to prevent the plastic product sticking to the cope plate. Accordingly, it is capable to prevent the plastic product crushed when the insert molding is closed again.

Abstract: Provided is a mould with flat thimble including a mould core, a guide plate and a flat thimble. The mould core disposes a groove. The guide plate is fixedly connected to one end of the mould core and forms a through hole corresponding to the groove. The flat thimble partly passes through the through hole to be received in the groove. Wherein the through hole includes a communicating section and a guiding section expanded from one end of the communicating section along away from the groove, a pore diameter of the guiding section is larger than that of the communicating section, and the flat thimble partly passes through the communicating section and the guiding section to be received in the groove. The mould with flat thimble of the prevent invention can be fast assembled and can elongate life thereof.

Abstract: The hard drive enclosure contains a casing member where a first rack at a first lateral side has a number of partition plates, each having a number of through holes allowing a rod to pass through. A number of covers laterally arranged in parallel on a front side of the hard drive enclosure, each capable of swiveling around a front axle and engages a rod. A number of levers are pivotally configured adjacent to a back side of the first rack, each engaged by a rod and having a pushing piece. When a cover is pulled outward, a rod is engaged to drive a lever whose pushing piece ejects the hard drive for additional distance.

Abstract: A dynamic bandwidth allocation method of an Ethernet passive optical network, comprises a predictor and a rule of QoS-promoted dynamic bandwidth allocation (PQ-DBA); the predictor predicts a client behavior and numbers of various kinds of packets by using a pipeline scheduling predictor consisted of a pipelined recurrent neural network (PRNN), and a learning rule of the extended recursive least squares (ERLS); the present invention establishes a better QoS traffic management for the OLT-allocated ONU bandwidth and client packets sent by priority.