Patents by Inventor Wen Peng
Wen Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120263821Abstract: An injection mold for molding a product having at least one bar formed at one side thereof. The injection mold includes a stationary mold including an inclined pillar and a movable mold including a movable core and a sliding block mounted on a top thereof. The inclined pillar inserted in the sliding block to drive the sliding block to slide towards or away from the movable core. A shaping cavity for molding the product is formed among the movable core, the sliding block and the stationary mold. The end surface of the sliding block further defines at least one shaping groove connected with the shaping cavity for molding the bar. The movable mold further includes an ejector pin and a maintaining pillar. The maintaining pillar resists against a bottom of the sliding block to avoid the ejector pin moving upward before the bar completely parted from the shaping groove.Type: ApplicationFiled: April 18, 2011Publication date: October 18, 2012Inventors: Wen-Peng Gong, Xiao-Ping Wu, Kun-Hsueh Chiang
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Publication number: 20120244238Abstract: An injection mold for molding a product having a hook portion includes a stationary mold, a return pin, a movable mold, an ejector mechanism and a plurality of ejector pins for ejecting the product out of the injection mold. The movable mold defines an inserting perforation, a receiving groove and a receiving gap. The ejector mechanism includes a slide block located in the receiving groove, a supporting bar stretching into the receiving groove, and an inclined ejector pin having a tail at a top thereof movably inserted in the inserting perforation and fastened on the slide block. The slide block is pressed downward by the return pin when the injection mold is closed. When the injection mold is opened, the slide block drives the inclined ejector pin to move upward and sideward under an upward push of the supporting bar to make the hook portion parted from the tail.Type: ApplicationFiled: March 24, 2011Publication date: September 27, 2012Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.Inventors: Wen-Peng Gong, Xiao-Ping Wu, Kun-Hsueh Chiang
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Patent number: 8231373Abstract: Disclosed is an insert molding apparatus employed to form a plastic product with an insert. The insert has an inserting unit and an extending unit. The insert molding apparatus comprises a cope plate, a lower die and a holding mechanism. The cope plate is formed with a cavity. The extending unit dips into the cavity. The holding mechanism is installed on the lower die to hold the extending unit of the insert. When the insert molding apparatus of the present invention is opened, the holding mechanism can hold the extending unit of the insert to prevent the plastic product sticking to the cope plate. Accordingly, it is capable to prevent the plastic product crushed when the insert molding apparatus is closed again.Type: GrantFiled: October 18, 2010Date of Patent: July 31, 2012Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Wen-peng Gong, Xiao-ping Wu, Shih-hsiung Ho
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Publication number: 20120183640Abstract: An injection mold includes a fixed mold having a clamping plate and a fixed plate mounted underneath the clamping plate. An angular pin has an upper end fastened in a through hole of the fixed plate and a lower end projected underneath the fixed plate. A side-compression block fastened underneath the fixed plate has a securing portion. A movable mold movably engaged with the fixed mold has a movable plate and a sliding plate slidably mounted on the movable plate and capable of sliding sideward on the movable plate under the actions of the lower end of the angular pin and the side-compression block. The sliding plate defines a guiding hole to receive the lower end of the angular pin therein when the injection mold is closed. A top surface of the movable plate defines a securing groove for securing the securing portion therein.Type: ApplicationFiled: January 14, 2011Publication date: July 19, 2012Applicant: Cheng Uei Precision Industry Co., LTD.Inventors: WEN-PENG GONG, Xiao-Ping Wu, Kun-Hsueh Chiang
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Patent number: 8222731Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.Type: GrantFiled: December 24, 2009Date of Patent: July 17, 2012Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chun Chen, Kuo-Wen Peng, Ker-Chang Hsieh
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Publication number: 20120141624Abstract: Disclosed is a shaping mold for products with a circular hole, comprising a male mold and a female mold corresponding thereto, forming a core cavity therebetween after the shaping mold is closed. A pin mold core and a female mold core capable of dipping into the core cavity are in the male mold and female mold respectively. A mating face of the pin mold core and the inner face of a square hole shaping portion of the female mold core compress with each other after the shaping mold is closed. With the limitation head and the limitation boards buckling up, the shaping mold of the present invention restricts the pin mold core not rotated in the core cavity to prevent dislocation of the mating face and the square hole shaping portion happening during the insert and shut off operation. Accordingly, the shaping accuracy of the products can be guaranteed.Type: ApplicationFiled: December 3, 2010Publication date: June 7, 2012Applicant: Cheng Uei Precision Industry Co., LTD.Inventors: Wen-peng GONG, Xiao-ping WU, Kun-hsueh CHIANG
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Patent number: 8192190Abstract: An injection mold for molding an insert element which includes a material belt with two belt holes formed therein and a plurality of terminals. Each terminal has a fastening portion with an inserting hole formed therein and a contact portion. The injection mold includes a male mold, a plurality of locating elements, a fastening element, a plurality of locating pieces and a female mold. The male mold has a cavity and a plurality of inserting grooves. Each locating element mounted to the male mold has a locating head extending beyond the male mold for inserting into the belt holes. The fastening element mounted to the cavity has a plurality of fastening grooves for respectively receiving the fastening portions. Each locating piece inserted into the inserting grooves has an inserting portion passing through the inserting hole and supporting the contact portion. The female mold is engaged with the male mold.Type: GrantFiled: May 24, 2010Date of Patent: June 5, 2012Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Wen-Peng Gong, Xian-Yun Wang, Xiao-Ping Wu, Shih-Hsiung Ho
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Publication number: 20120115371Abstract: A connector having a basic structure of a Slimline SATA connector with terminal sets for transmitting PCIe signals. The connector includes a first plurality of conductive terminals and a first insulating body, as well as second plurality of conductive terminals and a second insulating body. The first insulating body includes a port and a plurality of terminal grooves for receiving the first plurality of conductive terminals. The second insulating body includes a slot, L-shaped tongue members, and a plurality of terminal grooves for engagement with the second plurality of conductive terminals.Type: ApplicationFiled: November 9, 2011Publication date: May 10, 2012Inventors: Wen-Ching Chuang, Sheng-Wen Peng, Huei-Shun Feng
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Publication number: 20120093967Abstract: Disclosed is an insert molding employed to form a plastic product with an insert. The insert has an inserting unit and an extending unit. The insert molding comprises a cope plate, a lower die and a holding mechanism. The cope plate is formed with a cavity. The extending unit dips into the cavity. The holding mechanism is installed on the lower die to hold the extending unit of the insert. When the insert molding of the present invention is opened, the holding mechanism can hold the extending unit of the insert to prevent the plastic product sticking to the cope plate. Accordingly, it is capable to prevent the plastic product crushed when the insert molding is closed again.Type: ApplicationFiled: October 18, 2010Publication date: April 19, 2012Applicant: Cheng Uei Precision Industry Co., Ltd.Inventors: Wen-peng GONG, Xiao-ping WU, Shih-hsiung HO
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Publication number: 20120070530Abstract: Provided is a mould with flat thimble including a mould core, a guide plate and a flat thimble. The mould core disposes a groove. The guide plate is fixedly connected to one end of the mould core and forms a through hole corresponding to the groove. The flat thimble partly passes through the through hole to be received in the groove. Wherein the through hole includes a communicating section and a guiding section expanded from one end of the communicating section along away from the groove, a pore diameter of the guiding section is larger than that of the communicating section, and the flat thimble partly passes through the communicating section and the guiding section to be received in the groove. The mould with flat thimble of the prevent invention can be fast assembled and can elongate life thereof.Type: ApplicationFiled: September 17, 2010Publication date: March 22, 2012Applicant: Cheng Uei Precision Industry Co., LTD.Inventors: Wen-peng Gong, Xiao-ping Wu, Shih-hsiung Ho
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Publication number: 20110299237Abstract: The hard drive enclosure contains a casing member where a first rack at a first lateral side has a number of partition plates, each having a number of through holes allowing a rod to pass through. A number of covers laterally arranged in parallel on a front side of the hard drive enclosure, each capable of swiveling around a front axle and engages a rod. A number of levers are pivotally configured adjacent to a back side of the first rack, each engaged by a rod and having a pushing piece. When a cover is pulled outward, a rod is engaged to drive a lever whose pushing piece ejects the hard drive for additional distance.Type: ApplicationFiled: December 2, 2010Publication date: December 8, 2011Inventor: WEN-PENG LIANG
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Patent number: 8068731Abstract: A dynamic bandwidth allocation method of an Ethernet passive optical network, comprises a predictor and a rule of QoS-promoted dynamic bandwidth allocation (PQ-DBA); the predictor predicts a client behavior and numbers of various kinds of packets by using a pipeline scheduling predictor consisted of a pipelined recurrent neural network (PRNN), and a learning rule of the extended recursive least squares (ERLS); the present invention establishes a better QoS traffic management for the OLT-allocated ONU bandwidth and client packets sent by priority.Type: GrantFiled: April 7, 2009Date of Patent: November 29, 2011Assignee: Chunghwa Telecom Co., Ltd.Inventors: Jan-Wen Peng, Hsing-Yi Wu, Chung-Ju Chang
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Publication number: 20110287120Abstract: An injection mold for molding an insert element which includes a material belt with two belt holes formed therein and a plurality of terminals. Each terminal has a fastening portion with an inserting hole formed therein and a contact portion. The injection mold includes a male mold, a plurality of locating elements, a fastening element, a plurality of locating pieces and a female mold. The male mold has a cavity and a plurality of inserting grooves. Each locating element mounted to the male mold has a locating head extending beyond the male mold for inserting into the belt holes. The fastening element mounted to the cavity has a plurality of fastening grooves for respectively receiving the fastening portions. Each locating piece inserted into the inserting grooves has an inserting portion passing through the inserting hole and supporting the contact portion. The female mold is engaged with the male mold.Type: ApplicationFiled: May 24, 2010Publication date: November 24, 2011Inventors: WEN-PENG GONG, Xian-Yun Wang, Xiao-Ping Wu, Shih-Hsiung Ho
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Patent number: 8037157Abstract: An apparatus is provided for generating a Customized Uniform Resource Locator (CURL). The apparatus includes a request receiver, an information obtainer, and a CURL register. The request receiver is adapted to receive a request for assigning a CURL applied by a user to selected content in a network resource accessed through a normal URL. The information obtainer is adapted to obtain the normal URL, the CURL, and a set of description information of the selected content. The CURL register is adapted to obtain a browser context, an application context, and a system context related to the selected content, and is further adapted to store the browser context, the application context, and the system context which have been obtained with the normal URL, the CURL, and the set of description information of the selected content into a CURL repository as a whole.Type: GrantFiled: January 30, 2009Date of Patent: October 11, 2011Assignee: International Business Machines CorporationInventors: Wen Peng Xiao, Yang Min, Rong Yao Fu, Chang Yan Chi
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Publication number: 20110109336Abstract: In a positioning method and apparatus capable of preventing a solar battery panel from suffer damage during inspection, the method includes steps of providing a transport platen, a set of positioning device, a first probe row and a second probe row; transporting the solar battery panel to an inspecting region by the transport platen; moving the positioning devices to position the solar battery panel step by step; the first probe row pressing an electrode line on one surface of the solar battery panel; the second probe row pressing an electrode line on the other surface of the solar battery panel, thereby electrically connecting the first probe row and the second probe row. In this way, the solar battery panel can be inspected accurately without suffering damage.Type: ApplicationFiled: November 6, 2009Publication date: May 12, 2011Inventors: Yu-Hsing LIN, Jin-Po Tsa, Che-Min Lin, Po-Wen Peng
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Patent number: 7885073Abstract: A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.Type: GrantFiled: June 10, 2009Date of Patent: February 8, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Jun-Hai Li
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Patent number: 7884899Abstract: Systems for displaying images and methods for fabricating the same. A representative system includes a substrate having a display region and a peripheral region, and a mosaic color filter pattern formed in the peripheral region. The mosaic color filter pattern includes a plurality of separated pillars and a plurality of channels adjacent to the pillars. Specifically the volume ratio between the pillars and the channel is 1:5 to 2:1, preferably 1:3 to 1:1.Type: GrantFiled: February 2, 2007Date of Patent: February 8, 2011Assignee: TPO Displays Corp.Inventors: Yao-Pin Hsu, Chi-Wen Peng, Cheng-Hsin Chen, Jr-Hong Chen
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Patent number: 7874428Abstract: An air-packing device has an improved shock absorbing capability to protect a product in a container box. The air-packing device is comprised of first and second thermoplastic films where predetermined portions are bonded thereby creating a plurality of air containers, a plurality of heat-seal lands each sealing the first and second thermoplastic films in a small area of the air container thereby creating a plurality of series connected air cells for each air container, a plurality of check valves for corresponding air containers for allowing the compressed air to flow in a forward direction. The plurality of heat-seal lands at predetermined sides of the air-packing device create triangled areas of the air cells, and the air-packing device is folded at the heat-seal lands, thereby creating an inner space for packing a product therein.Type: GrantFiled: October 30, 2008Date of Patent: January 25, 2011Assignee: Air-Paq, Inc.Inventors: Akira Kojima, Wei-Wen Peng
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Publication number: 20100317229Abstract: A socket connector having a plurality of connectors, and at least one corresponding plug connector inserts into the socket connector. The socket connector includes a shielding housing having a plurality of sidewalls that define at least one receiving slot, and a body provided with the plurality of connectors and a plurality of conductive contacts assembled to each of the plurality of connectors. The plurality of connectors are different types of I/O connectors arranged in a side-by-side manner. The shielding housing encloses a plurality of walls of the body so that the plurality of connectors are located within the at least one receiving slot. The plug connector includes a plurality of contact receptacles, which correspond to the plurality of different types of connectors, which are arranged in a side-by-side manner.Type: ApplicationFiled: June 15, 2010Publication date: December 16, 2010Inventors: Cheng Wen Chen, Yi Wei Chang, Sheng Wen Peng
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Publication number: 20100271774Abstract: A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.Type: ApplicationFiled: June 10, 2009Publication date: October 28, 2010Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, JUN-HAI LI