Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.

Abstract: A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.

Abstract: A heat dissipation device includes a heat spreader (100), a fin assembly (300) located above the heat spreader and a heat pipe (400). The heat spreader has a bottom (110) for contacting a heat-generating component (500) and an upper surface (120) with a groove (122) defined therein. The fin assembly includes a plurality of horizontal fins stacked on each other. The heat pipe includes a first section (410) accommodated in the groove of the heat spreader, a pair of first legs (422) extending from opposite ends of the first section, respectively, and away from the heat spreader, and a second leg (424) bent from each of the first legs towards the heat spreader. The first and second legs pass through the horizontal fins and are fixed to and thermally connected with the horizontal fins.

Abstract: A heat dissipation device for dissipating heat generated by an electronic component mounted on an add-on card includes a first heat dissipation unit, a second heat dissipation unit, a third heat dissipation unit and a heat pipe. The heat pipe has an evaporating portion thermally connecting with the electronic component via the first dissipation unit, and two oppositely extending condensing portions extending through and thermally connecting with the second and third heat dissipation units. The second and third heat dissipation units are positioned at a common lengthwise side of the graphics card and separated from each other. The second and third heat dissipation units each have an L-shaped configuration. The heat pipe has two connection portions connecting the evaporating portion with the condensing portions, respectively. The connecting portions together with the evaporating portion form a U-shaped configuration.

Abstract: A structure comprises a high thermally conductive case with a receiver space for a power module, a thermally conductive part being provided on the case to contact a heating component of the power module in the power supply to induct the heat by the heating component to the case and contact the exterior air through the outside surface of case to dissipate the heat; and a housing the inner surface of which directly contact and cover the outside of high thermally conductive case, a grid-formed structure being formed at most of the region of housing to prevent the heat from scalding the person who touches or takes the power supply. With the large heat dissipation area, the heat is transferred through the external air to increase the efficiency of heat dissipation, and further all power parts may operate in a lower temperature to increase the work efficiency of power supply.

Abstract: A heat dissipation device (100) includes a vapor chamber (20), a heat sink (10) and a heat pipe (30). The heat sink (10) includes a plurality of fins (12). The heat pipe (30) includes an evaporating portion (32) sandwiched between the vapor chamber (20) and the fins (12) of the heat sink (10), and a condensing portion (34) extending through the fins (12). The vapor chamber (20) is attached to an electronic component (42) mounted on an add-on card (40). The fins (12) of the heat sink (10) directly contact with the vapor chamber (20) and define a recess (127) at a bottom thereof to receive the vapor chamber (20) therein.

Abstract: A heat dissipation device mounted on a heat-generating component of a graphics card, includes a base, a fin unit and a fan. The base is kept in intimate contact with the heat-generating component. The fin unit includes a plurality of fins arranged on the base and forming a plurality of air passages between each fin and its neighboring fins. The fan is mounted on the base, close to the fin unit and producing airflow in the air passages. The base comprises a spreader inlayed in the base. The spreader is a flattened heat pipe. A bottom surface of the spreader is in contact with the heat-generating component. The fin unit is thermally attached to a top surface of the spreader.

Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.

Abstract: An air-packing device has an improved shock absorbing capability to protect a product in a container box. The air-packing device is comprised of first and second thermoplastic films where predetermined portions are bonded thereby creating a plurality of air containers, a plurality of heat-seal lands each sealing the first and second thermoplastic films in a small area of the air container thereby creating a plurality of series connected air cells for each air container, a plurality of check valves for corresponding air containers for allowing the compressed air to flow in a forward direction. The plurality of heat-seal lands at predetermined sides of the air-packing device create triangled areas of the air cells, and the air-packing device is folded at the heat-seal lands, thereby creating an inner space for packing a product therein.

Abstract: A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure.

Abstract: A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.

Abstract: A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.

Abstract: A messaging system based group joint debugging system is provided, comprising a master computer and a slave computer in mutual communication with the master computer through network. With the group joint debugging system, multiple members of a geographical distributed development team can do jobs on a same debugging session. The master computer includes capabilities for obtaining a debugging request message containing a debugging command via the messaging system, extracting the debugging command and calling a corresponding debugging function of the program debugger according to the debugging command, and sending execution result of the called debugging function, as a debugging response message, to computers participating in a group joint debugging, such that the group joint debugging is carried out to the program to be debugged. The slave computer includes capabilities for receiving the debugging response message and carrying out automatic debugging on the program according to the debugging command.

Abstract: A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure.

Abstract: A bubble wrapping sheet has a simple structure and can easily inflate all of the air bubbles to wrap a product to be protected. The air bubbles can be constructed by tube partition seals that create air tubes and by bubble partition seals that divide the air tubes into a plurality of series connected air bubbles. The shape and size of the tube partition seals and bubble partition seals can be modified to change the shape of air bubbles and the density of the air bubbles on the bubble wrapping sheet. A check valve for the bubble wrapping sheet is provided to each air tube. The check valve may be configured by an air flow maze portion having a zig-zag air passage and a common air duct portion which provides the air to the air flow maze portion of a current air tube as well as to the air flow maze portion of a next air tube.

Abstract: An air-packing device has an improved shock absorbing capability to protect a product in a container box. The air-packing device is comprised of first and second thermoplastic films where predetermined portions are bonded thereby creating a plurality of air containers, a plurality of heat-seal lands each sealing the first and second thermoplastic films in a small area of the air container thereby creating a plurality of series connected air cells for each air container, a plurality of check valves for corresponding air containers for allowing the compressed air to flow in a forward direction. The plurality of heat-seal lands at predetermined sides of the air-packing device create triangled areas of the air cells, and the air-packing device is folded at the heat-seal lands, thereby creating an inner space for packing a product therein.

Abstract: A heat dissipation device is to be mounted in a computer enclosure for dissipating heat generated by a VGA card (10). The heat dissipation device includes a heat sink (90), a fan (60) and a fan duct (50) connecting the heat sink (90) and the fan (60). The heat sink (90) contacts a heat-generating device (12) of the VGA card. The fan (60) has an inlet port (62) and an outlet port (63). The outlet port (63) communicates with an ambient air outside the computer enclosure. The fan duct (50) has two open ends (55,52). One open end (55) engages with the heat sink (90) and the other open end (52) engages with the inlet port (62) of the fan (60).

Abstract: A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.

Abstract: A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate (200) having conductive traces (235) and pad landings (265). The conductive traces have pad landings (265). An IC (230) is mounted on the substrate (200). The IC (230) has bonding pads (245). With conductive wires (225), the IC bonding pads (245) are connected to the pad landings (265), which in turn, are connected to the conductive traces (235). A heat slug (220), having predetermined height, is disposed on the substrate surface (200). The heat slug includes a plurality of mounting feet (210) providing mechanical attachment to the substrate. A cavity (220a) in the heat slug accommodates the IC. A plurality of first-size openings (215) surrounds the IC. A second-size opening (255) constructed from one of the first size-openings, is larger than the first-size opening.