Abstract: A dynamic bandwidth allocation method of an Ethernet passive optical network, comprises a predictor and a rule of QoS-promoted dynamic bandwidth allocation (PQ-DBA); the predictor predicts a client behavior and numbers of various kinds of packets by using a pipeline scheduling predictor consisted of a pipelined recurrent neural network (PRNN), and a learning rule of the extended recursive least squares (ERLS); the present invention establishes a better QoS traffic management for the OLT-allocated ONU bandwidth and client packets sent by priority.

Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.

Abstract: A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.

Abstract: A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward each other. The first fin set defined a channel receiving the base therein. A plat extends from an end of the first face of the base. The second fin set is arranged on the plat of the base. The first face of the base has two grooves defined therein. A retaining member is attached to the first face of the base and has two retaining bars thereof fitted in the two grooves of the first face, respectively.

Abstract: A method, apparatus, and system for maintaining corresponding relationships between at least one chat transcript and related chat content in an instant messaging system may include establishing a chat session in the instant messaging system. Corresponding chat content may be displayed synchronously according to a changed address of the chat content. The changed address of the chat content may be inserted into a chat transcript, and the chat transcript may be segmented into at least two segments to create a segmented chat transcript. The segmented chat transcript and corresponding relationship between the changed address of the chat content and corresponding chat transcript segments may be stored.

Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.

Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Abstract: A power-saving device for power supply, including a transformer having a primary coil and a secondary coil. The primary coil is electrically connected with a power supply circuit of the power supply. The secondary coil is serially connected with a diode to electrically connect with a load via a load circuit. The power supply circuit controls powering on/off of the primary coil by means of a switch element. The load circuit includes a ?-type filter circuit, which is chargeable and dischargeable. A power indicator circuit is forward parallel connected between the secondary coil of the transformer and the load circuit. The power indicator circuit includes a light-emitting diode. One terminal of the light-emitting diode is connected with P-pole of the diode. The diode acts as a barrier to the discharge of the ?-type filter circuit so as to effectively reduce energy consumption of the power indicator circuit.

Abstract: A testing method of baseboard management controller (BMC) is used for testing firmware stability of a BMC in a server. The testing method includes initializing a plurality of virtual operating systems; setting a plurality of virtual intelligent platform management interfaces (IPMIs) and a virtual BMC in the virtual operating systems; performing a firmware update on the virtual BMC through the virtual IPMI to update the firmware of the virtual BMC; performing a stability test through the virtual BMC and the server; and loading the firmware of the virtual BMC passing the stability test into a physical BMC.

Abstract: A method and apparatus for loading classes to virtual machines and a method and apparatus for reorganizing class archives. The method for loading a class to a virtual machine includes organizing a class archive before class loading such that the organized class archive includes a class contraction portion and loading only the class contraction portion of the class archive to the virtual machine at the moment of class loading. By first loading the class contraction portion from the organized class archive to the virtual machine at the moment of loading, the present invention curtails code redundancy, shortens loading time and reduces occupied memory resources.

Abstract: An apparatus is provided for generating a Customized Uniform Resource Locator (CURL). The apparatus includes a request receiver, an information obtainer, and a CURL register. The request receiver is adapted to receive a request for assigning a CURL applied by a user to selected content in a network resource accessed through a normal URL. The information obtainer is adapted to obtain the normal URL, the CURL, and a set of description information of the selected content. The CURL register is adapted to obtain a browser context, an application context, and a system context related to the selected content, and is further adapted to store the browser context, the application context, and the system context which have been obtained with the normal URL, the CURL, and the set of description information of the selected content into a CURL repository as a whole.

Abstract: A power plug adapter structure including: a power plug having a mating face and a set of first conductive members disposed on the mating face, two lateral recesses being respectively formed on two lateral faces of the power plug, a locating dent being formed on a wall of at least one lateral recess; and a plug adapter having second conductive members and insertion slots extending to the second conductive member corresponding to the first conductive members. The plug adapter further has two lateral extension sections disposed on two sides of the plug adapter in parallel to the insertion slots corresponding to the lateral recesses. A locating rib is formed on at least one lateral extension section corresponding to the locating dent. When plug adapter is combined with the power plug, the lateral extension sections extend into the lateral recesses with the locating rib inlaid and chucked in the locating dent.

Abstract: A jet assembly has internals rotatably and releaseably fit to a jet body, such as that for a spa. The internals have a barrel housing, a rotor and a barrel inlet. The internals as screwed into the jet body. A first threaded portion outside the barrel threadably engages second threaded portion inside the jet body wherein the internals have delimited rotation therein to align and misalign the barrel inlet from a body inlet on the jet body to control flow on and off respectively. The threaded portion within the jet body can be a locking ring affixed therein by fasteners or integral with the jet body. Rotation can be delimited by a projection on the barrel and a cooperating annular delimiting surface on the locking ring, such as circumferentially-spaced detents.

Abstract: An air-packing device has an improved shock absorbing capability to protect a product in a container box. The air-packing device is comprised of first and second thermoplastic films where predetermined portions are bonded thereby creating a plurality of air containers, a plurality of heat-seal lands each sealing the first and second thermoplastic films in a small area of the air container thereby creating a plurality of series connected air cells for each air container, a plurality of check valves for corresponding air containers for allowing the compressed air to flow in a forward direction, and at least one pocket formed of a sheet of thermoplastic film bonded to either the first thermoplastic film or the second thermoplatic film at boundaries between two adjacent air containers. The air-packing device is folded after the product is inserted in the pocket and installed in a container box.