Patents by Inventor Wen-Shan Wang

Wen-Shan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10382232
    Abstract: A memory controller adjusts impedance matching of an output terminal and outputs a control signal that controls a memory through the output terminal. The memory controller includes a first driving and impedance matching circuit, a second driving and impedance matching circuit, and a logic circuit. The logic circuit, which is coupled to the first driving and impedance matching circuit and the second driving and impedance matching circuit, sets a first impedance and a first driving capability of the first driving and impedance matching circuit, sets a second impedance and a second driving capability of the second driving and impedance matching circuit, and enables the first driving and impedance matching circuit to cause the control signal to have a first level or enables the second driving and impedance matching circuit to cause the control signal to have a second level different from the first level.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: August 13, 2019
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Shih-Hung Wang, Shen-Kuo Huang, Gerchih Chou, Wen-Shan Wang
  • Patent number: 10373962
    Abstract: A semiconductor device includes: active regions arranged in a first grid oriented parallel to a first direction; and gate electrodes arranged spaced apart in a second grid and overlying corresponding ones of the active regions, the second grid being oriented parallel to a second direction, the second direction being orthogonal to the first direction. The first gaps are interspersed between neighboring ones of the active regions. For a flyover intersection at which a corresponding gate electrode crosses over a corresponding active region and for which the gate electrode is not functionally connected to the corresponding active region, the gate electrode does not extend substantially beyond the corresponding active region and so does not extend substantially into the corresponding gap.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 6, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jen Chen, Wen-Hsi Lee, Ling-Sung Wang, I-Shan Huang, Chan-yu Hung
  • Patent number: 10374643
    Abstract: A transmitter with compensating mechanism of pulling effect includes an output unit and a correction unit. The output unit mixes a first correction signal and a second correction signal according to an oscillating signal to generate a modulated signal, and to amplify the modulated signal to generate a first output signal. The correction unit analyzes the power of the first output signal to generate a first coefficient and a second coefficient, and generate the first correction signal and the second correction signal according to the first coefficient, the second coefficient, an in-phase data signal, and a quadrature data signal.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: August 6, 2019
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Wen-Shan Wang, Yuan-Shuo Chang, Chih-Chieh Wang
  • Patent number: 10310660
    Abstract: A hover controlling device includes a sensing unit and a hover control unit. The sensing unit includes a plurality of first electrostatic sensing elements, a plurality of first electrodes, a plurality of second electrostatic sensing elements, and a plurality of third electrodes located on a substrate. Each first electrostatic sensing element and each second electrostatic sensing element include a single walled carbon nanotube or a few-walled carbon nanotube. The resistances of the plurality of first electrostatic sensing elements and the plurality of second electrostatic sensing elements are changed in process of a sensed object with electrostatic near, but does not touch the plurality of first electrostatic sensing elements and the plurality of second electrostatic sensing elements. The hover control unit is electrically connected to the plurality of first electrostatic sensing elements and the plurality of second electrostatic sensing elements.
    Type: Grant
    Filed: December 27, 2015
    Date of Patent: June 4, 2019
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin-He Wang, Dong-Qi Li, Jiang-Tao Wang, Wen-Yun Wu, Yu-Jun He, Peng Liu, Qing-Yu Zhao, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 10312118
    Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: June 4, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Shan Wu, Yi-Ting Hu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang, Pin-Yi Shin, Wen-Ming Chen, Wei-Chih Chen, Chih-Yuan Chiu
  • Patent number: 10310661
    Abstract: A hover controlling device includes a sensing unit and a hover control unit. The sensing unit includes a plurality of first electrostatic sensing elements, a plurality of first electrodes, a plurality of second electrostatic sensing elements, and a plurality of third electrodes located on a substrate. Each first electrostatic sensing element and each second electrostatic sensing element include a single walled carbon nanotube or a few-walled carbon nanotube. The resistances of the plurality of first electrostatic sensing elements and the plurality of second electrostatic sensing elements are changed in process of a sensed object with electrostatic near, but does not touch the plurality of first electrostatic sensing elements and the plurality of second electrostatic sensing elements. The hover control unit is electrically connected to the plurality of first electrostatic sensing elements and the plurality of second electrostatic sensing elements.
    Type: Grant
    Filed: December 27, 2015
    Date of Patent: June 4, 2019
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin-He Wang, Dong-Qi Li, Jiang-Tao Wang, Wen-Yun Wu, Yu-Jun He, Peng Liu, Qing-Yu Zhao, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 10305523
    Abstract: A transmitting device, for handling signal interference, comprises a first transmitting circuit, for processing a first plurality of baseband signals, to generate a first plurality of radio frequency signals; a second transmitting circuit, for processing a second plurality of baseband signals and a plurality of input signals, to generate a second plurality of radio frequency signals; a feedback circuit, coupled to the second transmitting circuit, for processing the second plurality of radio frequency signals and a plurality of leakage signals, to generate a plurality of error signals; and a control circuit, coupled to the first transmitting circuit, the second transmitting circuit and the feedback circuit, for generating the plurality of input signals according to the first plurality of baseband signals and the plurality of error signals.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: May 28, 2019
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chin-Liang Wang, Min-Chau Jan, Wen-Shan Wang, Yuan-Shuo Chang, Wu-Chi Wang, Ying-Hsi Lin
  • Patent number: 10296129
    Abstract: A touch and hover sensing device includes a hover sensing module is located on a first surface of a substrate, the hover sensing module includes a plurality of first electrostatic sensing elements and a plurality of second electrostatic sensing elements electrically insulated from each other. Each of the plurality of first electrostatic sensing elements and each of the plurality of second electrostatic sensing elements include a single walled carbon nanotube or few-walled carbon nanotube. A touch sensing module is located on a second surface of the substrate. The hover sensing module and the touch sensing module are connected to a control chip, the control chip controls the hover sensing module and the touch sensing module simultaneously working or working separately, to sense a position coordinate of the sensed object.
    Type: Grant
    Filed: December 27, 2015
    Date of Patent: May 21, 2019
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin-He Wang, Dong-Qi Li, Jiang-Tao Wang, Wen-Yun Wu, Yu-Jun He, Peng Liu, Qing-Yu Zhao, Kai-Li Jiang, Shou-Shan Fan
  • Publication number: 20190140867
    Abstract: A memory controller adjusts impedance matching of an output terminal and outputs a control signal that controls a memory through the output terminal. The memory controller includes a first driving and impedance matching circuit, a second driving and impedance matching circuit, and a logic circuit. The logic circuit, which is coupled to the first driving and impedance matching circuit and the second driving and impedance matching circuit, sets a first impedance and a first driving capability of the first driving and impedance matching circuit, sets a second impedance and a second driving capability of the second driving and impedance matching circuit, and enables the first driving and impedance matching circuit to cause the control signal to have a first level or enables the second driving and impedance matching circuit to cause the control signal to have a second level different from the first level.
    Type: Application
    Filed: May 10, 2018
    Publication date: May 9, 2019
    Inventors: SHIH-HUNG WANG, SHEN-KUO HUANG, GERCHIH CHOU, WEN-SHAN WANG
  • Publication number: 20190096444
    Abstract: A circuit for a memory system including a plurality of memories, including: a plurality of connection traces coupled in series, each connection trace having a first end, and a second end coupled to a terminal of a memory of the plurality of memories; wherein an equivalent impedance of a first connection trace of the plurality of connection traces is different with the equivalent impedance of the second connection trace of the plurality of connection traces, the first connection trace being coupled to the second connection trace in series.
    Type: Application
    Filed: September 25, 2017
    Publication date: March 28, 2019
    Inventors: Chih-Chia Chiu, Ruey-Beei Wu, Ting-Ying Wu, Wen-Shan Wang, GERCHIH CHOU
  • Publication number: 20190074855
    Abstract: A transmitting device, for handling signal interference, comprises a first transmitting circuit, for processing a first plurality of baseband signals, to generate a first plurality of radio frequency signals; a second transmitting circuit, for processing a second plurality of baseband signals and a plurality of input signals, to generate a second plurality of radio frequency signals; a feedback circuit, coupled to the second transmitting circuit, for processing the second plurality of radio frequency signals and a plurality of leakage signals, to generate a plurality of error signals; and a control circuit, coupled to the first transmitting circuit, the second transmitting circuit and the feedback circuit, for generating the plurality of input signals according to the first plurality of baseband signals and the plurality of error signals.
    Type: Application
    Filed: September 3, 2018
    Publication date: March 7, 2019
    Inventors: Chin-Liang Wang, Min-Chau Jan, Wen-Shan Wang, Yuan-Shuo Chang, Wu-Chi Wang, Ying-Hsi Lin
  • Patent number: 10211931
    Abstract: A method of interference cancellation includes the following steps: performing a take-energy operation on a to-be-sent signal at multiple times to generate multiple to-be-sent signal powers; performing a first high-pass operation on the to-be-sent signal powers to generate a to-be-sent high-pass result; performing a second high-pass operation on a received signal to generate a received high-pass result; adjusting multiple filter coefficients according to the to-be-sent high-pass result and the received high-pass result; and generating a recover signal according to the filter coefficients.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: February 19, 2019
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chin-Liang Wang, Kuan-Kai Chen, Min-Chau Jan, Wen-Shan Wang, Yuan-Shuo Chang, Ying-Hsi Lin
  • Patent number: 9955586
    Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 24, 2018
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Ting-Ying Wu, Cheng-Lin Wu, Chin-Yuan Lo, Wen-Shan Wang
  • Patent number: 9948280
    Abstract: Disclosed is a two-capacitor-based filter design method comprising: determining a frequency f1 and a fractional bandwidth ratio FBW; selecting a first and a second capacitors according to f1 and FBW, in which a resonant frequency fC1 of the first capacitor is equal to f1×(1?N×FBW), a resonant frequency fC2 of the second capacitor is equal to f1×(1+M×FBW), and each of N and M is a positive number less than one; and determining a length of a first transmission line according to fC1 and a signal speed, and determining a length of a second transmission line according to fC2 and the signal speed. The first capacitor is coupled between a center of the first transmission line and ground, the second capacitor is coupled between a center of the second transmission line and ground, and the first and second transmission lines are connected in series.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: April 17, 2018
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Po-Chun Chen, Ruey-Beei Wu, Ting-Ying Wu, Wen-Shan Wang, Gerchih Chou
  • Publication number: 20170194990
    Abstract: A transmitter with compensating mechanism of pulling effect includes an output unit and a correction unit. The output unit mixes a first correction signal and a second correction signal according to an oscillating signal to generate a modulated signal, and to amplify the modulated signal to generate a first output signal. The correction unit analyzes the power of the first output signal to generate a first coefficient and a second coefficient, and generate the first correction signal and the second correction signal according to the first coefficient, the second coefficient, an in-phase data signal, and a quadrature data signal.
    Type: Application
    Filed: December 26, 2016
    Publication date: July 6, 2017
    Inventors: Wen-Shan WANG, Yuan-Shuo CHANG, Chih-Chieh WANG
  • Patent number: 9269674
    Abstract: The present invention discloses an integrated circuit having electromagnetic shielding capability and the manufacturing method thereof. An embodiment of the said integrated circuit comprises: a semiconductor circuit structure including a first surface which covers an electromagnetic radiation area; an electromagnetic shielding layer covering the first surface and including at least one contact; and at least one conducting path operable to electrically connect the at least one contact with a steady voltage and thereby shield off the electromagnetic wave from the electromagnetic radiation area, wherein the current running through the electromagnetic shielding layer is zero or less than the maximum current running through the electromagnetic radiation area.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: February 23, 2016
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chao-Cheng Lee, Wen-Shan Wang
  • Publication number: 20160021745
    Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.
    Type: Application
    Filed: July 16, 2015
    Publication date: January 21, 2016
    Inventors: TING-YING WU, CHENG-LIN WU, CHIN-YUAN LO, WEN-SHAN WANG
  • Publication number: 20150364429
    Abstract: The present invention discloses an integrated circuit having electromagnetic shielding capability and the manufacturing method thereof. An embodiment of the said integrated circuit comprises: a semiconductor circuit structure including a first surface which covers an electromagnetic radiation area; an electromagnetic shielding layer covering the first surface and including at least one contact; and at least one conducting path operable to electrically connect the at least one contact with a steady voltage and thereby shield off the electromagnetic wave from the electromagnetic radiation area, wherein the current running through the electromagnetic shielding layer is zero or less than the maximum current running through the electromagnetic radiation area.
    Type: Application
    Filed: June 2, 2015
    Publication date: December 17, 2015
    Inventors: CHAO-CHENG LEE, WEN-SHAN WANG
  • Patent number: 9025658
    Abstract: An embodiment includes a method that includes receiving a number of pixels of video data. The method also includes commencing a first arithmetic operation of a matrix of the number of pixels with a transpose of a constant matrix prior to a first element of the second row being received.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: May 5, 2015
    Assignee: Intel Corporation
    Inventors: Wen-Shan Wang, Hyung-Suk Kim
  • Patent number: 8989279
    Abstract: Encoding or decoding digital video frames in intra-prediction mode by selecting column reference data locations for blocks adjacent a current block from a column reference data buffer storing column reference data samples for no more than two macro blocks of the frame. In some cases, the column reference data buffer may include a storage size for samples of a first column of data of blocks of one macro block of luminance samples. Encoding and decoding may also include selecting row reference data locations for blocks adjacent a current block from a row reference data buffer storing row reference data samples for at least one row of macro blocks of the frame. In some cases, the row reference data buffer may include storage for samples of a first row of data of fourteen successive blocks spanning two rows. The concept can be applied to various video processing components and standards.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: March 24, 2015
    Assignee: Intel Corporation
    Inventor: Wen-Shan Wang