Abstract: The present invention provides novel substituted benzimidazole derivatives used as DAAO inhibitors and for treatment and/or prevention of neurological disorders.

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.

Abstract: A laser welding mechanism includes a main body having a space and two securing devices which are respectively attached to two ends of the body. A linkage assembly includes a bearing and a linkage tube. A refraction mirror unit includes two mirrors connected to the linkage tube of the linkage assembly. A laser unit is pivotally connected to a swinging member which is connected to the linkage tube of the linkage assembly. A drive unit including a motor, a driving gear, and a driven gear. A rotation unit is connected to the swinging member of the laser unit. The laser unit rotates relative to the first workpiece and the second workpiece during welding, ensuring a stable rotation at the joining faces of the two workpieces.

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

Abstract: A database system includes an interface and a processor. The interface is configured to receive a transaction request comprising one or more transaction blocks in an order. The processor is configured to evaluate each transaction block of the one or more transaction blocks in the order by: determining in the order whether a condition expression of a transaction block of the one or more transaction blocks is true; and in response to the condition expression of the transaction block being true, adding in the order one or more associated action sets of the transaction block to a transaction context; and in response to each of the transaction blocks being evaluated, cause the transaction context to be executed as an atomic transaction.

Abstract: A semiconductor package includes a first die structure, a first redistribution structure that is disposed on the first die structure, a second die structure that is disposed on the first redistribution structure, and a second redistribution structure that is disposed on the second die structure. The first die structure includes an interposer, and the interposer includes a semiconductor substrate and through-vias that penetrate through the semiconductor substrate. A first integrated circuit die is disposed in the semiconductor substrate of the interposer. The second die structure includes a second integrated circuit die that is encapsulated in an encapsulant and several conductive pillars that penetrate through the encapsulant. The first integrated circuit die is electrically connected to the second integrated circuit die through the first redistribution structure, the conductive pillars, and the second redistribution structure.

Abstract: The present invention provides novel substituted benzimidazole derivatives used as DAAO inhibitors and for treatment and/or prevention of neurological disorders.

Abstract: A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a bridge structure, and a plurality of conductive bumps. The first semiconductor die and the second semiconductor die are disposed over the first redistribution layer. The bridge structure is disposed under the first redistribution layer. The first semiconductor die is electrically coupled to the second semiconductor die through the first redistribution layer and the bridge structure. The conductive bumps are disposed under the first redistribution layer and are coupled to the first redistribution layer. The bridge structure is disposed between at least two of the conductive bumps.

Abstract: A database system includes an interface and a processor. The interface is configured to receive a transaction request comprising one or more transaction blocks in an order. The processor is configured to evaluate each transaction block of the one or more transaction blocks in the order by: determining in the order whether a condition expression of a transaction block of the one or more transaction blocks is true; and in response to the condition expression of the transaction block being true, adding in the order one or more associated action sets of the transaction block to a transaction context; and in response to each of the transaction blocks being evaluated, cause the transaction context to be executed as an atomic transaction.

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

Abstract: A bump structure includes a conductive pad on a semiconductor die; a passivation layer covering a perimeter of the conductive pad; and a first polymer layer on the passivation layer. The first polymer layer includes a via opening partially exposing the central portion of the conductive pad. A RDL is disposed on the first polymer layer and patterned into a bump pad situated directly above the conductive pad. The via opening is completely filled with the RDL and a RDL via is integrally formed with the bump pad. A second polymer layer is disposed on the first polymer layer. An island of the second polymer layer is disposed at a central portion of the bump pad. UBM layer is disposed on the bump pad. The UBM layer covers the island and forms a bulge thereon. A bump is disposed on the UBM layer.

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

Abstract: A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

Abstract: The present invention discloses a smart clothing and its device mount, wherein the device mount includes an upper casing and a lower casing, a circuit board is arranged between the upper casing and the lower casing, and a metal contact of the top surface of the circuit board penetrates through the upper casing to form a plurality of metal contact points, and the cable interface of the bottom surface of the circuit board passes through the lower casing, and the bottom surface of the lower casing is formed with individual cable grooves toward each cable interface for guiding the transmission wire to insert into the cable interface along the cable groove, and the device mount is combined with a soft gasket on the clothing body and is equipped with a waterproof protective layer to avoid damage to the circuit components and transmission wire during cleaning; when the device mount is installed with the electronic device, the motion status can be monitored.

Abstract: A semiconductor package structure includes a substrate, a bridge structure, a redistribution layer, a first semiconductor component, and a second semiconductor component. The substrate has a wiring structure. The bridge structure is over the substrate. The redistribution layer is over the bridge structure. The first semiconductor component and the second semiconductor component are over the redistribution layer, wherein the first semiconductor component is electrically coupled to the second semiconductor component through the redistribution layer and the bridge structure.

Abstract: An oral pharmaceutical composition includes a metal complex and an outer layer. The metal complex is formed by coordinate bonding of an organic compound to a metal ion, and the organic compound is an aromatic compound and includes at least two oxygen atoms. The outer layer includes a ?-glucan, and the ?-glucan is dispersed outside the metal complex and coordinately bonded to the metal complex to form the outer layer.

Abstract: A database system includes an interface and a processor. The interface is configured to receive a transaction request comprising one or more transaction blocks in an order. The processor is configured to evaluate each transaction block of the one or more transaction blocks in the order by: determining in the order whether a condition expression of a transaction block of the one or more transaction blocks is true; and in response to the condition expression of the transaction block being true, adding in the order one or more associated action sets of the transaction block to a transaction context; and in response to each of the transaction blocks being evaluated, cause the transaction context to be executed as an atomic transaction.

Abstract: Ultrasound imaging is a non-invasive, non-radioactive, and low cost technology for diagnosis and identification of implantable medical devices in real time. Developing new ultrasound activated coatings is important to broaden the utility of in vivo marking by ultrasound imaging. Ultrasound responsive macro-phase segregated micro-composite thin films were developed to be coated on medical devices composed of multiple materials and with multiple shapes and varying surface area. The macro-phase segregated films having silica micro-shells in polycyanoacrylate produces strong color Doppler signals with the use of a standard clinical ultrasound transducer. Electron microscopy showed a macro-phase separation during slow curing of the cyanoacrylate adhesive, as air-filled silica micro-shells were driven to the surface of the film. The air sealed in the hollow space of the silica shells acted as an ultrasound contrast agent and echo decorrelation of air exposed to ultrasound waves produces color Doppler signals.

Abstract: A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor component, a conductive pillar, and a second semiconductor component. The redistribution layer is over the substrate. The first semiconductor component is over the redistribution layer. The conductive pillar is adjacent to the first semiconductor component, wherein the first semiconductor component and the conductive pillar are surrounded by a molding material. The second semiconductor component is over the molding material, wherein the second semiconductor component is electrically coupled to the redistribution layer through the conductive pillar.

Abstract: A semiconductor package structure includes a substrate, a dummy conductive mesh structure, an interposer, an underfill material, and a semiconductor die. The substrate includes a wiring structure in dielectric layers. The dummy conductive mesh structure is embedded in the substrate and is spaced apart from the wiring structure by the dielectric layers. The interposer is disposed over the substrate. The underfill material extends between the substrate and the interposer and over the dummy conductive mesh structure. The semiconductor die is disposed over the interposer and is electrically coupled to the wiring structure through the interposer.