Patents by Inventor Wen Sung

Wen Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11742564
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: August 29, 2023
    Assignee: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
  • Publication number: 20230260866
    Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.
    Type: Application
    Filed: January 20, 2023
    Publication date: August 17, 2023
    Inventors: Yin-Fa CHEN, Bo-Jiun YANG, Ta-Jen YU, Bo-Hao MA, Chih-Wei CHANG, Tsung-Yu PAN, Tai-Yu CHEN, Shih-Chin LIN, Wen-Sung HSU
  • Patent number: 11698178
    Abstract: An illuminating device and a method for optimizing the light pattern are provided. The illuminating device includes a lamp case having a lighting space; a light-reflecting cup, located in the lighting space and including a light incident side, a light emergent side; a light source, located in the lighting space and corresponding to the light incident side of the light reflecting cup; and a cylindrical lens, located in the lighting space and corresponds to the light emergent side of the light reflecting cup; wherein one surface of the cylindrical lens has a plurality of convex columns extending up and down, and each convex column faces to the light emergent side; wherein, when the light source emits light, the main bright area of the light pattern reflected by the light emergent side of the light reflecting cup is wide at the top and narrow at the bottom.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: July 11, 2023
    Inventor: Wen-Sung Lee
  • Patent number: 11670596
    Abstract: A semiconductor package structure includes a substrate, a first redistribution layer, a second redistribution layer, a bridge structure, a first semiconductor component, and a second semiconductor component. The first redistribution layer is over the substrate. The second redistribution layer is over the first redistribution layer. The bridge structure is between the first redistribution layer and the second redistribution layer, wherein the bridge structure includes an active device. The first semiconductor component and the second semiconductor component are located over the second redistribution layer, wherein the first semiconductor component is electrically coupled to the second semiconductor component through the second redistribution layer and the bridge structure.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: June 6, 2023
    Assignee: MEDIATEK INC.
    Inventors: Yi-Lin Tsai, Wen-Sung Hsu, I-Hsuan Peng, Yi-Jou Lin
  • Publication number: 20230157956
    Abstract: A method for fabricating an oral drug delivery system includes steps as follows. A mixture is provided, which includes an organic ligand, a metal ion, a biological macromolecule and water. A coating step is performed for forming a biomimetic mineralized carrier encapsulated the biological macromolecule having a surface with the positive charge. A first solution including the biomimetic mineralized carrier is provided. A second solution including a yeast capsule is provided, wherein the yeast capsule has a surface with the negative charge. A loading step is performing, wherein the first solution is mixed with the second solution and then shaken for a shaking time, and the biomimetic mineralized carrier is loaded into the yeast capsule by an electrostatic force to form the oral drug delivery system.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 25, 2023
    Inventors: Hsing-Wen SUNG, Yang-Bao MIAO, Kuan-Hung CHEN
  • Patent number: 11652273
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: May 16, 2023
    Assignee: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
  • Patent number: 11611334
    Abstract: A duty margin monitoring circuit, coupled to a functional circuit which generates a first output signal in response to a target signal, includes a modulation circuit, a replica circuit and an error detection circuit. The modulation circuit is arranged to receive the target signal and modulate the target signal to generate a modulated target signal. The replica circuit is arranged to receive the modulated target signal and generate a second output signal in response to the modulated target signal. The error detection circuit is coupled to the functional circuit and the replica circuit to receive the first output signal and the second output signal and arranged to generate an error detection result according to the first output signal and the second output signal.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: March 21, 2023
    Assignee: MEDIATEK INC.
    Inventors: Shou-En Liu, Wen-Sung Chiang, Ming-Han Hsieh, Keng-Jui Chang, Lin-Chien Chen
  • Patent number: 11612038
    Abstract: A boost voltage driving device is provided, in which the boost voltage driving device is electrically connected to a light emitting device, and drives the light emitting device. The boost voltage driving device includes: an electric power supply module, a microcontroller, a boost voltage module, a first feedback circuit and a second feedback circuit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: March 21, 2023
    Inventor: Wen-Sung Lee
  • Publication number: 20230073399
    Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 9, 2023
    Applicant: MediaTek Inc.
    Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin
  • Patent number: 11601156
    Abstract: Disclosed herein are devices and methods to reduce unwanted CIM3 emission in a wireless communication device, such that the transmit (TX) power level applied in a RU can be increased without exceeding a regulatory emission requirement. In some aspects, unwanted emission may be reduced by shifting or changing local oscillator (LO) frequencies during TX operation. Some embodiments are directed to a fast-locking PLL with adjustable bandwidth that can be controlled to increase the PLL bandwidth during the RX to TX transition to provide a fast locking to a new LO frequency. Some aspects are directed to configuring an LO frequency shift amount for different RUs when multiple RUs are allocated within a frequency band.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 7, 2023
    Assignee: MediaTek Inc.
    Inventors: Yu-Hsien Chang, Po-Chun Huang, Pi-An Wu, Wen-Hsien Chiu, Tzu-Wen Sung
  • Publication number: 20230046413
    Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.
    Type: Application
    Filed: July 15, 2022
    Publication date: February 16, 2023
    Inventors: Tai-Yu CHEN, Chin-Lai CHEN, Hsiao-Yun CHEN, Wen-Sung HSU, Haw-Kuen SU, Duen-Yi HO, Bo-Jiun YANG, Ta-Jen YU, Bo-Hao MA
  • Patent number: 11574881
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: February 7, 2023
    Assignee: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
  • Publication number: 20230005808
    Abstract: A semiconductor chip package includes a substrate having a top surface and a bottom surface, and a semiconductor device mounted on the top surface of the substrate. A gap is provided between the semiconductor device and the top surface of the substrate. A multi-layer laminate epoxy sheet is disposed on the top surface of the substrate and around a perimeter of the semiconductor device.
    Type: Application
    Filed: September 1, 2022
    Publication date: January 5, 2023
    Applicant: MEDIATEK INC.
    Inventors: Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng, Wen-Sung Hsu
  • Publication number: 20220392839
    Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.
    Type: Application
    Filed: August 12, 2022
    Publication date: December 8, 2022
    Applicant: MediaTek Inc.
    Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu
  • Publication number: 20220352084
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Application
    Filed: May 19, 2022
    Publication date: November 3, 2022
    Applicant: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu, Chih-Ming Hung, Wei-Hsiu Hsu
  • Publication number: 20220328378
    Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.
    Type: Application
    Filed: March 22, 2022
    Publication date: October 13, 2022
    Inventors: Bo-Jiun YANG, Wen-Sung HSU, Tai-Yu CHEN, Sheng-Liang KUO, Chia-Hao HSU
  • Patent number: 11469201
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 11, 2022
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
  • Patent number: 11469152
    Abstract: A semiconductor chip package includes a substrate having a top surface and a bottom surface, and a semiconductor device mounted on the top surface of the substrate. A gap is provided between the semiconductor device and the top surface of the substrate. A pre-cut laminate epoxy sheet is disposed on the top surface of the substrate and around a perimeter of the semiconductor device.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: October 11, 2022
    Assignee: MEDIATEK INC.
    Inventors: Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng, Wen-Sung Hsu
  • Patent number: RE49340
    Abstract: The invention utilizes virtual screening strategy to seek for current market drugs as anti-schizophrenia therapy drug repurposing. Drug repurposing strategy finds new uses other than the original medical indications of existing drugs. Finding new indications for such drugs will benefit patients who are in needs for a potential new therapy sooner since known drugs are usually with acceptable safety and pharmacokinetic profiles. In this study, repurposing marketed drugs for DAAO inhibitor as new schizophrenia therapy was performed with virtual screening on marketed drugs and its metabolites. The identified and available drugs and compounds were further confirmed with in vitro DAAO enzymatic inhibitory assay.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: December 20, 2022
    Assignees: National Taiwan University, National Yang Ming Chiao Tung University, National Health Research Institutes
    Inventors: Yufeng Jane Tseng, Yu-Li Liu, Chung-Ming Sun, Hai-Gwo Hwu, Chih-Min Liu, Wen-Sung Lai
  • Patent number: D987138
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: May 23, 2023
    Inventor: Wen-Sung Lee